R. Sidhu

1.1k total citations
27 papers, 937 citations indexed

About

R. Sidhu is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Mechanics of Materials. According to data from OpenAlex, R. Sidhu has authored 27 papers receiving a total of 937 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Mechanical Engineering, 20 papers in Electrical and Electronic Engineering and 6 papers in Mechanics of Materials. Recurrent topics in R. Sidhu's work include Electronic Packaging and Soldering Technologies (20 papers), Advanced Welding Techniques Analysis (11 papers) and Aluminum Alloys Composites Properties (6 papers). R. Sidhu is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), Advanced Welding Techniques Analysis (11 papers) and Aluminum Alloys Composites Properties (6 papers). R. Sidhu collaborates with scholars based in United States, Malaysia and India. R. Sidhu's co-authors include Nikhilesh Chawla, V.V. Ganesh, Xin Deng, Peter M. Johnson, Mariusz Dudek, I. Dutta, Praveen Kumar, Ravi Mahajan, Zhe Huang and Aidy Ali and has published in prestigious journals such as Acta Materialia, Journal of Materials Science and Scripta Materialia.

In The Last Decade

R. Sidhu

27 papers receiving 902 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
R. Sidhu United States 16 662 575 239 178 155 27 937
Tz-Cheng Chiu Taiwan 13 435 0.7× 907 1.6× 316 1.3× 88 0.5× 100 0.6× 67 1.2k
Raj Bhatti United Kingdom 11 379 0.6× 335 0.6× 100 0.4× 262 1.5× 50 0.3× 33 692
Jong-ook Suh United States 14 1.2k 1.8× 696 1.2× 121 0.5× 233 1.3× 172 1.1× 28 1.7k
Liwei Wang China 17 605 0.9× 198 0.3× 108 0.5× 370 2.1× 140 0.9× 67 978
H. D. Solomon United States 17 846 1.3× 546 0.9× 482 2.0× 363 2.0× 148 1.0× 41 1.2k
Stephen W. Banovic United States 16 512 0.8× 121 0.2× 210 0.9× 332 1.9× 139 0.9× 45 766
Shengxin Zhu China 18 418 0.6× 254 0.4× 335 1.4× 320 1.8× 65 0.4× 35 900
M. Braunović Canada 16 924 1.4× 464 0.8× 533 2.2× 195 1.1× 123 0.8× 67 1.2k
Erdoğan Kanca Türkiye 19 668 1.0× 139 0.2× 425 1.8× 405 2.3× 174 1.1× 50 880
Joana Rebelo Kornmeier Germany 14 544 0.8× 392 0.7× 153 0.6× 270 1.5× 51 0.3× 59 1.0k

Countries citing papers authored by R. Sidhu

Since Specialization
Citations

This map shows the geographic impact of R. Sidhu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R. Sidhu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R. Sidhu more than expected).

Fields of papers citing papers by R. Sidhu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by R. Sidhu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R. Sidhu. The network helps show where R. Sidhu may publish in the future.

Co-authorship network of co-authors of R. Sidhu

This figure shows the co-authorship network connecting the top 25 collaborators of R. Sidhu. A scholar is included among the top collaborators of R. Sidhu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with R. Sidhu. R. Sidhu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Sahaym, Uttara, et al.. (2014). Interfacially engineered liquid-phase-sintered Cu–In composite solders for thermal interface material applications. Journal of Materials Science. 49(22). 7844–7854. 13 indexed citations
3.
Sidhu, R., Aidy Ali, & Mohd Roshdi Hassan. (2011). Experimental Determination of Fatigue Life of Automotive Jounce Bumper. Key engineering materials. 462-463. 634–638. 3 indexed citations
4.
Kumar, Praveen, et al.. (2011). Liquid phase sintered Cu–In composite solders for thermal interface material and interconnect applications. Journal of Materials Science. 46(21). 7012–7025. 19 indexed citations
5.
Kumar, Praveen, et al.. (2011). Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map. Journal of Electronic Materials. 41(2). 412–424. 24 indexed citations
6.
Huang, Zhe, Praveen Kumar, I. Dutta, et al.. (2011). Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions. Journal of Electronic Materials. 41(2). 375–389. 33 indexed citations
7.
Ali, Aidy, et al.. (2010). Durability of automotive jounce bumper. Materials & Design (1980-2015). 32(2). 1001–1005. 19 indexed citations
8.
Huang, Zhe, Praveen Kumar, I. Dutta, et al.. (2010). Fracture mechanism map for the fracture of microelectronic Pb-free solder joints under dynamic loading conditions. 298–303. 1 indexed citations
9.
Averill, Ronald C., et al.. (2009). Optimization of Engineering Systems. 1 indexed citations
10.
11.
Sidhu, R. & Nikhilesh Chawla. (2008). Thermal Fatigue Behavior of Sn-Rich (Pb-Free) Solders. Metallurgical and Materials Transactions A. 39(4). 799–810. 25 indexed citations
12.
Sidhu, R. & Nikhilesh Chawla. (2008). Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part I. Microstructure Characterization of Bulk Solder and Solder/Copper Joints. Metallurgical and Materials Transactions A. 39(2). 340–348. 32 indexed citations
13.
Sidhu, R., Xin Deng, & Nikhilesh Chawla. (2007). Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part II. Creep Behavior of Bulk Solder and Solder/Copper Joints. Metallurgical and Materials Transactions A. 39(2). 349–362. 55 indexed citations
14.
Averill, Ronald C., et al.. (2007). Nonlinear Material Characterization using HEEDS and ABAQUS. 1 indexed citations
15.
Chawla, Nikhilesh & R. Sidhu. (2006). Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys. Journal of Materials Science Materials in Electronics. 18(1-3). 175–189. 25 indexed citations
16.
Dudek, Mariusz, R. Sidhu, & Nikhilesh Chawla. (2006). Novel rare-earth-containing lead-free solders with enhanced ductility. JOM. 58(6). 57–62. 49 indexed citations
17.
Chawla, Nikhilesh, R. Sidhu, & V.V. Ganesh. (2006). Three-dimensional visualization and microstructure-based modeling of deformation in particle-reinforced composites. Acta Materialia. 54(6). 1541–1548. 238 indexed citations
18.
Dudek, Mariusz, et al.. (2006). Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders. Journal of Electronic Materials. 35(12). 2088–2097. 64 indexed citations
19.
Deng, Xin, R. Sidhu, Peter M. Johnson, & Nikhilesh Chawla. (2005). Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints. Metallurgical and Materials Transactions A. 36(1). 55–64. 155 indexed citations
20.
Sidhu, R. & Nikhilesh Chawla. (2004). Three-dimensional microstructure characterization of Ag3Sn intermetallics in Sn-rich solder by serial sectioning. Materials Characterization. 52(3). 225–230. 59 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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