Yi-Sa Huang

1.0k total citations
8 papers, 848 citations indexed

About

Yi-Sa Huang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Yi-Sa Huang has authored 8 papers receiving a total of 848 indexed citations (citations by other indexed papers that have themselves been cited), including 7 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 2 papers in Mechanics of Materials. Recurrent topics in Yi-Sa Huang's work include Copper Interconnects and Reliability (5 papers), Electronic Packaging and Soldering Technologies (5 papers) and Microstructure and mechanical properties (2 papers). Yi-Sa Huang is often cited by papers focused on Copper Interconnects and Reliability (5 papers), Electronic Packaging and Soldering Technologies (5 papers) and Microstructure and mechanical properties (2 papers). Yi-Sa Huang collaborates with scholars based in Taiwan and United States. Yi-Sa Huang's co-authors include Chih Chen, Chien-Min Liu, K. N. Tu, Han-wen Lin, Hsiang‐Yao Hsiao, Chia-Ling Lu, Kuan‐Neng Chen, Yi‐Cheng Chu, Jui‐Chao Kuo and David S.H. Chu and has published in prestigious journals such as Science, Scientific Reports and Scripta Materialia.

In The Last Decade

Yi-Sa Huang

8 papers receiving 833 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Yi-Sa Huang Taiwan	8	670	366	282	276	145	8	848
Hsiang‐Yao Hsiao Taiwan	9	736 1.1×	298 0.8×	234 0.8×	379 1.4×	123 0.8×	10	888
Han-wen Lin Taiwan	6	533 0.8×	260 0.7×	190 0.7×	240 0.9×	102 0.7×	9	652
David M. Stewart United States	13	249 0.4×	145 0.4×	266 0.9×	152 0.6×	45 0.3×	36	584
Hongbo Qin China	12	272 0.4×	77 0.2×	391 1.4×	207 0.8×	70 0.5×	49	613
Soon‐Chul Ur South Korea	18	379 0.6×	185 0.5×	563 2.0×	144 0.5×	25 0.2×	67	747
James Spencer Lundh United States	14	261 0.4×	309 0.8×	499 1.8×	75 0.3×	59 0.4×	47	718
S. Hymes United States	10	439 0.7×	435 1.2×	116 0.4×	102 0.4×	145 1.0×	20	568
Nisha Verma India	12	145 0.2×	205 0.6×	385 1.4×	161 0.6×	113 0.8×	25	490
Kong Boon Yeap United States	13	241 0.4×	113 0.3×	79 0.3×	103 0.4×	120 0.8×	38	394
Dong-Hee Yeon South Korea	15	368 0.5×	159 0.4×	290 1.0×	136 0.5×	36 0.2×	22	613

Countries citing papers authored by Yi-Sa Huang

Since Specialization

Citations

This map shows the geographic impact of Yi-Sa Huang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yi-Sa Huang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yi-Sa Huang more than expected).

Fields of papers citing papers by Yi-Sa Huang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yi-Sa Huang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yi-Sa Huang. The network helps show where Yi-Sa Huang may publish in the future.

Co-authorship network of co-authors of Yi-Sa Huang

This figure shows the co-authorship network connecting the top 25 collaborators of Yi-Sa Huang. A scholar is included among the top collaborators of Yi-Sa Huang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yi-Sa Huang. Yi-Sa Huang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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8 of 8 papers shown

1.

Huang, Yi-Sa, et al.. (2016). Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints. Crystals. 6(1). 12–12. 31 indexed citations

2.

Liu, Chien-Min, Han-wen Lin, Yi-Sa Huang, et al.. (2015). Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu. Scientific Reports. 5(1). 9734–9734. 191 indexed citations

3.

Huang, Yi-Sa, et al.. (2014). Grain growth in electroplated (111)-oriented nanotwinned Cu. Scripta Materialia. 89. 5–8. 55 indexed citations

4.

Lu, Chia-Ling, Han-wen Lin, Chien-Min Liu, et al.. (2014). Extremely anisotropic single-crystal growth in nanotwinned copper. NPG Asia Materials. 6(10). e135–e135. 44 indexed citations

5.

Liu, Chien-Min, et al.. (2012). Eliminate Kirkendall voids in solder reactions on nanotwinned copper. Scripta Materialia. 68(5). 241–244. 89 indexed citations

6.

Liu, Chien-Min, et al.. (2012). Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition. Crystal Growth & Design. 12(10). 5012–5016. 107 indexed citations

7.

Hsiao, Hsiang‐Yao, Chien-Min Liu, Han-wen Lin, et al.. (2012). Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper. Science. 336(6084). 1007–1010. 323 indexed citations

8.

Chao, Yu‐Chiang, Yi-Sa Huang, Hsin-Ping Wang, et al.. (2011). An organic hydrogel film with micron-sized pillar array for real-time and indicator-free detection of Zn2+. Organic Electronics. 12(11). 1899–1902. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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