Timwah Luk

583 citations

43 papers · 399 indexed · h-index 10

Impact in

Electrical and Electronic Engineering top 10%
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Silicon Carbide Semiconductor Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electrostatic Discharge in Electronics
Electronic, Optical and Magnetic Materials
- Copper Interconnects and Reliability

Papers in

Electrical and Electronic Engineering 40
- Electronic Packaging and Soldering Technologies 32
- 3D IC and TSV technologies 17
- Electromagnetic Compatibility and Noise Suppression 7
- Silicon Carbide Semiconductor Technologies 5
- Semiconductor materials and devices 5
- Integrated Circuits and Semiconductor Failure Analysis 4
Electronic, Optical and Magnetic Materials 9
- Copper Interconnects and Reliability 9

Co-authors: Scott IrvingYong LiuLihua LiangFeng ZhangDan Kinzer Qiang Wang Yuanzhong Zhou Zhigang Suo
Journals: IEEE Transactions on Electronics Packaging Manufacturing (3 papers)Microelectronics Reliability (1 paper)Solid-State Electronics (1 paper)TechConnect Briefs (1 paper)
Partner nations: United States China

In The Last Decade

Timwah Luk

40 papers receiving 375 citations

Peers

Countries citing papers authored by Timwah Luk

Since Specialization

Citations

This map shows the geographic impact of Timwah Luk's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Timwah Luk with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Timwah Luk more than expected).

Fields of papers citing papers by Timwah Luk

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Timwah Luk. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Timwah Luk. The network helps show where Timwah Luk may publish in the future.

Co-authorship network

The 25 scholars most cited alongside Timwah Luk, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Timwah Luk Line = papers co-authored together Timwah Luk links everyone, so they are left out of the graph.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

#	Work
1	Parameter Modeling for Wafer Probe Test IEEE Transactions on Electronics Packaging Manufacturing ·Yong Liu, Timwah Luk, Scott Irving	2009	10
2	Investigation of BPSG profile and FAB size Cu stud bumping process by modeling and experiment Yumin Liu, Yong Liu, Scott Irving, Timwah Luk, M. A. Silva	2008	5
3	Impact of wedge wire bonding and thermal mechanical stress on reliability of BPSG/poly layer of a silicon die Yong Liu, Scott Irving, Timwah Luk, H. Besserdich, A. Monari	2008	2
4	Identification and verification by experiment and simulation for the possibility of die cracking induces by UIL test Paul Spurgeon Lewis, Y.-W. Lui, Scott Irving, Timwah Luk	2008	1
5	Influence of heat sink mounting procedure on package reliability Paul Spurgeon Lewis, Yong Liu, Timwah Luk, Scott Irving	2008	1
6	Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis IEEE Transactions on Electronics Packaging Manufacturing ·Yong Liu, Scott Irving, Timwah Luk	2008	50
7	Electromigration Time to Failure Simulation for Solder Bumps of a Chip Scale Package M Pigois, Lihua Liang, Yuanxiang Zhang, Yong Liu, Scott Irving, Timwah Luk	2007	3
8	Solder Joint Reliability under Electromigration and Thermal-Mechanical Load M Pigois, Lihua Liang, Yong Liu, Scott Irving, Timwah Luk	2007	8
9	Analysis of the Impact of Polyimide Coating on Passivation Reliability by Simulation A. Monari, Yong Liu, Scott Irving, Timwah Luk	2007	4
10	Thermal Numerical Simulation and Correlation for a Power Package Paul Spurgeon Lewis, Yong Liu, Scott Irving, Timwah Luk, José Rubens Moraes Júnior	2007	2
11	Wafer Probing Simulation for Copper Bond Pad Based BPOA Structure Yumin Liu, Yong Liu, Scott Irving, Timwah Luk	2007	0
12	Highly Efficient Modeling Automation for Electronic Package Thermal Analysis Yuanxiang Zhang, Lihua Liang, Clara Fenger, Yong Liu, Scott Irving, Timwah Luk	2007	3
13	Methodology for Avoidance of Ratcheting-Induced Stable Cracking (RISC) in Microelectronic Devices Zhen Zhang, Zhigang Suo, C. L. Waring, Scott Irving, Timwah Luk, T Takanashi	2006	14
14	Modeling Snapback and Rise-time Effects in TLP Testing for ESD MOS Devices using BSIM3 and VBIC Models TechConnect Briefs ·B. M. Nail, A. J. Lees, Timwah Luk, Yangyi Zhou	2005	3
15	Impact of the die attach process on power & thermal cycling for a discrete style semiconductor package Yong Liu, Scott Irving, T Takanashi, Timwah Luk	2005	17
16	Probe test failure analysis of bond pad over active structure by modeling and experiment Yong Liu, T Takanashi, Scott Irving, Timwah Luk, Farrux Ravshanov, Н. В. Громова, Xie Xiu	2005	6
17	Parameter optimization for wafer probe using simulation Yong Liu, T Takanashi, Timwah Luk, Scott Irving	2005	6
18	Thermosonic wire bonding process simulation and bond pad over active stress analysis Yong Liu, Scott Irving, Timwah Luk	2004	19
19	Characterization of electrical packages via simulation and measurement Timwah Luk, Dominik Erhart	2002	0
20	Two-dimensional transient analysis of a buried-channel charge-coupled device Solid-State Electronics ·Saúl De Jesús Molina-Domínguez, Timwah Luk	1984	2

About Timwah Luk

Timwah Luk is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering, Industrial and Manufacturing Engineering and Mechanics of Materials, having authored 43 papers that have together received 399 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (32 papers), 3D IC and TSV technologies (17 papers), Copper Interconnects and Reliability (9 papers), Electromagnetic Compatibility and Noise Suppression (7 papers), Silicon Carbide Semiconductor Technologies (5 papers), Semiconductor materials and devices (5 papers), Heat Transfer and Optimization (4 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (352 citations), Electronic, Optical and Magnetic Materials (72 citations), Mechanics of Materials (76 citations), Industrial and Manufacturing Engineering (30 citations) and Mechanical Engineering (100 citations). Timwah Luk has collaborated with scholars based in United States and China. Frequent co-authors include Scott Irving, Yong Liu, Lihua Liang, Yong Liu, Yong Liu, Feng Zhang, Dan Kinzer, Qiang Wang, Yuanzhong Zhou and Yong Liu. Their work appears in journals such as IEEE Transactions on Electronics Packaging Manufacturing, Microelectronics Reliability, Solid-State Electronics and TechConnect Briefs.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact