R. Tilgner
- Mechanics of Materials top 5%
- Electrical and Electronic Engineering
- Biomedical Engineering
- Mechanical Engineering
- Aerospace Engineering
- Topics
- Electronic Packaging and Soldering Technologies (16 papers)3D IC and TSV technologies (12 papers)Thermography and Photoacoustic Techniques (12 papers)
- Journals
- Journal of Applied PhysicsSAE technical papers on CD-ROM/SAE technical paper seriesPolymer Testing
- Partner nations
- GermanySingaporeUnited Kingdom
In The Last Decade
R. Tilgner
39 papers receiving 403 citations
Peers
Comparison fields: 5 of 58
- Mechanics of Materials 259
- Electrical and Electronic Engineering 195
- Biomedical Engineering 119
- Mechanical Engineering 55
- Aerospace Engineering 52
Countries citing papers authored by R. Tilgner
This map shows the geographic impact of R. Tilgner's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R. Tilgner with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R. Tilgner more than expected).
Fields of papers citing papers by R. Tilgner
This network shows the impact of papers produced by R. Tilgner. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R. Tilgner. The network helps show where R. Tilgner may publish in the future.
Co-authorship network of co-authors of R. Tilgner
This figure shows the co-authorship network connecting the top 25 collaborators of R. Tilgner. A scholar is included among the top collaborators of R. Tilgner based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with R. Tilgner. R. Tilgner is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 4 | |
| 2 | 5 | |
| 3 | 19 | |
| 4 | 4 | |
| 5 | 2 | |
| 6 | 16 | |
| 7 | 11 | |
| 8 | 9 | |
| 9 | 13 | |
| 10 | 1 | |
| 11 | 2 | |
| 12 | 11 | |
| 13 | 10 | |
| 14 | 9 | |
| 15 | 39 | |
| 16 | 21 | |
| 17 | 33 | |
| 18 | 1 | |
| 19 | 6 | |
| 20 | 1 |
About R. Tilgner
R. Tilgner is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Development, having authored 40 papers that have together received 423 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (12 papers) and Thermography and Photoacoustic Techniques (12 papers). The work is most often cited by research in Mechanics of Materials (259 citations), Electrical and Electronic Engineering (195 citations) and Biomedical Engineering (119 citations). R. Tilgner has collaborated with scholars based in Germany, Singapore and United Kingdom. Frequent co-authors include P. Alpern, P. Korpiun, T. Baumann, R. Dudek, E. Lüscher, Hartmut Günther, M. Stecher, G. Fritsch, B. Michel and K. Müller. Their work appears in journals such as Journal of Applied Physics, SAE technical papers on CD-ROM/SAE technical paper series and Polymer Testing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.