Zhiwen Chen

1.1k total citations · 1 hit paper
67 papers, 828 citations indexed

About

Zhiwen Chen is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Zhiwen Chen has authored 67 papers receiving a total of 828 indexed citations (citations by other indexed papers that have themselves been cited), including 52 papers in Electrical and Electronic Engineering, 32 papers in Mechanical Engineering and 15 papers in Mechanics of Materials. Recurrent topics in Zhiwen Chen's work include Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (19 papers) and Aluminum Alloys Composites Properties (14 papers). Zhiwen Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (19 papers) and Aluminum Alloys Composites Properties (14 papers). Zhiwen Chen collaborates with scholars based in China, United Kingdom and Australia. Zhiwen Chen's co-authors include Sheng Liu, Xingtong Liu, Han Yan, Shengjun Zhou, Changqing Liu, Feifeng Wu, Yiping Wu, Bing An, Li Liu and Ching‐Ping Wong and has published in prestigious journals such as Nature Communications, Journal of Power Sources and Journal of Cleaner Production.

In The Last Decade

Zhiwen Chen

61 papers receiving 801 citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Spontaneous bifacial capping of perovskite film for efficient and mechanically stable flexible solar cell

2025 27 citations Junjun Jin, Zhenkun Zhu et al. Nature Communications profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Zhiwen Chen China	16	482	250	238	199	169	67	828
Yuan Gan China	12	200 0.4×	416 1.7×	244 1.0×	158 0.8×	194 1.1×	31	875
Zhisheng Wu China	13	306 0.6×	428 1.7×	302 1.3×	77 0.4×	113 0.7×	61	790
Vincent Bley France	15	378 0.8×	343 1.4×	194 0.8×	113 0.6×	69 0.4×	50	709
Jang‐Won Kang South Korea	21	587 1.2×	962 3.8×	247 1.0×	438 2.2×	195 1.2×	71	1.4k
Bingfeng Fan China	18	408 0.8×	316 1.3×	99 0.4×	118 0.6×	279 1.7×	69	834
Samuel Cruz United States	9	254 0.5×	438 1.8×	86 0.4×	151 0.8×	103 0.6×	12	717
Eunsung Lee South Korea	9	444 0.9×	714 2.9×	98 0.4×	140 0.7×	141 0.8×	18	978
Huaiyu Ye Netherlands	16	712 1.5×	566 2.3×	463 1.9×	66 0.3×	129 0.8×	46	1.4k
Allel Mokaddem Algeria	16	164 0.3×	423 1.7×	114 0.5×	444 2.2×	99 0.6×	101	817

Countries citing papers authored by Zhiwen Chen

Since Specialization

Citations

This map shows the geographic impact of Zhiwen Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Zhiwen Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Zhiwen Chen more than expected).

Fields of papers citing papers by Zhiwen Chen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Zhiwen Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Zhiwen Chen. The network helps show where Zhiwen Chen may publish in the future.

Co-authorship network of co-authors of Zhiwen Chen

This figure shows the co-authorship network connecting the top 25 collaborators of Zhiwen Chen. A scholar is included among the top collaborators of Zhiwen Chen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Zhiwen Chen. Zhiwen Chen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Jin, Junjun, Zhenkun Zhu, Yuan Zhou, et al.. (2025). Spontaneous bifacial capping of perovskite film for efficient and mechanically stable flexible solar cell. Nature Communications. 16(1). 90–90. 27 indexed citations breakdown →

Liu, Li, Qian Wang, Stuart Robertson, et al.. (2025). Study on sintering parameters and bonding mechanism of Cu@Ag preform via electromagnetic compaction for power electronics. Journal of Alloys and Compounds. 1030. 180842–180842.

