Wenhui Zhu
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- Electronic Packaging and Soldering Technologies 95
- 3D IC and TSV technologies 76
- Electrodeposition and Electroless Coatings 19
- Silicon Carbide Semiconductor Technologies 16
- Mechanical Engineering top 5%
- Aluminum Alloys Composites Properties 12
- Advanced Welding Techniques Analysis 11
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- Ga2O3 and related materials 11
- Materials Chemistry top 10%
- Mechanics of Materials top 5%
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- GaN-based semiconductor devices and materials 14
- Co-authors
- Hu HeJunhui LiLiancheng WangFuliang WangCan ZhouYan WangFa XingGuangping Zheng
- Cited by
- Electrical and Electronic EngineeringMechanical EngineeringElectronic, Optical and Magnetic Materials
- Journals
- Applied Physics Letters (2 papers)The Journal of Physical Chemistry B (1 paper)Journal of The Electrochemical Society (7 papers)
- Partner nations
- ChinaSingaporeUnited States
In The Last Decade
Wenhui Zhu
186 papers receiving 2.2k citations
Peers
Comparison fields: 5 of 112
- Electrical and Electronic Engineering 1.4k
- Mechanical Engineering 695
- Electronic, Optical and Magnetic Materials 273
- Materials Chemistry 503
- Mechanics of Materials 260
Countries citing papers authored by Wenhui Zhu
This map shows the geographic impact of Wenhui Zhu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wenhui Zhu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wenhui Zhu more than expected).
Fields of papers citing papers by Wenhui Zhu
This network shows the impact of papers produced by Wenhui Zhu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wenhui Zhu. The network helps show where Wenhui Zhu may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Wenhui Zhu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 4 | |
| 2 | 2025 | 1 | |
| 3 | 2024 | 0 | |
| 4 | 2024 | 0 | |
| 5 | 2024 | 0 | |
| 6 | 2023 | 0 | |
| 7 | 2023 | 2 | |
| 8 | 2023 | 1 | |
| 9 | 2023 | 8 | |
| 10 | 2022 | 8 | |
| 11 | 2022 | 16 | |
| 12 | 2021 | 8 | |
| 13 | 2021 | 4 | |
| 14 | 2021 | 4 | |
| 15 | 2021 | 16 | |
| 16 | 2020 | 25 | |
| 17 | 2020 | 9 | |
| 18 | 2020 | 1 | |
| 19 | 2018 | 10 | |
| 20 | 2017 | 27 |
About Wenhui Zhu
Wenhui Zhu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Condensed Matter Physics, having authored 199 papers that have together received 2.3k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (95 papers), 3D IC and TSV technologies (76 papers), Electrodeposition and Electroless Coatings (19 papers), Silicon Carbide Semiconductor Technologies (16 papers), GaN-based semiconductor devices and materials (14 papers), Aluminum Alloys Composites Properties (12 papers), Advanced Welding Techniques Analysis (11 papers) and Ga2O3 and related materials (11 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.4k citations), Mechanical Engineering (695 citations) and Electronic, Optical and Magnetic Materials (273 citations). Wenhui Zhu has collaborated with scholars based in China, Singapore and United States. Frequent co-authors include Hu He, Junhui Li, Liancheng Wang, Fuliang Wang, Can Zhou, Yan Wang, Fa Xing, Guangping Zheng, Chengdi Xiao and Zhuo Chen. Their work appears in journals such as Applied Physics Letters, The Journal of Physical Chemistry B and Journal of The Electrochemical Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.