Doug C. H. Yu

1.5k total citations
31 papers, 1.0k citations indexed

About

Doug C. H. Yu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Automotive Engineering. According to data from OpenAlex, Doug C. H. Yu has authored 31 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Electrical and Electronic Engineering, 7 papers in Electronic, Optical and Magnetic Materials and 3 papers in Automotive Engineering. Recurrent topics in Doug C. H. Yu's work include 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (19 papers) and Copper Interconnects and Reliability (7 papers). Doug C. H. Yu is often cited by papers focused on 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (19 papers) and Copper Interconnects and Reliability (7 papers). Doug C. H. Yu collaborates with scholars based in Taiwan, United States and Netherlands. Doug C. H. Yu's co-authors include Chih Chen, Kuan‐Neng Chen, Brendan Fisher, David Hadley, Paul Morling, Stephen Färber, R.S. de Groot, Kerry Turner, Matthew Zylstra and Chris Kirkby and has published in prestigious journals such as Ecological Applications, MRS Bulletin and Journal of Electronic Materials.

In The Last Decade

Doug C. H. Yu

31 papers receiving 948 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Doug C. H. Yu Taiwan 14 585 319 160 94 85 31 1.0k
Haiyun Chen China 18 221 0.4× 144 0.5× 40 0.3× 66 0.7× 20 0.2× 79 745
Chenxi Lu China 13 54 0.1× 154 0.5× 93 0.6× 30 0.3× 70 0.8× 51 696
Pan Gao China 18 389 0.7× 161 0.5× 31 0.2× 19 0.2× 47 0.6× 68 1.0k
Mengyu Wang China 12 300 0.5× 92 0.3× 15 0.1× 20 0.2× 121 1.4× 56 726
Conglin Zhang China 21 307 0.5× 95 0.3× 31 0.2× 19 0.2× 412 4.8× 87 1.1k
Haiyang Li China 18 155 0.3× 62 0.2× 46 0.3× 12 0.1× 112 1.3× 70 760
Holger Gerdes Germany 10 100 0.2× 162 0.5× 99 0.6× 55 0.6× 27 0.3× 25 453
M. Köhl Germany 27 626 1.1× 150 0.5× 10 0.1× 11 0.1× 197 2.3× 99 1.9k
Xiangfeng Meng China 12 99 0.2× 222 0.7× 36 0.2× 17 0.2× 6 0.1× 24 541
Wei‐Chih Lin Taiwan 18 190 0.3× 134 0.4× 28 0.2× 21 0.2× 25 0.3× 76 965

Countries citing papers authored by Doug C. H. Yu

Since Specialization
Citations

This map shows the geographic impact of Doug C. H. Yu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Doug C. H. Yu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Doug C. H. Yu more than expected).

Fields of papers citing papers by Doug C. H. Yu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Doug C. H. Yu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Doug C. H. Yu. The network helps show where Doug C. H. Yu may publish in the future.

Co-authorship network of co-authors of Doug C. H. Yu

This figure shows the co-authorship network connecting the top 25 collaborators of Doug C. H. Yu. A scholar is included among the top collaborators of Doug C. H. Yu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Doug C. H. Yu. Doug C. H. Yu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Tung, Chih‐Hang & Doug C. H. Yu. (2023). An Integrated System Scaling Solution for Future High Performance Computing. 1–2. 3 indexed citations
2.
Hsiao, Sheng-Yi, Wei Lin, C. W. Chang, et al.. (2021). Ultra High Power Cooling Solution for 3D-ICs. 1–2. 12 indexed citations
3.
Yu, Doug C. H., et al.. (2019). System on Integrated Chips (SoIC(TM) for 3D Heterogeneous Integration. 594–599. 126 indexed citations
4.
Hsu, Che‐Wei, et al.. (2019). High Q-factor 3D Solenoid Inductor on InFO Package for RF System Integration. 1–3. 3 indexed citations
5.
Chiou, W.C., et al.. (2019). 3D Multi-chip Integration with System on Integrated Chips (SoIC™). T20–T21. 52 indexed citations
6.
7.
Yu, Chengpu, et al.. (2018). High Performance, High Density RDL for Advanced Packaging. 587–593. 26 indexed citations
8.
Chen, Chih, Doug C. H. Yu, & Kuan‐Neng Chen. (2015). Vertical interconnects of microbumps in 3D integration. MRS Bulletin. 40(3). 257–263. 79 indexed citations
9.
10.
Yang, Shun‐Chung, et al.. (2015). A flexible interconnect technology demonstrated on a wafer-level chip scale package. 26. 859–864. 1 indexed citations
11.
12.
Yu, Doug C. H.. (2014). New System-in-Package (SiP) Integration technologies. 1–6. 19 indexed citations
13.
Lii, Mirng-Ji, Antonio Manna, Kenneth June Rebibis, et al.. (2014). Process development to enable 3D IC multi-tier die bond for 20μM pitch and beyond. 572–575. 9 indexed citations
14.
15.
Lai, Wei‐Chih, Harry Chuang, Chung-Hao Tsai, et al.. (2013). 300mm size ultra-thin glass interposer technology and high-Q embedded helical inductor (EHI) for mobile application. 13.4.1–13.4.4. 23 indexed citations
16.
Lii, Mirng-Ji, et al.. (2012). Advanced flip-chip package solution for 28nm Si node and beyond. 436–438. 2 indexed citations
17.
Jeng, Shin-Puu, J.H. Chang, Yirong Lin, et al.. (2011). Orthotropic stress field induced by TSV and its impact on device performance. 11. 1–3. 10 indexed citations
18.
Yu, Doug C. H., et al.. (2011). Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation. Journal of Electronic Materials. 40(6). 1409–1415. 57 indexed citations
19.
Hou, S. Y., Cho-Chiang Shih, C.H. Hsieh, et al.. (2010). Lead-free flip chip solution for 40 nm extreme low-k interconnect system. 9. 1–3. 2 indexed citations
20.
Fisher, Brendan, Kerry Turner, Matthew Zylstra, et al.. (2008). ECOSYSTEM SERVICES AND ECONOMIC THEORY: INTEGRATION FOR POLICY‐RELEVANT RESEARCH. Ecological Applications. 18(8). 2050–2067. 390 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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