Wen-Wei Shen

527 total citations
27 papers, 429 citations indexed

About

Wen-Wei Shen is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, Wen-Wei Shen has authored 27 papers receiving a total of 429 indexed citations (citations by other indexed papers that have themselves been cited), including 26 papers in Electrical and Electronic Engineering, 9 papers in Biomedical Engineering and 5 papers in Automotive Engineering. Recurrent topics in Wen-Wei Shen's work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (17 papers) and Nanofabrication and Lithography Techniques (5 papers). Wen-Wei Shen is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (17 papers) and Nanofabrication and Lithography Techniques (5 papers). Wen-Wei Shen collaborates with scholars based in Taiwan, United States and China. Wen-Wei Shen's co-authors include Guanjun Zhang, Junbo Deng, Demin Tu, Bai‐Peng Song, Haibao Mu, Wei Song, Guo-Qiang Su, Hsiang‐Hung Chang, Cheng-Ta Ko and Wei‐Chung Lo and has published in prestigious journals such as Journal of Applied Physics, IEEE Transactions on Dielectrics and Electrical Insulation and Biological and Pharmaceutical Bulletin.

In The Last Decade

Wen-Wei Shen

26 papers receiving 399 citations

Peers

Countries citing papers authored by Wen-Wei Shen

Since Specialization

Citations

This map shows the geographic impact of Wen-Wei Shen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wen-Wei Shen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wen-Wei Shen more than expected).

Fields of papers citing papers by Wen-Wei Shen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Wen-Wei Shen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wen-Wei Shen. The network helps show where Wen-Wei Shen may publish in the future.

