Doug C. H. Yu
- Electrical and Electronic Engineering top 10%
- Global and Planetary Change top 5%
- Economics and Econometrics top 5%
- Management, Monitoring, Policy and Law top 5%
- Mechanical Engineering
- Co-authors
- Kuan‐Neng ChenChih ChenAndrew BalmfordStephen FärberJouni PaavolaRhys E. GreenChris KirkbyDavid Hadley
- Topics
- 3D IC and TSV technologies (26 papers)Electronic Packaging and Soldering Technologies (19 papers)Copper Interconnects and Reliability (7 papers)
- Cited by
- Global and Planetary ChangeElectrical and Electronic EngineeringManagement, Monitoring, Policy and Law
- Partner nations
- TaiwanUnited StatesNetherlands
In The Last Decade
Doug C. H. Yu
31 papers receiving 948 citations
Peers
Comparison fields: 5 of 80
- Electrical and Electronic Engineering 585
- Global and Planetary Change 319
- Economics and Econometrics 160
- Management, Monitoring, Policy and Law 94
- Mechanical Engineering 85
Countries citing papers authored by Doug C. H. Yu
This map shows the geographic impact of Doug C. H. Yu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Doug C. H. Yu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Doug C. H. Yu more than expected).
Fields of papers citing papers by Doug C. H. Yu
This network shows the impact of papers produced by Doug C. H. Yu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Doug C. H. Yu. The network helps show where Doug C. H. Yu may publish in the future.
Co-authorship network of co-authors of Doug C. H. Yu
This figure shows the co-authorship network connecting the top 25 collaborators of Doug C. H. Yu. A scholar is included among the top collaborators of Doug C. H. Yu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Doug C. H. Yu. Doug C. H. Yu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 12 | |
| 2 | 126 | |
| 3 | 52 | |
| 4 | 3 | |
| 5 | 5 | |
| 6 | 22 | |
| 7 | 79 | |
| 8 | 12 | |
| 9 | 5 | |
| 10 | 1 | |
| 11 | 19 | |
| 12 | 9 | |
| 13 | 17 | |
| 14 | High-performance inductors for integrated fan-out wafer level packaging (InFO-WLP) | 6 |
| 15 | 2 | |
| 16 | 2 | |
| 17 | 10 | |
| 18 | 57 | |
| 19 | 2 | |
| 20 | 390 |
About Doug C. H. Yu
Doug C. H. Yu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Automotive Engineering, having authored 31 papers that have together received 1.0k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (19 papers) and Copper Interconnects and Reliability (7 papers). The work is most often cited by research in Global and Planetary Change (319 citations), Electrical and Electronic Engineering (585 citations) and Management, Monitoring, Policy and Law (94 citations). Doug C. H. Yu has collaborated with scholars based in Taiwan, United States and Netherlands. Frequent co-authors include Kuan‐Neng Chen, Chih Chen, Andrew Balmford, Stephen Färber, Jouni Paavola, Rhys E. Green, Chris Kirkby, David Hadley, Roy Brouwer and R.S. de Groot. Their work appears in journals such as Ecological Applications, MRS Bulletin and Journal of Electronic Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.