Tae Sung Oh
About
In The Last Decade
Tae Sung Oh
68 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 56
- Materials Chemistry 774
- Electrical and Electronic Engineering 599
- Mechanical Engineering 223
- Mechanics of Materials 179
- Civil and Structural Engineering 177
Countries citing papers authored by Tae Sung Oh
This map shows the geographic impact of Tae Sung Oh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tae Sung Oh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tae Sung Oh more than expected).
Fields of papers citing papers by Tae Sung Oh
This network shows the impact of papers produced by Tae Sung Oh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tae Sung Oh. The network helps show where Tae Sung Oh may publish in the future.
Co-authorship network of co-authors of Tae Sung Oh
This figure shows the co-authorship network connecting the top 25 collaborators of Tae Sung Oh. A scholar is included among the top collaborators of Tae Sung Oh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tae Sung Oh. Tae Sung Oh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 1 | |
| 3 | 17 | |
| 4 | 9 | |
| 5 | 5 | |
| 6 | 20 | |
| 7 | 13 | |
| 8 | 1 | |
| 9 | 0 | |
| 10 | Thermal Cycling and High Temperature Storage Reliabilities of the Flip Chip Joints Processed Using Cu Pillar Bumps | 4 |
| 11 | Flip Chip Process for RF Packages Using Joint Structures of Cu and Sn Bumps | 3 |
| 12 | Interconnection Processes Using Cu Vias for MEMS Sensor Packages | 2 |
| 13 | 3 | |
| 14 | 2 | |
| 15 | 1 | |
| 16 | 5 | |
| 17 | 1 | |
| 18 | 5 | |
| 19 | 0 | |
| 20 | Ion Beam Assisted Crystallization Behavior of Sol-Gel Derived PbTiO₃ Thin Films | 3 |
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.