Hsien‐Chie Cheng

2.1k total citations
122 papers, 1.7k citations indexed

About

Hsien‐Chie Cheng is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Hsien‐Chie Cheng has authored 122 papers receiving a total of 1.7k indexed citations (citations by other indexed papers that have themselves been cited), including 77 papers in Electrical and Electronic Engineering, 34 papers in Mechanical Engineering and 33 papers in Mechanics of Materials. Recurrent topics in Hsien‐Chie Cheng's work include Electronic Packaging and Soldering Technologies (59 papers), 3D IC and TSV technologies (38 papers) and Boron and Carbon Nanomaterials Research (17 papers). Hsien‐Chie Cheng is often cited by papers focused on Electronic Packaging and Soldering Technologies (59 papers), 3D IC and TSV technologies (38 papers) and Boron and Carbon Nanomaterials Research (17 papers). Hsien‐Chie Cheng collaborates with scholars based in Taiwan, United States and Belgium. Hsien‐Chie Cheng's co-authors include Wen‐Hwa Chen, Kuo‐Ning Chiang, Su‐Tsai Lu, Noboru Kikuchi, Yu‐Chen Hsu, Chun‐Hung Wu, Po-Wen Hwang, Cheng Peng, Kun-Nan Chen and Jiayun Lin and has published in prestigious journals such as Journal of Computational Physics, Computer Methods in Applied Mechanics and Engineering and Journal of Materials Science.

In The Last Decade

Hsien‐Chie Cheng

115 papers receiving 1.6k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Hsien‐Chie Cheng Taiwan 24 934 498 479 321 185 122 1.7k
Wen‐Hwa Chen Taiwan 22 676 0.7× 531 1.1× 586 1.2× 750 2.3× 212 1.1× 135 1.9k
F.P. Dawson Canada 23 1.3k 1.4× 421 0.8× 374 0.8× 133 0.4× 302 1.6× 188 2.1k
Zhongping Zhang China 15 577 0.6× 308 0.6× 299 0.6× 228 0.7× 89 0.5× 91 1.1k
Jae‐Woo Jung South Korea 19 982 1.1× 303 0.6× 204 0.4× 253 0.8× 169 0.9× 73 1.9k
Dapeng Chen China 17 582 0.6× 152 0.3× 191 0.4× 355 1.1× 257 1.4× 110 1.2k
Ganesh Subbarayan United States 22 906 1.0× 627 1.3× 349 0.7× 610 1.9× 119 0.6× 192 1.8k
Fuchang Lin China 24 1.1k 1.2× 302 0.6× 769 1.6× 222 0.7× 491 2.7× 203 1.9k
Lihong Yang China 24 399 0.4× 415 0.8× 751 1.6× 381 1.2× 197 1.1× 149 1.8k
Masato Tanaka Japan 19 415 0.4× 294 0.6× 209 0.4× 269 0.8× 387 2.1× 172 1.5k
Yan Cui China 21 569 0.6× 504 1.0× 411 0.9× 199 0.6× 259 1.4× 86 1.5k

Countries citing papers authored by Hsien‐Chie Cheng

Since Specialization
Citations

This map shows the geographic impact of Hsien‐Chie Cheng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hsien‐Chie Cheng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hsien‐Chie Cheng more than expected).

Fields of papers citing papers by Hsien‐Chie Cheng

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hsien‐Chie Cheng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hsien‐Chie Cheng. The network helps show where Hsien‐Chie Cheng may publish in the future.

