K.-F. Becker

542 total citations
42 papers, 377 citations indexed

About

K.-F. Becker is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Mechanics of Materials. According to data from OpenAlex, K.-F. Becker has authored 42 papers receiving a total of 377 indexed citations (citations by other indexed papers that have themselves been cited), including 36 papers in Electrical and Electronic Engineering, 10 papers in Automotive Engineering and 7 papers in Mechanics of Materials. Recurrent topics in K.-F. Becker's work include 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (26 papers) and Additive Manufacturing and 3D Printing Technologies (10 papers). K.-F. Becker is often cited by papers focused on 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (26 papers) and Additive Manufacturing and 3D Printing Technologies (10 papers). K.-F. Becker collaborates with scholars based in Germany, Taiwan and United States. K.-F. Becker's co-authors include R. Aschenbrenner, Tanja Braun, R. Kahle, T. Thomas, S. Voges, K.-D. Lang, V. Bader, J. Bauer, H. Reichl and Matthias Koch and has published in prestigious journals such as Macromolecular Symposia, IEEE Transactions on Advanced Packaging and Journal of Electronic Packaging.

In The Last Decade

K.-F. Becker

41 papers receiving 339 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
K.-F. Becker Germany 12 323 60 53 48 45 42 377
S. Voges Germany 13 349 1.1× 53 0.9× 57 1.1× 46 1.0× 52 1.2× 36 400
Scott Pozder United States 14 580 1.8× 54 0.9× 51 1.0× 24 0.5× 102 2.3× 25 607
R. Kahle Germany 13 312 1.0× 50 0.8× 63 1.2× 44 0.9× 50 1.1× 35 372
Aibin Yu Singapore 14 429 1.3× 81 1.4× 95 1.8× 23 0.5× 82 1.8× 27 479
Dionysios Manessis Germany 13 418 1.3× 128 2.1× 85 1.6× 31 0.6× 30 0.7× 64 516
Ho‐Ming Tong Taiwan 11 302 0.9× 79 1.3× 96 1.8× 58 1.2× 47 1.0× 32 464
V. Bader Germany 11 280 0.9× 59 1.0× 42 0.8× 49 1.0× 37 0.8× 34 327
Christof Landesberger Germany 12 374 1.2× 67 1.1× 305 5.8× 30 0.6× 35 0.8× 40 500
Adeel Bajwa United States 13 366 1.1× 98 1.6× 68 1.3× 19 0.4× 24 0.5× 26 415
Lei Dong China 9 133 0.4× 111 1.9× 39 0.7× 35 0.7× 36 0.8× 25 285

Countries citing papers authored by K.-F. Becker

Since Specialization
Citations

This map shows the geographic impact of K.-F. Becker's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K.-F. Becker with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K.-F. Becker more than expected).

Fields of papers citing papers by K.-F. Becker

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by K.-F. Becker. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K.-F. Becker. The network helps show where K.-F. Becker may publish in the future.

Co-authorship network of co-authors of K.-F. Becker

This figure shows the co-authorship network connecting the top 25 collaborators of K.-F. Becker. A scholar is included among the top collaborators of K.-F. Becker based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with K.-F. Becker. K.-F. Becker is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Braun, Tanja, K.-F. Becker, V. Bader, et al.. (2016). Foldable Fan-Out Wafer Level Packaging. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 19–24. 5 indexed citations
2.
Thomas, T., S. Voges, Tanja Braun, et al.. (2016). High viscosity paste dosing for microelectronic applications. IMAPSource Proceedings. 2016(1). 345–350.
3.
Braun, Tanja, J. Bauer, K.-F. Becker, et al.. (2015). Influence of humidity on reliability of plastic packages. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–6. 3 indexed citations
4.
Braun, Tanja, S. Voges, Michael J. Topper, et al.. (2015). Material and process trends for moving from FOWLP to FOPLP. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–6. 16 indexed citations
5.
Braun, Tanja, K.-F. Becker, S. Voges, et al.. (2014). 24"×18" Fan-out panel level packing. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 940–946. 14 indexed citations
6.
Becker, K.-F., Matthias Koch, J. Bauer, et al.. (2012). Precision Jetting of Glob Top Materials – a methodology for process optimization. IMAPSource Proceedings. 2012(1). 351–358. 3 indexed citations
7.
Braun, Tanja, K.-F. Becker, S. Voges, et al.. (2011). 3D stacking approaches for mold embedded packages. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 10 indexed citations
8.
Braun, Tanja, K.-F. Becker, S. Voges, et al.. (2011). Through mold vias for stacking of mold embedded packages. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 48–54. 29 indexed citations
9.
Braun, Tanja, K.-F. Becker, J. Bauer, et al.. (2010). Large area embedding for heterogeneous system integration. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 550–556. 20 indexed citations
10.
Braun, Tanja, Victoria Georgi, J. Bauer, et al.. (2010). Water diffusion in micro- and nano-particle filled encapsulants. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–7. 4 indexed citations
11.
Braun, Tanja, J. Bauer, Dionysios Manessis, et al.. (2007). Microtechnology For Realization Of Dielectrophoresis Enhanced Microwells For Biomedical Applications. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 74. 406–410. 2 indexed citations
12.
Aschenbrenner, R., Erik Jung, Tanja Braun, et al.. (2007). New Sensor Packaging Concept for Avionic Application. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). a46?47. 1–4. 1 indexed citations
13.
Becker, K.-F., Tanja Braun, Alexander Neumann, et al.. (2005). Duromer MID technology for system-in-package generation. IEEE Transactions on Electronics Packaging Manufacturing. 28(4). 291–296. 8 indexed citations
14.
Becker, K.-F., Alexander Neumann, Andreas Ostmann, et al.. (2005). A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing. Journal of Electronic Packaging. 127(1). 1–6. 8 indexed citations
15.
Becker, K.-F., Erik Jung, Andreas Ostmann, et al.. (2004). Stackable system-on-packages with integrated components. IEEE Transactions on Advanced Packaging. 27(2). 268–277. 26 indexed citations
16.
Becker, K.-F., et al.. (2004). Printable die attach adhesives for substrate-on-chip packaging. 250–255. 5 indexed citations
17.
Koch, Matthias, et al.. (2004). Modelling and application of silicon microphone systems. 183–188. 1 indexed citations
18.
Braun, Tanja, K.-F. Becker, Matthias Koch, et al.. (2002). Wafer level encapsulation - a transfer molding approach to system in package generation. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 235–244. 8 indexed citations
19.
Schubert, Andreas, R. Dudek, K.-F. Becker, et al.. (2000). Numerical and experimental investigations of large IC flip chip attach. 1338–1346. 11 indexed citations
20.
Aschenbrenner, R., et al.. (1998). Characterization of adhesive materials for high circuit density applications. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 248–255. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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