Karsten Meier

427 total citations
96 papers, 328 citations indexed

About

Karsten Meier is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Karsten Meier has authored 96 papers receiving a total of 328 indexed citations (citations by other indexed papers that have themselves been cited), including 93 papers in Electrical and Electronic Engineering, 35 papers in Mechanical Engineering and 19 papers in Mechanics of Materials. Recurrent topics in Karsten Meier's work include Electronic Packaging and Soldering Technologies (83 papers), 3D IC and TSV technologies (48 papers) and Integrated Circuits and Semiconductor Failure Analysis (12 papers). Karsten Meier is often cited by papers focused on Electronic Packaging and Soldering Technologies (83 papers), 3D IC and TSV technologies (48 papers) and Integrated Circuits and Semiconductor Failure Analysis (12 papers). Karsten Meier collaborates with scholars based in Germany, United States and Belgium. Karsten Meier's co-authors include M. Roellig, Karlheinz Bock, Steffen Wiese, Klaus-Juergen Wolter, Andreas Schießl, K.-J. Wolter, Abhijit Dasgupta, David Leslie, Frank Alexander Kraemer and Klaus‐Jürgen Wolter and has published in prestigious journals such as IEEE Transactions on Electron Devices, Microelectronics Reliability and IEEE Transactions on Device and Materials Reliability.

In The Last Decade

Karsten Meier

83 papers receiving 318 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Karsten Meier Germany 9 297 132 83 35 34 96 328
R. Venkatesan India 9 87 0.3× 200 1.5× 96 1.2× 28 0.8× 76 2.2× 24 262
Scott Irving United States 11 423 1.4× 132 1.0× 122 1.5× 18 0.5× 29 0.9× 51 476
Young-Eui Shin South Korea 10 329 1.1× 222 1.7× 60 0.7× 59 1.7× 15 0.4× 44 386
Awni Qasaimeh United States 11 319 1.1× 178 1.3× 98 1.2× 78 2.2× 50 1.5× 19 352
Ahmer Syed United States 13 401 1.4× 153 1.2× 47 0.6× 51 1.5× 13 0.4× 36 422
Saroj Kumar Sarangi India 10 121 0.4× 258 2.0× 105 1.3× 35 1.0× 104 3.1× 17 295
Joshua Major United States 12 227 0.8× 120 0.9× 27 0.3× 11 0.3× 63 1.9× 29 317
Masazumi Amagai United States 9 508 1.7× 315 2.4× 147 1.8× 72 2.1× 35 1.0× 29 549
Thomas A. Siewert United States 7 167 0.6× 142 1.1× 55 0.7× 26 0.7× 38 1.1× 26 283
Tsung‐Yu Pan United States 12 229 0.8× 389 2.9× 102 1.2× 105 3.0× 52 1.5× 35 518

Countries citing papers authored by Karsten Meier

Since Specialization
Citations

This map shows the geographic impact of Karsten Meier's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Karsten Meier with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Karsten Meier more than expected).

Fields of papers citing papers by Karsten Meier

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Karsten Meier. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Karsten Meier. The network helps show where Karsten Meier may publish in the future.

Co-authorship network of co-authors of Karsten Meier

This figure shows the co-authorship network connecting the top 25 collaborators of Karsten Meier. A scholar is included among the top collaborators of Karsten Meier based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Karsten Meier. Karsten Meier is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Geisler, H., et al.. (2025). Study on Effect of Microstructure Evolution on Wafer Warpage for High-Temperature Annealed and Self-Annealed Copper Thin Films. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(3). 576–590.
2.
Meier, Karsten, et al.. (2025). Characterization and Modeling of Solder Interconnects for Wafer Level Packaging Applications Subjected to Low Cycle Fatigue Stress. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(11). 2417–2428.
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Meier, Karsten, et al.. (2023). Feasibility Investigation of Machine Learning for Electronic Reliability Analysis using FEA. 1181–1186. 4 indexed citations
9.
Roellig, M., et al.. (2023). FEM Modelling of Ag-Sinter Joints with Respect of Porosity and Sinter Pressure. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–8. 1 indexed citations
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Roellig, M., et al.. (2020). FEM-study for Solder Model Comparison on Solder Joints Stress-Strain Effects. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 3 indexed citations
13.
Jarman, Paul, et al.. (2020). Stress-Induced Transistor Degradation Studied by an Indentation Approach. IEEE Transactions on Device and Materials Reliability. 21(1). 9–16. 4 indexed citations
14.
Meier, Karsten, Jan Meyer, Friedrich‐Leonhard Schein, et al.. (2019). Reliability of Substrate Embedded Rectifiers for High Voltage Applications. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 276–281. 1 indexed citations
15.
Meier, Karsten, M. Roellig, Andreas Schießl, & Klaus-Juergen Wolter. (2014). Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loading. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–7. 16 indexed citations
16.
Meier, Karsten, et al.. (2013). Lifetime assessment for bipolar components under vibration and temperature loading. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–7. 7 indexed citations
17.
Roellig, M., et al.. (2010). Characterization methods for determination of temperature depended electrical, thermal, mechanical and fatigue properties of SnAg3.5 solder. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 13. 1–11. 11 indexed citations
18.
Meier, Karsten, M. Roellig, Steffen Wiese, & K.-J. Wolter. (2010). Characterisation of the mechanical behaviour of SAC solder at high strain rates. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–6. 3 indexed citations
19.
Meier, Karsten, M. Roellig, Steffen Wiese, & K.-J. Wolter. (2009). Combining experimental and simulation methods for the mechanical characterisation of lead free solder alloys under high strain rate loads. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 48. 1–7. 4 indexed citations
20.
Wiese, Steffen, et al.. (2007). Creep Measurements of 200 μm - 400 μm Solder Joints. 1–9. 13 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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