Yi-Sa Huang
- Electrical and Electronic Engineering top 5%
- Electronic, Optical and Magnetic Materials top 10%
- Materials Chemistry
- Mechanical Engineering top 10%
- Mechanics of Materials top 10%
- Co-authors
- Chih ChenChien-Min LiuK. N. TuHan-wen LinHsiang‐Yao HsiaoChia-Ling LuKuan‐Neng ChenYi‐Cheng Chu
- Topics
- Copper Interconnects and Reliability (5 papers)Electronic Packaging and Soldering Technologies (5 papers)Microstructure and mechanical properties (2 papers)
- Cited by
- Electronic, Optical and Magnetic MaterialsElectrical and Electronic EngineeringMechanical Engineering
- Partner nations
- TaiwanUnited States
In The Last Decade
Yi-Sa Huang
8 papers receiving 833 citations
Peers
Comparison fields: 5 of 35
- Electrical and Electronic Engineering 670
- Electronic, Optical and Magnetic Materials 366
- Materials Chemistry 282
- Mechanical Engineering 276
- Mechanics of Materials 145
Countries citing papers authored by Yi-Sa Huang
This map shows the geographic impact of Yi-Sa Huang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yi-Sa Huang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yi-Sa Huang more than expected).
Fields of papers citing papers by Yi-Sa Huang
This network shows the impact of papers produced by Yi-Sa Huang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yi-Sa Huang. The network helps show where Yi-Sa Huang may publish in the future.
Co-authorship network of co-authors of Yi-Sa Huang
This figure shows the co-authorship network connecting the top 25 collaborators of Yi-Sa Huang. A scholar is included among the top collaborators of Yi-Sa Huang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yi-Sa Huang. Yi-Sa Huang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 31 | |
| 2 | 191 | |
| 3 | 55 | |
| 4 | 44 | |
| 5 | 89 | |
| 6 | 107 | |
| 7 | 323 | |
| 8 | 8 |
About Yi-Sa Huang
Yi-Sa Huang is a scholar working on Electronic, Optical and Magnetic Materials, Bioengineering and Electrical and Electronic Engineering, having authored 8 papers that have together received 848 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (5 papers), Electronic Packaging and Soldering Technologies (5 papers) and Microstructure and mechanical properties (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (366 citations), Electrical and Electronic Engineering (670 citations) and Mechanical Engineering (276 citations). Yi-Sa Huang has collaborated with scholars based in Taiwan and United States. Frequent co-authors include Chih Chen, Chien-Min Liu, K. N. Tu, Han-wen Lin, Hsiang‐Yao Hsiao, Chia-Ling Lu, Kuan‐Neng Chen, Yi‐Cheng Chu, Jui‐Chao Kuo and David S.H. Chu. Their work appears in journals such as Science, Scientific Reports and Scripta Materialia.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.