Wenhui Zhu

3.0k total citations
199 papers, 2.3k citations indexed

About

Wenhui Zhu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Wenhui Zhu has authored 199 papers receiving a total of 2.3k indexed citations (citations by other indexed papers that have themselves been cited), including 136 papers in Electrical and Electronic Engineering, 52 papers in Mechanical Engineering and 33 papers in Materials Chemistry. Recurrent topics in Wenhui Zhu's work include Electronic Packaging and Soldering Technologies (95 papers), 3D IC and TSV technologies (76 papers) and Electrodeposition and Electroless Coatings (19 papers). Wenhui Zhu is often cited by papers focused on Electronic Packaging and Soldering Technologies (95 papers), 3D IC and TSV technologies (76 papers) and Electrodeposition and Electroless Coatings (19 papers). Wenhui Zhu collaborates with scholars based in China, Singapore and United States. Wenhui Zhu's co-authors include Hu He, Junhui Li, Liancheng Wang, Fuliang Wang, Can Zhou, Yan Wang, Fa Xing, Guangping Zheng, Chengdi Xiao and Zhuo Chen and has published in prestigious journals such as Applied Physics Letters, The Journal of Physical Chemistry B and Journal of The Electrochemical Society.

In The Last Decade

Wenhui Zhu

186 papers receiving 2.2k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Wenhui Zhu China 26 1.4k 695 503 368 273 199 2.3k
Yung-Cheng Lee United States 25 1.1k 0.8× 928 1.3× 448 0.9× 365 1.0× 220 0.8× 68 2.5k
Kuo‐Ning Chiang Taiwan 27 2.1k 1.4× 775 1.1× 215 0.4× 349 0.9× 152 0.6× 264 2.7k
Suresh K. Sitaraman United States 24 1.9k 1.3× 651 0.9× 586 1.2× 645 1.8× 162 0.6× 259 2.9k
Hsien‐Chie Cheng Taiwan 24 934 0.7× 498 0.7× 479 1.0× 185 0.5× 105 0.4× 122 1.7k
Daoguo Yang China 32 1.8k 1.3× 725 1.0× 1.4k 2.8× 582 1.6× 249 0.9× 219 3.6k
Takashi Yamaguchi Japan 25 853 0.6× 712 1.0× 1.2k 2.3× 378 1.0× 422 1.5× 262 2.6k
Guangning Wu China 31 1.6k 1.1× 1.3k 1.8× 1.6k 3.3× 543 1.5× 180 0.7× 342 3.6k
Hyunchul Park South Korea 27 637 0.4× 347 0.5× 382 0.8× 524 1.4× 153 0.6× 91 2.1k
André Zimmermann Germany 23 579 0.4× 683 1.0× 822 1.6× 516 1.4× 140 0.5× 175 2.1k
Vincenzo Tucci Italy 31 642 0.5× 440 0.6× 1.2k 2.4× 761 2.1× 269 1.0× 143 2.6k

Countries citing papers authored by Wenhui Zhu

Since Specialization
Citations

This map shows the geographic impact of Wenhui Zhu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wenhui Zhu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wenhui Zhu more than expected).

Fields of papers citing papers by Wenhui Zhu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Wenhui Zhu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wenhui Zhu. The network helps show where Wenhui Zhu may publish in the future.

Co-authorship network of co-authors of Wenhui Zhu

This figure shows the co-authorship network connecting the top 25 collaborators of Wenhui Zhu. A scholar is included among the top collaborators of Wenhui Zhu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wenhui Zhu. Wenhui Zhu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hau, Liya, et al.. (2025). Dynamic tail risk connectedness among green REITs, sustainability products, and fossil energy assets under external shocks. Finance research letters. 75. 106864–106864. 4 indexed citations
2.
Zhu, Wenhui, et al.. (2025). HWDQT: A hybrid quantum machine learning method for ultra-short-term distributed photovoltaic power prediction. Computers & Electrical Engineering. 123. 110122–110122. 1 indexed citations
3.
Liu, Zhen, et al.. (2025). Effect of P on interfacial reaction and shear strength for FCBGA packaging with indium thermal interface materials under isothermal aging. Journal of Materials Research and Technology. 36. 6113–6127.
4.
5.
Hu, Fan, et al.. (2024). High-Quality 4H-SiC Homogeneous Epitaxy via Homemade Horizontal Hot-Wall Reactor. Coatings. 14(7). 911–911.
6.
Zhu, Wenhui, et al.. (2024). Degradation Mechanisms of SiC MOSFET Power Module With Cu–Cu Die Top Interconnects Under Power Cycling Stress. IEEE Journal of Emerging and Selected Topics in Power Electronics. 12(4). 3629–3636. 1 indexed citations
7.
8.
Zhu, Wenhui, et al.. (2023). Language-dependent cue weighting in distinctive feature: evidence from the perception of Mandarin high vowels by native English speakers. Asian-Pacific Journal of Second and Foreign Language Education. 8(1).
9.
Zhu, Wenhui, et al.. (2023). Competitive Failures Decoupling and Mechanisms Analysis of SiC MOSFET Module Under Power Cycling Stress. IEEE Journal of Emerging and Selected Topics in Power Electronics. 11(6). 5877–5888. 8 indexed citations
10.
11.
Zhu, Wenhui, et al.. (2022). Investigation of Vehicle-Oriented Double-Sided Cooling Power Module With BGA Technology. IEEE Journal of Emerging and Selected Topics in Power Electronics. 10(5). 6171–6179. 8 indexed citations
12.
Zhu, Wenhui, et al.. (2021). A Novel Approach to Evaluate and Predict the Impact of Randomly Distributed Voids on Junction Temperature for Power Modules. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(1). 42–50. 4 indexed citations
13.
Liu, Zhen, et al.. (2021). Numerical and Experimental Analyses of Component Failure Risk in a Mobile Phone Under Drop Test. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(1). 69–79. 4 indexed citations
14.
Zhang, Lei, et al.. (2021). 3D-MSM AlN Deep Ultraviolet Detector. IEEE Journal of Quantum Electronics. 57(3). 1–7. 8 indexed citations
15.
Zhang, Lei, et al.. (2020). Flexible and thermally stable resistive switching memory in a Ta/TaO x /stainless steel structure. Semiconductor Science and Technology. 35(11). 115021–115021. 5 indexed citations
16.
Zhu, Wenhui, et al.. (2020). Influence of Ag Layer on Microstructural Evolution and Joining Properties With Zn Foil for Power Electronics. IEEE Transactions on Components Packaging and Manufacturing Technology. 10(8). 1266–1275. 1 indexed citations
17.
Huang, Qiang, et al.. (2020). A Finite Element Analysis on the Reliability of Heavy Bonding Wire for High-Power IGBT Module. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(2). 212–221. 25 indexed citations
18.
Li, Junhui, Zhihui Liu, Zhan Liu, et al.. (2018). Electromechanical characteristics and numerical simulation of a new smaller magnetorheological fluid damper. Mechanics Research Communications. 92. 81–86. 10 indexed citations
19.
Zheng, Guangping, Lei Shi, Junhui Li, et al.. (2018). High-performance ultra-low-k fluorine-doped nanoporous organosilica films for inter-layer dielectric. Journal of Materials Science. 54(3). 2379–2391. 23 indexed citations
20.
Wang, Fuliang, et al.. (2017). Ultrasonic-Assisted Sintering of Silver Nanoparticles for Flexible Electronics. The Journal of Physical Chemistry C. 121(51). 28515–28519. 27 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026