Luo, Haoze, Wenbo Wang, Zhiwen Chen, et al.. (2025). Comparison of electro-thermal-mechanical stress in SiC MOSFETs under several short-circuit types. Microelectronics Reliability. 168. 115720–115720. 1 indexed citations

Liu, Li, Haojie Ma, Chuantong Chen, et al.. (2025). Decomposition and sintering behaviors of MOD-assisted Ag pastes for power electronics. Materials Today Communications. 45. 112265–112265.

Liu, Li, Bo Zhao, Zhen Wang, et al.. (2024). Tribological behaviors and mechanism of as-cast QT700-8 ductile iron with high strength and toughness. Tribology International. 198. 109942–109942. 3 indexed citations

Chen, Zhiwen, et al.. (2024). Large second-harmonic generation and linear electro-optic effect in the bulk kagome lattice compound Nb3MX7 (M=Se,S,Te; X=I,Br). Physical review. B.. 109(11). 3 indexed citations

Chen, Zhiwen, Zhiwen Chen, Ziwen Chen, et al.. (2024). Mechanical property of intermetallic compounds in Zn–Al solder interconnects by nanoindentation and first-principles calculations. Intermetallics. 172. 108387–108387. 2 indexed citations

Wang, Zhengzhi, et al.. (2024). Impacts of Pressure on the Stability of Chip Stack Structures in the Presence of Noncoplanar Cu Pillars. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(7). 1207–1214. 1 indexed citations

Zhang, Xiangyu, Yan Liu, Vasiliy Pelenovich, et al.. (2024). Self‐assembled high‐entropy nitride multilayer coating. Rare Metals. 43(6). 2876–2883. 5 indexed citations

10.

Pan, Da, Zhiqiang Tian, Zhiwen Chen, et al.. (2024). Investigation of Photosensitive Polyimide with Photolithography Process and Mechanical Behavior for Wafer-Level Packaging. 1–5. 1 indexed citations

11.

Liu, Li, et al.. (2023). Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by Finite Element Analysis. Micromachines. 14(3). 588–588. 8 indexed citations

12.

Liu, Zhenyu, et al.. (2023). Low-temperature joining of alumina ceramic and nickel by Al-Ni self-propagating nanofoil. Ceramics International. 49(22). 36103–36113. 3 indexed citations

13.

Liu, Li, Bo Zhao, Ziwen Chen, et al.. (2023). Effects of Gd doping on microwave absorption properties and mechanism for CaMnO3 perovskites. Ceramics International. 49(14). 23499–23509. 16 indexed citations

14.

Chen, Zhiwen, Fan Yang, Sheng Liu, et al.. (2022). Creep behavior of intermetallic compounds at elevated temperatures and its effect on fatigue life evaluation of Cu pillar bumps. Intermetallics. 144. 107526–107526. 6 indexed citations

15.

Liu, Li, et al.. (2022). Fabrication and microwave absorbing property of WO3@WC with a core-shell porous structure. Ceramics International. 48(18). 26575–26584. 17 indexed citations

16.

Chen, Zhiwen, Kun Ma, Li Liu, et al.. (2021). Mechanical Performance and Reliability of a Sn–Ag–Cu–Sb Alloy at Elevated Temperatures. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(7). 1081–1087. 8 indexed citations

17.

Feng, Zheng, Licheng Wang, Li Liu, et al.. (2020). Simulation Research on Integrated Shadow Mask in Fabrication of OLED Displays. 194–197. 1 indexed citations

18.

Zhang, Zhao, Zhiwen Chen, Sheng Liu, et al.. (2019). The comparison of Qian-Liu model and Anand model for uniaxial tensile test of SAC305. 1–5. 5 indexed citations

19.

Zhou, Shengjun, et al.. (2019). Highly efficient GaN-based high-power flip-chip light-emitting diodes. Optics Express. 27(12). A669–A669. 223 indexed citations

20.

Ji, Jianhua, Zhiwen Chen, & Ming Xu. (2008). Performance analysis of WDM-based coherent time-spreading optical CDMA system. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7137. 713731–713731. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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