E. Pek

785 total citations
9 papers, 640 citations indexed

About

E. Pek is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Infectious Diseases. According to data from OpenAlex, E. Pek has authored 9 papers receiving a total of 640 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 2 papers in Mechanics of Materials and 0 papers in Infectious Diseases. Recurrent topics in E. Pek's work include Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (9 papers) and Electrostatic Discharge in Electronics (7 papers). E. Pek is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (9 papers) and Electrostatic Discharge in Electronics (7 papers). E. Pek collaborates with scholars based in Singapore, Switzerland and United States. E. Pek's co-authors include Tong Yan Tee, Chwee Teck Lim, Z.W. Zhong, Jing-en Luan, Hun Shen Ng, Jiang Zhou and V.B.C. Tan and has published in prestigious journals such as Microelectronics Reliability and IEEE Transactions on Components and Packaging Technologies.

In The Last Decade

E. Pek

9 papers receiving 590 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
E. Pek Singapore	7	602	229	97	45	39	9	640
Jing-en Luan Singapore	14	721 1.2×	272 1.2×	179 1.8×	60 1.3×	44 1.1×	46	799
Hun Shen Ng Singapore	13	607 1.0×	165 0.7×	116 1.2×	35 0.8×	17 0.4×	26	630
Nokibul Islam United States	12	349 0.6×	73 0.3×	81 0.8×	34 0.8×	85 2.2×	31	405
Yi-Hsin Pao United States	10	594 1.0×	244 1.1×	315 3.2×	41 0.9×	30 0.8×	18	679
Sueo KAWAI Japan	10	318 0.5×	281 1.2×	174 1.8×	51 1.1×	44 1.1×	40	474
Sandeep Shantaram United States	13	423 0.7×	138 0.6×	159 1.6×	53 1.2×	66 1.7×	29	465
Jiefeng Xu United States	14	328 0.5×	81 0.4×	117 1.2×	27 0.6×	18 0.5×	24	382
Karsten Meier Germany	9	297 0.5×	83 0.4×	132 1.4×	34 0.8×	17 0.4×	96	328
Anthony Primavera United States	8	291 0.5×	62 0.3×	171 1.8×	12 0.3×	20 0.5×	14	333
Vadim Gektin United States	9	211 0.4×	59 0.3×	230 2.4×	72 1.6×	22 0.6×	28	413

Countries citing papers authored by E. Pek

Since Specialization

Citations

This map shows the geographic impact of E. Pek's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Pek with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Pek more than expected).

Fields of papers citing papers by E. Pek

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by E. Pek. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Pek. The network helps show where E. Pek may publish in the future.

Co-authorship network of co-authors of E. Pek

This figure shows the co-authorship network connecting the top 25 collaborators of E. Pek. A scholar is included among the top collaborators of E. Pek based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with E. Pek. E. Pek is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

9 of 9 papers shown

1.

Luan, Jing-en, Tong Yan Tee, E. Pek, Chwee Teck Lim, & Z.W. Zhong. (2007). Dynamic responses and solder joint reliability under board level drop test. Microelectronics Reliability. 47(2-3). 450–460. 33 indexed citations

2.

Tee, Tong Yan, et al.. (2006). Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact. IEEE Transactions on Components and Packaging Technologies. 29(3). 449–456. 59 indexed citations

3.

Lim, Chwee Teck, et al.. (2006). Study of PCB Strains and Component Position Under Board Level Drop Test. 1. 248–254. 4 indexed citations

4.

Pek, E., Chwee Teck Lim, Tong Yan Tee, Jing-en Luan, & V.B.C. Tan. (2006). Investigating the Cyclic Bending of PCB Subassembly During Board Level Drop Test. 1. 276–282. 5 indexed citations

5.

Tee, Tong Yan, Hun Shen Ng, Chwee Teck Lim, E. Pek, & Z.W. Zhong. (2004). Board level drop test and simulation of TFBGA packages for telecommunication applications. 121–129. 98 indexed citations

6.

Tee, Tong Yan, Hun Shen Ng, Chwee Teck Lim, E. Pek, & Z.W. Zhong. (2004). Impact life prediction modeling of TFBGA packages under board level drop test. Microelectronics Reliability. 44(7). 1131–1142. 162 indexed citations

7.

Luan, Jing-en, Tong Yan Tee, E. Pek, Chwee Teck Lim, & Z.W. Zhong. (2004). Modal analysis and dynamic responses of board level drop test. 233–243. 79 indexed citations

8.

Tee, Tong Yan, Jing-en Luan, E. Pek, Chwee Teck Lim, & Z.W. Zhong. (2004). Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact. 1088–1094. 130 indexed citations

9.

Tee, Tong Yan, Jing-en Luan, E. Pek, Chwee Teck Lim, & Z.W. Zhong. (2004). Novel numerical and experimental analysis of dynamic responses under board level drop test. 133–140. 70 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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