Wenhui Zhu
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 5%
- Materials Chemistry top 10%
- Biomedical Engineering top 10%
- Electronic, Optical and Magnetic Materials top 10%
- Co-authors
- Hu HeJunhui LiLiancheng WangFuliang WangCan ZhouYan WangFa XingGuangping Zheng
- Topics
- Electronic Packaging and Soldering Technologies (95 papers)3D IC and TSV technologies (76 papers)Electrodeposition and Electroless Coatings (19 papers)
- Cited by
- Electrical and Electronic EngineeringMechanical EngineeringElectronic, Optical and Magnetic Materials
- Journals
- Applied Physics LettersThe Journal of Physical Chemistry BJournal of The Electrochemical Society
- Partner nations
- ChinaSingaporeUnited States
In The Last Decade
Wenhui Zhu
186 papers receiving 2.2k citations
Peers
Comparison fields: 5 of 112
- Electrical and Electronic Engineering 1.4k
- Mechanical Engineering 695
- Materials Chemistry 503
- Biomedical Engineering 368
- Electronic, Optical and Magnetic Materials 273
Countries citing papers authored by Wenhui Zhu
This map shows the geographic impact of Wenhui Zhu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wenhui Zhu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wenhui Zhu more than expected).
Fields of papers citing papers by Wenhui Zhu
This network shows the impact of papers produced by Wenhui Zhu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wenhui Zhu. The network helps show where Wenhui Zhu may publish in the future.
Co-authorship network of co-authors of Wenhui Zhu
This figure shows the co-authorship network connecting the top 25 collaborators of Wenhui Zhu. A scholar is included among the top collaborators of Wenhui Zhu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wenhui Zhu. Wenhui Zhu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 4 | |
| 2 | 1 | |
| 3 | 0 | |
| 4 | 0 | |
| 5 | 0 | |
| 6 | 0 | |
| 7 | 2 | |
| 8 | 1 | |
| 9 | 8 | |
| 10 | 8 | |
| 11 | 16 | |
| 12 | 8 | |
| 13 | 4 | |
| 14 | 4 | |
| 15 | 16 | |
| 16 | 25 | |
| 17 | 9 | |
| 18 | 1 | |
| 19 | 10 | |
| 20 | 27 |
About Wenhui Zhu
Wenhui Zhu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Condensed Matter Physics, having authored 199 papers that have together received 2.3k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (95 papers), 3D IC and TSV technologies (76 papers) and Electrodeposition and Electroless Coatings (19 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.4k citations), Mechanical Engineering (695 citations) and Electronic, Optical and Magnetic Materials (273 citations). Wenhui Zhu has collaborated with scholars based in China, Singapore and United States. Frequent co-authors include Hu He, Junhui Li, Liancheng Wang, Fuliang Wang, Can Zhou, Yan Wang, Fa Xing, Guangping Zheng, Chengdi Xiao and Zhuo Chen. Their work appears in journals such as Applied Physics Letters, The Journal of Physical Chemistry B and Journal of The Electrochemical Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.