Anthony Primavera
- Electrical and Electronic Engineering
- Mechanical Engineering top 10%
- Mechanics of Materials
- Aerospace Engineering
- Control and Systems Engineering
- Co-authors
- James M. PitarresiK. SrihariRichard CoyleM. A. YunusE. J. CottsG.R. WestbyA. ZribiL. Zavalij
- Topics
- Electronic Packaging and Soldering Technologies (14 papers)3D IC and TSV technologies (10 papers)Integrated Circuits and Semiconductor Failure Analysis (4 papers)
- Journals
- The International Journal of Advanced Manufacturing TechnologyMicroelectronics ReliabilityIEEE Transactions on Components and Packaging Technologies
- Partner nations
- United States
In The Last Decade
Anthony Primavera
13 papers receiving 308 citations
Peers
Comparison fields: 5 of 32
- Electrical and Electronic Engineering 291
- Mechanical Engineering 171
- Mechanics of Materials 62
- Aerospace Engineering 31
- Control and Systems Engineering 22
Countries citing papers authored by Anthony Primavera
This map shows the geographic impact of Anthony Primavera's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Anthony Primavera with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Anthony Primavera more than expected).
Fields of papers citing papers by Anthony Primavera
This network shows the impact of papers produced by Anthony Primavera. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Anthony Primavera. The network helps show where Anthony Primavera may publish in the future.
Co-authorship network of co-authors of Anthony Primavera
This figure shows the co-authorship network connecting the top 25 collaborators of Anthony Primavera. A scholar is included among the top collaborators of Anthony Primavera based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Anthony Primavera. Anthony Primavera is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 6 | |
| 2 | 4 | |
| 3 | 5 | |
| 4 | 122 | |
| 5 | 38 | |
| 6 | 7 | |
| 7 | 13 | |
| 8 | 33 | |
| 9 | Assembly and reliability of a wafer level CSP | 2 |
| 10 | 49 | |
| 11 | 9 | |
| 12 | 1 | |
| 13 | 1 | |
| 14 | 43 |
About Anthony Primavera
Anthony Primavera is a scholar working on General Materials Science, Electrical and Electronic Engineering and Mechanical Engineering, having authored 14 papers that have together received 333 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (10 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (291 citations), Mechanical Engineering (171 citations) and General Materials Science (14 citations). Anthony Primavera has collaborated with scholars based in United States. Frequent co-authors include James M. Pitarresi, K. Srihari, Richard Coyle, M. A. Yunus, E. J. Cotts, G.R. Westby, A. Zribi, L. Zavalij, Richard R. Chromik and Nathan Gnanasambandam. Their work appears in journals such as The International Journal of Advanced Manufacturing Technology, Microelectronics Reliability and IEEE Transactions on Components and Packaging Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.