Hun Shen Ng
- Electrical and Electronic Engineering top 10%
- Mechanics of Materials top 10%
- Mechanical Engineering
- Materials Chemistry
- Aerospace Engineering
- Topics
- Electronic Packaging and Soldering Technologies (24 papers)3D IC and TSV technologies (20 papers)Integrated Circuits and Semiconductor Failure Analysis (5 papers)
- Journals
- Journal of Electronic MaterialsMicroelectronics ReliabilityIEEE Transactions on Advanced Packaging
- Partner nations
- SingaporeUnited StatesSwitzerland
In The Last Decade
Hun Shen Ng
25 papers receiving 581 citations
Peers
Comparison fields: 5 of 26
- Electrical and Electronic Engineering 607
- Mechanics of Materials 165
- Mechanical Engineering 116
- Materials Chemistry 35
- Aerospace Engineering 30
Countries citing papers authored by Hun Shen Ng
This map shows the geographic impact of Hun Shen Ng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hun Shen Ng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hun Shen Ng more than expected).
Fields of papers citing papers by Hun Shen Ng
This network shows the impact of papers produced by Hun Shen Ng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hun Shen Ng. The network helps show where Hun Shen Ng may publish in the future.
Co-authorship network of co-authors of Hun Shen Ng
This figure shows the co-authorship network connecting the top 25 collaborators of Hun Shen Ng. A scholar is included among the top collaborators of Hun Shen Ng based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hun Shen Ng. Hun Shen Ng is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 0 | |
| 3 | 1 | |
| 4 | 16 | |
| 5 | 7 | |
| 6 | 3 | |
| 7 | 1 | |
| 8 | 19 | |
| 9 | 2 | |
| 10 | 25 | |
| 11 | 3 | |
| 12 | 2 | |
| 13 | 15 | |
| 14 | 37 | |
| 15 | 37 | |
| 16 | 98 | |
| 17 | 162 | |
| 18 | 2 | |
| 19 | 4 | |
| 20 | 25 |
About Hun Shen Ng
Hun Shen Ng is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, having authored 26 papers that have together received 630 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (20 papers) and Integrated Circuits and Semiconductor Failure Analysis (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (607 citations), Mechanics of Materials (165 citations) and Mechanical Engineering (116 citations). Hun Shen Ng has collaborated with scholars based in Singapore, United States and Switzerland. Frequent co-authors include Tong Yan Tee, Z.W. Zhong, Chwee Teck Lim, E. Pek, D. Yap, Jing-en Luan, Xavier Baraton, Ahmer Syed, R. Brenner and Jiang Zhou. Their work appears in journals such as Journal of Electronic Materials, Microelectronics Reliability and IEEE Transactions on Advanced Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.