Jiefeng Xu
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering
- Mechanics of Materials
- Industrial and Manufacturing Engineering top 10%
- Biomedical Engineering
- Co-authors
- Seungbae ParkHuayan WangKe PanYangyang LaiJing WangStephen R. CainScott PollardGamal Refai-Ahmed
- Topics
- Electronic Packaging and Soldering Technologies (20 papers)3D IC and TSV technologies (17 papers)Copper Interconnects and Reliability (6 papers)
- Cited by
- Electrical and Electronic EngineeringIndustrial and Manufacturing EngineeringMechanics of Materials
- Journals
- IEEE Transactions on Power ElectronicsMicroelectronics ReliabilityIEEE Transactions on Components Packaging and Manufacturing Technology
- Partner nations
- United StatesChina
In The Last Decade
Jiefeng Xu
24 papers receiving 373 citations
Peers
Comparison fields: 5 of 30
- Electrical and Electronic Engineering 328
- Mechanical Engineering 117
- Mechanics of Materials 81
- Industrial and Manufacturing Engineering 49
- Biomedical Engineering 36
Countries citing papers authored by Jiefeng Xu
This map shows the geographic impact of Jiefeng Xu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jiefeng Xu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jiefeng Xu more than expected).
Fields of papers citing papers by Jiefeng Xu
This network shows the impact of papers produced by Jiefeng Xu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jiefeng Xu. The network helps show where Jiefeng Xu may publish in the future.
Co-authorship network of co-authors of Jiefeng Xu
This figure shows the co-authorship network connecting the top 25 collaborators of Jiefeng Xu. A scholar is included among the top collaborators of Jiefeng Xu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jiefeng Xu. Jiefeng Xu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 1 | |
| 3 | 11 | |
| 4 | 17 | |
| 5 | 8 | |
| 6 | 17 | |
| 7 | 22 | |
| 8 | 20 | |
| 9 | 25 | |
| 10 | 18 | |
| 11 | 22 | |
| 12 | 22 | |
| 13 | 13 | |
| 14 | 6 | |
| 15 | 5 | |
| 16 | 7 | |
| 17 | 9 | |
| 18 | 20 | |
| 19 | 17 | |
| 20 | 11 |
About Jiefeng Xu
Jiefeng Xu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials, having authored 24 papers that have together received 382 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (17 papers) and Copper Interconnects and Reliability (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (328 citations), Industrial and Manufacturing Engineering (49 citations) and Mechanics of Materials (81 citations). Jiefeng Xu has collaborated with scholars based in United States and China. Frequent co-authors include Seungbae Park, Huayan Wang, Ke Pan, Yangyang Lai, Jing Wang, Stephen R. Cain, Scott Pollard, Gamal Refai-Ahmed, Chukwudi Okoro and Yuling Niu. Their work appears in journals such as IEEE Transactions on Power Electronics, Microelectronics Reliability and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.