Kejun Zeng

1.7k total citations
40 papers, 1.4k citations indexed

About

Kejun Zeng is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Kejun Zeng has authored 40 papers receiving a total of 1.4k indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Electrical and Electronic Engineering, 18 papers in Mechanical Engineering and 6 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Kejun Zeng's work include Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (11 papers) and Intermetallics and Advanced Alloy Properties (7 papers). Kejun Zeng is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (11 papers) and Intermetallics and Advanced Alloy Properties (7 papers). Kejun Zeng collaborates with scholars based in United States, China and Finland. Kejun Zeng's co-authors include R.J. Stierman, Tz-Cheng Chiu, J.K. Kivilahti, K. N. Tu, Darvin Edwards, Marko Hämäläinen, D.J. Edwards, Vesa Vuorinen, Tomi Laurila and Thomas Klassen and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Energy and Buildings.

In The Last Decade

Kejun Zeng

40 papers receiving 1.3k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Kejun Zeng United States 17 923 725 305 245 147 40 1.4k
Dajian Li China 20 672 0.7× 703 1.0× 613 2.0× 130 0.5× 181 1.2× 103 1.5k
Chun Yu China 22 492 0.5× 1.0k 1.4× 380 1.2× 79 0.3× 232 1.6× 84 1.4k
Joo‐Youl Huh South Korea 22 722 0.8× 382 0.5× 629 2.1× 65 0.3× 149 1.0× 74 1.3k
Mingliang Huang China 27 2.2k 2.4× 1.5k 2.1× 245 0.8× 372 1.5× 406 2.8× 183 2.5k
H.J. Seifert Germany 20 230 0.2× 579 0.8× 561 1.8× 43 0.2× 212 1.4× 47 1.1k
Zhuopeng Tan China 17 453 0.5× 366 0.5× 308 1.0× 285 1.2× 57 0.4× 53 1.1k
Makoto Tsukahara Japan 22 255 0.3× 340 0.5× 995 3.3× 238 1.0× 24 0.2× 51 1.4k
M. V. Karpets Ukraine 17 130 0.1× 564 0.8× 452 1.5× 139 0.6× 246 1.7× 143 1.0k
Tomasz Gancarz Poland 21 646 0.7× 824 1.1× 453 1.5× 39 0.2× 284 1.9× 71 1.2k
Werner Riehemann Germany 23 180 0.2× 799 1.1× 493 1.6× 153 0.6× 154 1.0× 108 1.2k

Countries citing papers authored by Kejun Zeng

Since Specialization
Citations

This map shows the geographic impact of Kejun Zeng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kejun Zeng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kejun Zeng more than expected).

Fields of papers citing papers by Kejun Zeng

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Kejun Zeng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kejun Zeng. The network helps show where Kejun Zeng may publish in the future.

Co-authorship network of co-authors of Kejun Zeng

This figure shows the co-authorship network connecting the top 25 collaborators of Kejun Zeng. A scholar is included among the top collaborators of Kejun Zeng based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kejun Zeng. Kejun Zeng is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Yuan, Yue, et al.. (2025). An occupant-centric control case study based on internet of things and data mining for an office space. Journal of Building Engineering. 101. 111925–111925. 2 indexed citations
2.
Liu, Sai, et al.. (2024). Retrofit Analysis of Exterior Windows for Large Office Buildings in Different Climate Zones of China. Buildings. 14(12). 3904–3904. 3 indexed citations
3.
Yuan, Yue, et al.. (2023). Enhanced Operation of Ice Storage System for Peak Load Management in Shopping Malls across Diverse Climate Zones. Sustainability. 15(20). 14759–14759. 4 indexed citations
4.
Yuan, Yue, Liying Gao, Kejun Zeng, & Yixing Chen. (2023). Space-Level air conditioner electricity consumption and occupant behavior analysis on a university campus. Energy and Buildings. 300. 113646–113646. 15 indexed citations
5.
Yang, Yuhui, Yin Cai, Kejun Zeng, et al.. (2021). Dynamic Patterns of N6‐Methyladenosine Profiles of Messenger RNA Correlated with the Cardiomyocyte Regenerability during the Early Heart Development in Mice. Oxidative Medicine and Cellular Longevity. 2021(1). 5537804–5537804. 16 indexed citations
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Zeng, Kejun, et al.. (2011). Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective. Journal of Electronic Materials. 41(2). 253–261. 14 indexed citations
10.
Zeng, Kejun. (2009). Lead-free soldering: Materials science and solder joint reliability. JOM. 61(6). 28–28. 9 indexed citations
11.
Kang, Sung K., Iver E. Anderson, Laura J. Turbini, et al.. (2009). Foreword. Journal of Electronic Materials. 38(12). 2427–2428. 1 indexed citations
12.
Chen, Sinn-wen, Chih‐Ming Chen, Hans Flandorfer, et al.. (2008). Foreword. Journal of Electronic Materials. 38(1). 1–1. 6 indexed citations
13.
Zeng, Kejun, et al.. (2006). Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating. 28. 1111–1119. 15 indexed citations
14.
Gupta, Vijay, et al.. (2004). Measurement of Solder Joint Strength and Its Dependence on Thermal Aging in Freestanding and Board-Mounted Packages using a Laser Spallation Technique. Proceedings - International Symposium for Testing and Failure Analysis. 30873. 267–276. 2 indexed citations
15.
Chiu, Tz-Cheng, et al.. (2004). Effect of thermal aging on board level drop reliability for Pb-free BGA packages. 1256–1262. 203 indexed citations
16.
Laurila, Tomi, Kejun Zeng, J.K. Kivilahti, Jyrki Molarius, & I. Suni. (2002). TaC as a diffusion barrier between Si and Cu. Journal of Applied Physics. 91(8). 5391–5399. 41 indexed citations
17.
Laurila, Tomi, et al.. (2000). Reliability of Tantalum Based Diffusion Barriers between Cu and Si. MRS Proceedings. 612. 3 indexed citations
18.
Friec, Y. Le, P. Rogl, Josef Bauer, et al.. (1998). Investigation of the nitrogen-nickel-titanium system: The isothermal section at 900 °C. Journal of Phase Equilibria and Diffusion. 19(2). 112–123. 5 indexed citations
19.
Zeng, Kejun, et al.. (1993). A Thermodynamic Assessment of the Cr-Zr System. International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde). 84(1). 23–28. 36 indexed citations
20.
Zeng, Kejun, et al.. (1993). Thermodynamic modeling of the laves phases in the CrZr system. Calphad. 17(1). 101–107. 25 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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