Xavier Baraton

502 total citations
24 papers, 396 citations indexed

About

Xavier Baraton is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Hardware and Architecture. According to data from OpenAlex, Xavier Baraton has authored 24 papers receiving a total of 396 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Electrical and Electronic Engineering, 4 papers in Mechanics of Materials and 3 papers in Hardware and Architecture. Recurrent topics in Xavier Baraton's work include Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (21 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers). Xavier Baraton is often cited by papers focused on Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (21 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers). Xavier Baraton collaborates with scholars based in Singapore, Switzerland and Germany. Xavier Baraton's co-authors include Jing-en Luan, Tong Yan Tee, D. Yap, Z.W. Zhong, Hun Shen Ng, Guojun Hu, Seung Wook Yoon, Pandi C. Marimuthu, Andreas Bahr and Yonggang Jin and has published in prestigious journals such as Microelectronics Reliability, National University of Singapore and European Microelectronics and Packaging Conference.

In The Last Decade

Xavier Baraton

22 papers receiving 347 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Xavier Baraton Singapore 12 371 95 95 28 18 24 396
Hun Shen Ng Singapore 13 607 1.6× 165 1.7× 116 1.2× 21 0.8× 16 0.9× 26 630
Timwah Luk United States 10 352 0.9× 76 0.8× 100 1.1× 72 2.6× 36 2.0× 43 399
Jiefeng Xu United States 14 328 0.9× 81 0.9× 117 1.2× 32 1.1× 36 2.0× 24 382
Ahmer Syed United States 13 401 1.1× 47 0.5× 153 1.6× 50 1.8× 15 0.8× 36 422
C. S. Hsiao Taiwan 11 288 0.8× 26 0.3× 65 0.7× 16 0.6× 26 1.4× 51 316
E Perfecto United States 10 222 0.6× 18 0.2× 60 0.6× 27 1.0× 20 1.1× 48 257
Karsten Meier Germany 9 297 0.8× 83 0.9× 132 1.4× 8 0.3× 33 1.8× 96 328
Jong‐Kai Lin United States 12 381 1.0× 36 0.4× 187 2.0× 35 1.3× 21 1.2× 33 394
Anthony Primavera United States 8 291 0.8× 62 0.7× 171 1.8× 9 0.3× 8 0.4× 14 333
Jie Xue United States 9 284 0.8× 20 0.2× 84 0.9× 20 0.7× 24 1.3× 37 308

Countries citing papers authored by Xavier Baraton

Since Specialization
Citations

This map shows the geographic impact of Xavier Baraton's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xavier Baraton with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xavier Baraton more than expected).

Fields of papers citing papers by Xavier Baraton

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Xavier Baraton. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xavier Baraton. The network helps show where Xavier Baraton may publish in the future.

Co-authorship network of co-authors of Xavier Baraton

This figure shows the co-authorship network connecting the top 25 collaborators of Xavier Baraton. A scholar is included among the top collaborators of Xavier Baraton based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Xavier Baraton. Xavier Baraton is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Yoon, Seung Wook, et al.. (2012). Next Generation eWLB (Embedded Wafer Level BGA): Advanced 3D SiP Packaging Solution. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2012(DPC). 1507–1526. 1 indexed citations
2.
Jin, Yonggang, et al.. (2012). Development of advanced fan-out wafer level package (embedded Wafer Level BGA) packaging. 17. 151–156. 4 indexed citations
3.
Jin, Yonggang, et al.. (2012). Development and characterization of next generation eWLB (embedded Wafer Level BGA) packaging. 1388–1393. 6 indexed citations
4.
Yoon, Seung Wook, Yaojian Lin, Yonggang Jin, et al.. (2011). Mechanical characterization of next generation eWLB (embedded wafer level BGA) packaging. 441–446. 23 indexed citations
5.
Jin, Yonggang, et al.. (2011). Advanced packaging solutions of next generation eWLB technology. 739–743. 4 indexed citations
6.
Jin, Yonggang, Xavier Baraton, Seung Wook Yoon, et al.. (2010). Next generation eWLB (embedded wafer level BGA) packaging. 520–526. 56 indexed citations
7.
Hu, Guojun, Roberto Rossi, Jing-en Luan, & Xavier Baraton. (2010). Interface delamination analysis of TQFP package during solder reflow. Microelectronics Reliability. 50(7). 1014–1020. 18 indexed citations
8.
Hu, Guojun, et al.. (2009). Thermoelastic properties of printed circuit boards: Effect of copper trace. European Microelectronics and Packaging Conference. 1–6. 11 indexed citations
9.
Luan, Jing-en, et al.. (2009). Challenges for extra large embedded wafer level ball grid array development. 202–207. 12 indexed citations
10.
Hu, Guojun, Jing-en Luan, Xavier Baraton, & A.A.O. Tay. (2009). Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics?. National University of Singapore. 19. 584–590. 8 indexed citations
11.
Xing, Fa, et al.. (2009). Drop impact life model development for FBGA assembly with lead-free solder joint. 656–662. 4 indexed citations
12.
Yoon, Seung Wook, et al.. (2009). 3D eWLB (embedded wafer level BGA) technology for 3D-packaging/3D-SiP (Systems-in-Package) applications. 23. 915–919. 22 indexed citations
13.
Lenzi, M., et al.. (2009). Numerical and experimental investigation of board level reliability of TEFCBGA. 600–606. 1 indexed citations
14.
Luan, Jing-en, et al.. (2008). A novel methodology for virtual qualification of IC packages under board level drop test. 1212–1217. 5 indexed citations
15.
Xing, Fa, Jing-en Luan, D. Yap, K.L. Goh, & Xavier Baraton. (2008). Thermal cycling fatigue model development for FBGA assembly with Sn-Ag-based lead-free solder. 1–6. 9 indexed citations
16.
17.
Hu, Guojun, Jing-en Luan, & Xavier Baraton. (2008). Characterization of silicon die strength with application to die crack analysis. 1–7. 12 indexed citations
18.
Luan, Jing-en, et al.. (2005). Drop impact life prediction model for lead-free BGA packages and modules. 559–565. 33 indexed citations
19.
Tee, Tong Yan, et al.. (2003). Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. Microelectronics Reliability. 43(5). 741–749. 39 indexed citations
20.
Baraton, Xavier, et al.. (2002). Thermal fatigue of solder flip-chip assemblies. 872–877. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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