Co-authorship network of co-authors of Wen-Wei Shen

This figure shows the co-authorship network connecting the top 25 collaborators of Wen-Wei Shen. A scholar is included among the top collaborators of Wen-Wei Shen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wen-Wei Shen. Wen-Wei Shen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	3-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV) 2018 ·IEEE Journal of the Electron Devices Society ·Wen-Wei Shen, Ming‐Jer Kao, Kuan‐Neng Chen, Yu-Min Lin, (unknown), (unknown), Tao‐Chih Chang, Wei‐Chung Lo, Chien‐Chung Lin, Yung-Fa Chou, Ding-Ming Kwai	11
2	Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology 2018 ·Journal of Nanoscience and Nanotechnology ·Wen-Wei Shen, Yu‐Min Lin, (unknown), (unknown), (unknown), (unknown), Tao‐Chih Chang, Kuan‐Neng Chen	8
3	An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications 2018 ·Yu-Min Lin, (unknown), Wen-Wei Shen, Shin‐Yi Huang, (unknown), (unknown), Tao‐Chih Chang, Hsiang‐Hung Chang, (unknown), Chia‐Hsin Lee, (unknown), Xiao Liu, Qi Wu, Kuan‐Neng Chen	11
4	Reliability evaluation of glass interposer module 2016 ·(unknown), Jen Chun Wang, Chau‐Jie Zhan, Wen-Wei Shen, (unknown), (unknown), (unknown), (unknown), (unknown), (unknown)	6
5	Optimization of laser release layer, glass carrier, and organic build-up layer to enable RDL-first fan-out wafer-level packaging 2016 ·IMAPSource Proceedings ·Alvin Kai-Xing Lee, (unknown), (unknown), (unknown), (unknown), Xiao Liu, Wen-Wei Shen, Yu-Min Lin, Tao‐Chih Chang, (unknown), Chia‐Wei Chiang, (unknown), (unknown), Yulan Lu, Kuan‐Neng Chen	3
6	Reliability test for integrated Glass interposer 2016 ·(unknown), Jen Chun Wang, Yu-Min Lin, Chau‐Jie Zhan, Wen-Wei Shen, (unknown), (unknown), Chia-Wen Chiang, (unknown), Sumei Chen, (unknown), Hsiang‐Hung Chang, Wei‐Chung Lo, (unknown)	1
7	Anti-HSV Activity of Kuwanon X from Mulberry Leaves with Genes Expression Inhibitory and HSV-1 Induced NF-κB Deactivated Properties 2016 ·Biological and Pharmaceutical Bulletin ·Fang Ma, Wen-Wei Shen, Xiaoqi Zhang, (unknown), Yifei Wang, Yuxiao Zou, Yao-Lan Li, Hui Wang	23
8	Aging characterization of high temperature vulcanized silicone rubber housing material used for outdoor insulation 2015 ·IEEE Transactions on Dielectrics and Electrical Insulation ·Wei Song, Wen-Wei Shen, Guanjun Zhang, Bai‐Peng Song, (unknown), Guo-Qiang Su, Haibao Mu, Junbo Deng	81
9	Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication 2015 ·Wen-Wei Shen, Hsiang‐Hung Chang, Jen Chun Wang, Cheng-Ta Ko, (unknown), (unknown), Aric Shorey, Alvin Kai-Xing Lee, (unknown), (unknown), (unknown), Wei‐Chung Lo, Kuan‐Neng Chen	7
10	A low-temperature temporary lamination and laser debonding technology to enable cost-effective fabrication of a through-glass-via (TGV) interposer on a panel substrate 2015 ·Alvin Kai-Xing Lee, (unknown), (unknown), (unknown), Wen-Wei Shen, Hsiang‐Hung Chang, Chia‐Wei Chiang	3
11	Process integration of 3D stacking for backside illuminated image sensor 2014 ·(unknown), Cheng-Ta Ko, Hsiang‐Hung Chang, (unknown), (unknown), (unknown), Wen‐Li Tsai, Wen-Wei Shen, Jen Chun Wang, Yu-Min Lin, Wei‐Chung Lo	2
12	2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications 2014 ·IEEE Transactions on Biomedical Circuits and Systems ·Po-Tsang Huang, (unknown), Yu‐Chieh Huang, (unknown), (unknown), (unknown), (unknown), (unknown), Wen-Wei Shen, Ching-Te Chuang, Kuan‐Neng Chen, Jin‐Chern Chiou, Wei Hwang, Ho‐Ming Tong	6
13	A Novel Thin Wafer Handling Technology to Enable Cost-Effective Fabrication of Through-Glass Via Interposers 2014 ·IMAPSource Proceedings ·Alvin Kai-Xing Lee, (unknown), (unknown), (unknown), (unknown), (unknown), Aric Shorey, Wen-Wei Shen, (unknown), Hsiang‐Hung Chang, Jen Chun Wang	2
14	Laminating thin glass onto glass carrier to eliminate grinding and bonding process for glass interposer 2014 ·(unknown), (unknown), Aric Shorey, Alvin Kai-Xing Lee, (unknown), (unknown), Wen-Wei Shen, Hsiang‐Hung Chang, Chi‐Hsien Chien	2
15	18.6 2.5D heterogeneously integrated bio-sensing microsystem for multi-channel neural-sensing applications 2014 ·Po-Tsang Huang, (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), Wen-Wei Shen, Kuan‐Neng Chen, Jin‐Chern Chiou, Ching-Te Chuang, Wei Hwang, (unknown), (unknown), (unknown), (unknown), Ho‐Ming Tong	6
16	Performance and process characteristic of glass interposer with through-glass-via(TGV) 2013 ·(unknown), (unknown), (unknown), (unknown), (unknown), Chau‐Jie Zhan, (unknown), (unknown), (unknown), Hsiang‐Hung Chang, (unknown), (unknown), Wen-Wei Shen, Cheng-Ta Ko, Wei‐Chung Lo, (unknown)	15
17	Surface Charge Accumulation on Silicon Rubber Material under DC Voltage in Atmosphere 2013 ·Guo-Qiang Su, Haibao Mu, Wen-Wei Shen, Bai‐Peng Song, (unknown), Guanjun Zhang	1
18	Identification of electron and hole trap based on isothermal surface potential decay model 2013 ·Journal of Applied Physics ·Wen-Wei Shen, (unknown), Guanjun Zhang, Junbo Deng, Demin Tu	150
19	The energy distribution of traps in polymers based on isothermal surface potential decay measurement 2012 ·Wen-Wei Shen, Guoli Wang, (unknown), (unknown), Limiao Zhang, (unknown), Guanjun Zhang	4
20	Surface trapping parameters of solid dielectrics: Novel measurement method and insulation condition characterization 2012 ·Guanjun Zhang, Wen-Wei Shen, Haibao Mu, Junbo Deng	2

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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