Kejun Zeng
Impact in
- General Materials Science top 0.5%
- Metallurgical and Alloy Processes
- Mechanical Engineering top 5%
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 16
- 3D IC and TSV technologies 11
- Integrated Circuits and Semiconductor Failure Analysis 6
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- Intermetallics and Advanced Alloy Properties 7
- Advanced Welding Techniques Analysis 6
- Co-authors
- R.J. Stierman (5 shared papers)Tz-Cheng Chiu (2 shared papers)J.K. Kivilahti (8 shared papers)K. N. Tu (1 shared paper)Darvin Edwards (1 shared paper)Marko Hämäläinen (3 shared papers)D.J. Edwards (1 shared paper)Vesa Vuorinen (2 shared papers)
- Journals
- Journal of Electronic Materials (4 papers)Journal of Alloys and Compounds (3 papers)Journal of Applied Physics (3 papers)Calphad (2 papers)Journal of materials research/Pratt's guide to venture capital sources (2 papers)
- Partner nations
- United StatesChinaFinland
In The Last Decade
Kejun Zeng
40 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 61
- General Materials Science 135
- Mechanical Engineering 727
- Electrical and Electronic Engineering 927
- Electronic, Optical and Magnetic Materials 245
- Catalysis 57
Countries citing papers authored by Kejun Zeng
This map shows the geographic impact of Kejun Zeng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kejun Zeng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kejun Zeng more than expected).
Fields of papers citing papers by Kejun Zeng
This network shows the impact of papers produced by Kejun Zeng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kejun Zeng. The network helps show where Kejun Zeng may publish in the future.
Co-authors
The 25 scholars most cited alongside Kejun Zeng, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 40 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 373 | |
| 2 | 2004 | 204 | |
| 3 | 2002 | 106 | |
| 4 | 2000 | 80 | |
| 5 | 1999 | 78 | |
| 6 | 2006 | 66 | |
| 7 | 1995 | 50 | |
| 8 | 1996 | 42 | |
| 9 | 1999 | 42 | |
| 10 | 2002 | 41 | |
| 11 | 1992 | 39 | |
| 12 | 1993 | 36 | |
| 13 | 1993 | 25 | |
| 14 | 2002 | 22 | |
| 15 | 2001 | 22 | |
| 16 | 1992 | 22 | |
| 17 | 1990 | 19 | |
| 18 | 2023 | 17 | |
| 19 | 2021 | 16 | |
| 20 | 2006 | 15 |
About Kejun Zeng
Kejun Zeng is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Atomic and Molecular Physics, and Optics, General Materials Science and Electronic, Optical and Magnetic Materials, having authored 40 papers that have together received 1.4k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (11 papers), Intermetallics and Advanced Alloy Properties (7 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers), Advanced Welding Techniques Analysis (6 papers), Metallurgical and Alloy Processes (6 papers), Semiconductor materials and interfaces (5 papers) and Building Energy and Comfort Optimization (5 papers). The work is most often cited by research in General Materials Science (135 citations), Mechanical Engineering (727 citations), Electrical and Electronic Engineering (927 citations), Electronic, Optical and Magnetic Materials (245 citations) and Catalysis (57 citations). Kejun Zeng has collaborated with scholars based in United States, China and Finland. Frequent co-authors include R.J. Stierman, Tz-Cheng Chiu, J.K. Kivilahti, K. N. Tu, Darvin Edwards, Marko Hämäläinen, D.J. Edwards, Vesa Vuorinen, Tomi Laurila and R. Bormann. Their work appears in journals such as Journal of Electronic Materials, Journal of Alloys and Compounds, Journal of Applied Physics, Calphad and Journal of materials research/Pratt's guide to venture capital sources.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.