Han-wen Lin

789 total citations
9 papers, 652 citations indexed

About

Han-wen Lin is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Aerospace Engineering. According to data from OpenAlex, Han-wen Lin has authored 9 papers receiving a total of 652 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 3 papers in Aerospace Engineering. Recurrent topics in Han-wen Lin's work include Electronic Packaging and Soldering Technologies (8 papers), Copper Interconnects and Reliability (5 papers) and Aluminum Alloy Microstructure Properties (3 papers). Han-wen Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Copper Interconnects and Reliability (5 papers) and Aluminum Alloy Microstructure Properties (3 papers). Han-wen Lin collaborates with scholars based in Taiwan, United States and Hong Kong. Han-wen Lin's co-authors include Chih Chen, Chien-Min Liu, Yi-Sa Huang, K. N. Tu, Chia-Ling Lu, Hsiang‐Yao Hsiao, Kuan‐Neng Chen, Yi‐Cheng Chu, Jui‐Chao Kuo and K. N. Tu and has published in prestigious journals such as Science, Acta Materialia and Scientific Reports.

In The Last Decade

Han-wen Lin

9 papers receiving 641 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Han-wen Lin Taiwan	6	533	260	240	190	102	9	652
Chia-Ling Lu Taiwan	7	482 0.9×	228 0.9×	232 1.0×	188 1.0×	90 0.9×	8	587
Yi-Sa Huang Taiwan	8	670 1.3×	366 1.4×	276 1.1×	282 1.5×	145 1.4×	8	848
Hsiang‐Yao Hsiao Taiwan	9	736 1.4×	298 1.1×	379 1.6×	234 1.2×	123 1.2×	10	888
Chien-Lung Liang Taiwan	15	478 0.9×	196 0.8×	193 0.8×	155 0.8×	34 0.3×	37	533
Kong Boon Yeap United States	13	241 0.5×	113 0.4×	103 0.4×	79 0.4×	120 1.2×	38	394
L.A. Bendersky United States	6	272 0.5×	90 0.3×	194 0.8×	110 0.6×	52 0.5×	6	418
Jubo Peng China	13	276 0.5×	157 0.6×	166 0.7×	125 0.7×	14 0.1×	53	488
G.T. Galyon United States	9	424 0.8×	101 0.4×	243 1.0×	77 0.4×	54 0.5×	15	488
Barbara Horváth Hungary	14	355 0.7×	57 0.2×	191 0.8×	82 0.4×	38 0.4×	31	445
Guangyin Lei China	8	422 0.8×	117 0.5×	192 0.8×	156 0.8×	38 0.4×	24	562

Countries citing papers authored by Han-wen Lin

Since Specialization

Citations

This map shows the geographic impact of Han-wen Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Han-wen Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Han-wen Lin more than expected).

Fields of papers citing papers by Han-wen Lin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Han-wen Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Han-wen Lin. The network helps show where Han-wen Lin may publish in the future.

Co-authorship network of co-authors of Han-wen Lin

This figure shows the co-authorship network connecting the top 25 collaborators of Han-wen Lin. A scholar is included among the top collaborators of Han-wen Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Han-wen Lin. Han-wen Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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9 of 9 papers shown

1.

Lin, Han-wen, et al.. (2025). To suppress tin whisker growth by using (100)-oriented copper. Journal of Materials Research and Technology. 35. 3217–3225. 1 indexed citations

2.

Lin, Han-wen, et al.. (2016). Effect of Sn Grain Orientation on Formation of Cu6Sn5 Intermetallic Compound Under Current Stressing. Journal of Electronic Materials. 46(4). 2179–2184. 3 indexed citations

3.

Liu, Chien-Min, Han-wen Lin, Yi-Sa Huang, et al.. (2015). Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu. Scientific Reports. 5(1). 9734–9734. 191 indexed citations

4.

Liu, Chien-Min, Han-wen Lin, Chia-Ling Lu, & Chih Chen. (2014). Effect of grain orientations of Cu seed layers on the growth of <111>-oriented nanotwinned Cu. Scientific Reports. 4(1). 6123–6123. 29 indexed citations

5.

Lu, Chia-Ling, Han-wen Lin, Chien-Min Liu, et al.. (2014). Extremely anisotropic single-crystal growth in nanotwinned copper. NPG Asia Materials. 6(10). e135–e135. 44 indexed citations

6.

Lin, Han-wen, Chia-Ling Lu, Chien-Min Liu, et al.. (2013). Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈1 1 1〉 oriented and nanotwinned Cu. Acta Materialia. 61(13). 4910–4919. 46 indexed citations

7.

Lin, Han-wen, et al.. (2012). Thermomigration of Ti in flip-chip solder joints. Scripta Materialia. 66(9). 694–697. 10 indexed citations

8.

Hsiao, Hsiang‐Yao, Chien-Min Liu, Han-wen Lin, et al.. (2012). Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper. Science. 336(6084). 1007–1010. 323 indexed citations

9.

Chen, Chih, et al.. (2012). Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam. Materials Characterization. 74. 42–48. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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