Co-authorship network of co-authors of Hsien‐Chie Cheng

This figure shows the co-authorship network connecting the top 25 collaborators of Hsien‐Chie Cheng. A scholar is included among the top collaborators of Hsien‐Chie Cheng based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hsien‐Chie Cheng. Hsien‐Chie Cheng is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Cheng, Hsien‐Chie, et al.. (2025). Dynamic Performance Evaluation of Bidirectional Bridgeless Interleaved Totem-Pole Power Factor Correction Boost Converter. Micromachines. 16(2). 223–223. 1 indexed citations
2.
Cheng, Hsien‐Chie, et al.. (2025). A hierarchical sub-modeling approach for the thermo-mechanical analysis of a TFT-FOPLP. Science Progress. 108(4). 352373712–352373712.
3.
4.
Sun, Yuhai, Min Chen, Dan Zhou, et al.. (2025). Green and efficient selective lithium extraction from spent lithium-ion batteries using a self-pressurizing-assisted oxidative fixation system. Separation and Purification Technology. 362. 131716–131716. 1 indexed citations
5.
Cheng, Hsien‐Chie, et al.. (2024). Power Cycling Modeling and Lifetime Evaluation of SiC Power MOSFET Module Using a Modified Physical Lifetime Model. IEEE Transactions on Device and Materials Reliability. 24(1). 142–153. 12 indexed citations
6.
Lee, Chang‐Chun, et al.. (2024). Chipping-induced fracture investigation of glass interposer with dielectric coatings. Surface and Coatings Technology. 489. 131097–131097. 2 indexed citations
7.
Cheng, Hsien‐Chie, et al.. (2023). Development and Performance Evaluation of Integrated Hybrid Power Module for Three-Phase Servo Motor Applications. Micromachines. 14(7). 1356–1356. 3 indexed citations
8.
Cheng, Hsien‐Chie, et al.. (2023). Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging. Materials. 16(23). 7491–7491. 1 indexed citations
9.
Cheng, Hsien‐Chie, et al.. (2023). Development of ANN-Based Warpage Prediction Model for FCCSP via Subdomain Sampling and Taguchi Hyperparameter Optimization. Micromachines. 14(7). 1325–1325. 14 indexed citations
10.
Cheng, Hsien‐Chie, et al.. (2021). Transient Electro-Thermal Coupled Modeling of Three-Phase Power MOSFET Inverter during Load Cycles. Materials. 14(18). 5427–5427. 10 indexed citations
11.
Cheng, Hsien‐Chie, et al.. (2015). First-principles Calculation of Interfacial AdhesionStrength and Electromigration for the Micro-bumpInterconnect of 3D Chip Stacking Packaging. Computer Modeling in Engineering & Sciences. 109(1). 1–13. 1 indexed citations
12.
Cheng, Hsien‐Chie, et al.. (2013). Process-dependent Thermal-Mechanical Behaviors of anAdvanced Thin-Flip-Chip-on-Flex InterconnectTechnology with Anisotropic Conductive Film Joints. Cmc-computers Materials & Continua. 38(3). 129–154. 2 indexed citations
13.
Chen, Wen‐Hwa, et al.. (2013). Thermal-Mechanical and Thermodynamic Properties ofGraphene Sheets using a Modified Nosé-HooverThermostat. Cmc-computers Materials & Continua. 36(2). 203–229. 3 indexed citations
14.
Chen, Wen‐Hwa, Chun‐Hung Wu, & Hsien‐Chie Cheng. (2011). Temperature-dependent Thermodynamic Behaviors of Carbon Fullerene Molecules at Atmospheric Pressure. Cmc-computers Materials & Continua. 25(3). 195–214. 2 indexed citations
15.
Cheng, Hsien‐Chie, et al.. (2011). Strain- and strain-rate-dependent mechanical properties and behaviors of Cu3Sn compound using molecular dynamics simulation. Journal of Materials Science. 47(7). 3103–3114. 50 indexed citations
16.
Cheng, Hsien‐Chie, Yu‐Chen Hsu, & Wen‐Hwa Chen. (2009). The Influence of Structural Defect on Mechanical Properties and Fracture Behaviors of Carbon Nanotubes. Cmc-computers Materials & Continua. 11(2). 127–146. 7 indexed citations
17.
Cheng, Hsien‐Chie, et al.. (2008). Atomistic-continuum modeling for mechanical properties of single-walled carbon nanotubes. International Journal of Solids and Structures. 46(7-8). 1695–1704. 64 indexed citations
18.
Cheng, Hsien‐Chie, et al.. (2007). Mechanical Properties of Carbon Nanotubes Using Molecular Dynamics Simulations with the Inlayer van der Waals Interactions. Computer Modeling in Engineering & Sciences. 20(2). 123–146. 18 indexed citations
19.
Cheng, Hsien‐Chie, et al.. (2005). An Effective Thermal-mechanical Modeling Methodology for Large-scale Area Array Typed Packages. Computer Modeling in Engineering & Sciences. 7(1). 1–18. 6 indexed citations
20.
Cheng, Hsien‐Chie. (1994). The optimal shape/topology design of structures for dynamic problems using a homogenization method.. Deep Blue (University of Michigan). 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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