C.D. Breach

942 total citations
44 papers, 759 citations indexed

About

C.D. Breach is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, C.D. Breach has authored 44 papers receiving a total of 759 indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Electrical and Electronic Engineering, 27 papers in Mechanical Engineering and 8 papers in Mechanics of Materials. Recurrent topics in C.D. Breach's work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (14 papers) and Aluminum Alloys Composites Properties (10 papers). C.D. Breach is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (14 papers) and Aluminum Alloys Composites Properties (10 papers). C.D. Breach collaborates with scholars based in Singapore, United Kingdom and Thailand. C.D. Breach's co-authors include F. Wulff, Saraswati Saraswati, C.S. Goh, Subodh G. Mhaisalkar, Thirumany Sritharan, Richard Holliday, Xiao Hu, A. C. Smith, Christian Wong and Athene M. Donald and has published in prestigious journals such as Polymer, Carbohydrate Polymers and Materials Science and Engineering A.

In The Last Decade

C.D. Breach

43 papers receiving 682 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
C.D. Breach Singapore	15	539	367	140	139	101	44	759
Ikuo Shohji Japan	15	861 1.6×	678 1.8×	120 0.9×	95 0.7×	51 0.5×	174	1.0k
Sehoon Yoo South Korea	13	475 0.9×	290 0.8×	86 0.6×	57 0.4×	52 0.5×	88	605
Kai Fu China	15	268 0.5×	143 0.4×	343 2.5×	119 0.9×	85 0.8×	50	640
Moon‐Jo Kim South Korea	14	764 1.4×	371 1.0×	425 3.0×	104 0.7×	26 0.3×	30	997
Dan Jia China	14	301 0.6×	308 0.8×	214 1.5×	167 1.2×	125 1.2×	39	829
Nan Jiang China	17	709 1.3×	536 1.5×	172 1.2×	72 0.5×	41 0.4×	61	1.0k
Chunjin Hang China	17	708 1.3×	444 1.2×	138 1.0×	45 0.3×	98 1.0×	53	838
Kyung-Wook Paik South Korea	13	507 0.9×	173 0.5×	128 0.9×	139 1.0×	68 0.7×	37	721
Kazuhiro Tsuruta Japan	14	521 1.0×	421 1.1×	55 0.4×	56 0.4×	64 0.6×	77	778
Seok‐Hwan Huh South Korea	10	1.2k 2.3×	981 2.7×	165 1.2×	94 0.7×	121 1.2×	49	1.4k

Countries citing papers authored by C.D. Breach

Since Specialization

Citations

This map shows the geographic impact of C.D. Breach's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.D. Breach with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.D. Breach more than expected).

Fields of papers citing papers by C.D. Breach

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C.D. Breach. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.D. Breach. The network helps show where C.D. Breach may publish in the future.

Co-authorship network of co-authors of C.D. Breach

This figure shows the co-authorship network connecting the top 25 collaborators of C.D. Breach. A scholar is included among the top collaborators of C.D. Breach based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C.D. Breach. C.D. Breach is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Goh, C.S., et al.. (2013). Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging. Crystals. 3(3). 391–404. 58 indexed citations

Breach, C.D., et al.. (2012). Oxidation and corrosion of Au/Al and Cu/Al in wire bonding assembly. 8 indexed citations

Breach, C.D., et al.. (2012). Shear Strength and Failure Modes of As-Bonded Gold and Copper Ball Bonds on Aluminum Metallization. Journal of Electronic Materials. 41(7). 2018–2028. 9 indexed citations

Breach, C.D., et al.. (2011). Failure of gold and copper ball bonds due to intermetallic oxidation and corrosion. 69. 1–6. 7 indexed citations

Breach, C.D., et al.. (2011). Corrosion of Gold and Copper Ball Bonds. ECS Transactions. 34(1). 831–841. 1 indexed citations

Breach, C.D., et al.. (2010). Effects of moisture on reliability of gold and copper ball bonds. 13 indexed citations

Breach, C.D., et al.. (2010). Moisture induced corrosion in gold and copper ball bonds. 1–11. 8 indexed citations

Breach, C.D. & F. Wulff. (2009). Intermetallic growth in gold ball bonds aged at 175°C: comparison between two 4N wires of different chemistry. Gold bulletin. 42(2). 92–105. 18 indexed citations

Breach, C.D. & F. Wulff. (2008). The Materials Science of Ballbonding: A Brief Overview. 52. 778–788. 4 indexed citations

10.

Saraswati, Saraswati, et al.. (2006). High Temperature Storage (HTS) Performance of Copper Ball Bonding Wires. 2. 602–607. 28 indexed citations

11.

Wulff, F. & C.D. Breach. (2006). Measurement of gold ballbond intermetallic coverage. Gold bulletin. 39(4). 175–184. 10 indexed citations

12.

Wulff, F., et al.. (2006). Oxidation of Au4Al in gold ballbonds. Materials Letters. 61(2). 452–456. 8 indexed citations

13.

Sritharan, Thirumany, et al.. (2006). Cyclic loading as an extended nanoindentation technique. Materials Science and Engineering A. 423(1-2). 14–18. 42 indexed citations

14.

Breach, C.D. & F. Wulff. (2006). Oxidation of Au4Al in un-moulded gold ballbonds after high temperature storage (HTS) in air at 175°C. Microelectronics Reliability. 46(12). 2112–2121. 14 indexed citations

15.

Wong, Christian, et al.. (2005). Effects of calcium on the mechanical properties of ultra-fine grained gold wires. Journal of Alloys and Compounds. 415(1-2). 193–197. 7 indexed citations

16.

Xu, Chen, C.D. Breach, Thirumany Sritharan, F. Wulff, & Subodh G. Mhaisalkar. (2004). Oxidation of bulk Au–Al intermetallics. Thin Solid Films. 462-463. 357–362. 22 indexed citations

17.

Breach, C.D., et al.. (2004). Degradation of the Au4Al compound in gold ballbonds during isothermal aging in air at 175 °C. Journal of Materials Science. 39(19). 6125–6128. 14 indexed citations

18.

Wulff, F., et al.. (2003). Crystallographic texture of drawn gold bonding wires using electron backscattered diffraction (EBSD). Journal of Materials Science Letters. 22(19). 1373–1376. 20 indexed citations

19.

Wan, Kai‐Tak & C.D. Breach. (1998). Thermodynamics of a Stable Blister Delamination at Elevated Temperature. The Journal of Adhesion. 66(1-4). 183–202. 7 indexed citations

20.

Breach, C.D. & Xiao Hu. (1996). Dynamic mechanical spectroscopy and modulated differential scanning calorimetry of an annealed poly(phenylene sulphide). Journal of Materials Science Letters. 15(16). 1416–1419. 13 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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