R. D. Bond

787 total citations
9 papers, 575 citations indexed

About

R. D. Bond is a scholar working on Electrical and Electronic Engineering, Civil and Structural Engineering and Mechanical Engineering. According to data from OpenAlex, R. D. Bond has authored 9 papers receiving a total of 575 indexed citations (citations by other indexed papers that have themselves been cited), including 3 papers in Electrical and Electronic Engineering, 2 papers in Civil and Structural Engineering and 2 papers in Mechanical Engineering. Recurrent topics in R. D. Bond's work include 3D IC and TSV technologies (3 papers), Electronic Packaging and Soldering Technologies (2 papers) and Fire effects on ecosystems (2 papers). R. D. Bond is often cited by papers focused on 3D IC and TSV technologies (3 papers), Electronic Packaging and Soldering Technologies (2 papers) and Fire effects on ecosystems (2 papers). R. D. Bond collaborates with scholars based in United States and Singapore. R. D. Bond's co-authors include W. W. Emerson, D. M. Van Doren, A.R. Dexter, L. C. Hammond, Claudio Maria Villa, Z.W. Zhong, Howard Jay Siegel, Tong Yan Tee, Hun Shen Ng and Richard Coyle and has published in prestigious journals such as Soil Science and Australian Journal of Soil Research.

In The Last Decade

R. D. Bond

9 papers receiving 470 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
R. D. Bond United States	6	213	178	166	100	70	9	575
N. Holowaychuk United States	13	185 0.9×	100 0.6×	115 0.7×	109 1.1×	90 1.3×	25	537
K. H. Hartge Germany	12	391 1.8×	166 0.9×	445 2.7×	52 0.5×	50 0.7×	58	839
O.H. Boersma Netherlands	9	272 1.3×	216 1.2×	419 2.5×	96 1.0×	25 0.4×	11	765
J. B. WILLIAMS United Kingdom	14	283 1.3×	111 0.6×	332 2.0×	50 0.5×	36 0.5×	18	683
J. C. Baker United States	14	183 0.9×	58 0.3×	136 0.8×	105 1.1×	92 1.3×	36	744
Henryk Czachor Poland	12	155 0.7×	164 0.9×	183 1.1×	59 0.6×	36 0.5×	24	509
Achim Ellies Chile	11	198 0.9×	253 1.4×	168 1.0×	84 0.8×	33 0.5×	42	613
M. De Boodt Belgium	14	703 3.3×	77 0.4×	115 0.7×	202 2.0×	33 0.5×	60	1.1k
C. D. Arbelo Spain	15	364 1.7×	100 0.6×	63 0.4×	183 1.8×	56 0.8×	40	612
W. H. McKee United States	15	213 1.0×	205 1.2×	143 0.9×	202 2.0×	17 0.2×	42	822

Countries citing papers authored by R. D. Bond

Since Specialization

Citations

This map shows the geographic impact of R. D. Bond's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R. D. Bond with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R. D. Bond more than expected).

Fields of papers citing papers by R. D. Bond

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by R. D. Bond. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R. D. Bond. The network helps show where R. D. Bond may publish in the future.

Co-authorship network of co-authors of R. D. Bond

This figure shows the co-authorship network connecting the top 25 collaborators of R. D. Bond. A scholar is included among the top collaborators of R. D. Bond based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with R. D. Bond. R. D. Bond is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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9 of 9 papers shown

1.

Tee, Tong Yan, Hun Shen Ng, Howard Jay Siegel, R. D. Bond, & Z.W. Zhong. (2005). Design analysis of touch chip for enhanced package and board level reliability. 743–747. 3 indexed citations

2.

Villa, Claudio Maria, et al.. (2002). Thermal study for flip chip on FR-4 boards. 10 2. 879–884. 8 indexed citations

3.

Coyle, Richard, et al.. (2002). Solder joint attachment reliability and assembly quality of a molded ball grid array socket. 2. 1219–1226. 4 indexed citations

4.

Emerson, W. W., R. D. Bond, A.R. Dexter, & D. M. Van Doren. (1978). Modification of Soil Structure. Soil Science. 126(5). 316–316. 255 indexed citations

5.

Bond, R. D. & L. C. Hammond. (1970). Effect of surface roughness and pore shape on water repellence of sandy soils.. 30. 308–315. 10 indexed citations

6.

Bond, R. D., et al.. (1964). The influence of the microflora on the physical properties of soils. I. Effects associated with filamentous algae and fungi. Australian Journal of Soil Research. 2(1). 111–122. 166 indexed citations

7.

Bond, R. D.. (1964). The influence of the microflora on the physical properties of soils. II. Field studies on water repellent sands. Australian Journal of Soil Research. 2(1). 123–131. 90 indexed citations

8.

Emerson, W. W. & R. D. Bond. (1963). The rate of water entry into dry sand and calculation of the advancing contact angle. Australian Journal of Soil Research. 1(1). 9–16. 34 indexed citations

9.

Bond, R. D.. (1960). The occurrence of microbial filaments in soils and their effect on some soil properties.. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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