Paul D. Franzon
- Hardware and Architecture top 0.5%
- Parallel Computing and Optimization Techniques 32
- VLSI and Analog Circuit Testing 30
-
- 3D IC and TSV technologies 87
- VLSI and FPGA Design Techniques 53
- Low-power high-performance VLSI design 52
- Semiconductor materials and devices 51
- Electromagnetic Compatibility and Noise Suppression 41
- Semiconductor Lasers and Optical Devices 28
- Biomedical Engineering top 5%
- Automotive Engineering top 5%
- Co-authors
- M.B. SteerW. Rhett DavisJohn WilsonStephen MickSaid F. Al-SarawiDerek AbbottJ. Q. XuAmbarish Mukund Sule
- Cited by
- Hardware and ArchitectureElectrical and Electronic EngineeringComputer Networks and Communications
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (10 papers)IEEE Transactions on Advanced Packaging (8 papers)IEEE Transactions on Very Large Scale Integration (VLSI) Systems (7 papers)
- Partner nations
- United StatesSwitzerlandAustralia
In The Last Decade
Paul D. Franzon
283 papers receiving 4.2k citations
Hit Papers
Peers
Comparison fields: 5 of 106
- Hardware and Architecture 934
- Electrical and Electronic Engineering 3.5k
- Computer Networks and Communications 761
- Biomedical Engineering 756
- Automotive Engineering 156
Countries citing papers authored by Paul D. Franzon
This map shows the geographic impact of Paul D. Franzon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Paul D. Franzon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Paul D. Franzon more than expected).
Fields of papers citing papers by Paul D. Franzon
This network shows the impact of papers produced by Paul D. Franzon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Paul D. Franzon. The network helps show where Paul D. Franzon may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Paul D. Franzon, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 3 | |
| 2 | 2024 | 0 | |
| 3 | 2022 | 5 | |
| 4 | 2022 | 2 | |
| 5 | 2021 | 5 | |
| 6 | 2010 | 13 | |
| 7 | 2010 | 3 | |
| 8 | 2009 | 112 | |
| 9 | 2007 | 310 | |
| 10 | Wafer scale aligned sub-25nm metal nanowires on Silicon (110) using PEDAL lift-off process | 2005 | 0 |
| 11 | Discontinuous Gold Films for Nanocell Memories | 2004 | 2 |
| 12 | 2004 | 33 | |
| 13 | 2003 | 0 | |
| 14 | 2002 | 2 | |
| 15 | 1999 | 0 | |
| 16 | Parasitic Extraction Accuracy - How Much is Enough? | 1999 | 1 |
| 17 | 1996 | 1 | |
| 18 | 1995 | 6 | |
| 19 | 1995 | 9 | |
| 20 | 1992 | 5 |
About Paul D. Franzon
Paul D. Franzon is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering and Computer Networks and Communications, having authored 304 papers that have together received 4.5k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (87 papers), VLSI and FPGA Design Techniques (53 papers), Low-power high-performance VLSI design (52 papers), Semiconductor materials and devices (51 papers), Electromagnetic Compatibility and Noise Suppression (41 papers), Parallel Computing and Optimization Techniques (32 papers), VLSI and Analog Circuit Testing (30 papers) and Semiconductor Lasers and Optical Devices (28 papers). The work is most often cited by research in Hardware and Architecture (934 citations), Electrical and Electronic Engineering (3.5k citations) and Computer Networks and Communications (761 citations). Paul D. Franzon has collaborated with scholars based in United States, Switzerland and Australia. Frequent co-authors include M.B. Steer, W. Rhett Davis, John Wilson, Stephen Mick, Said F. Al-Sarawi, Derek Abbott, J. Q. Xu, Ambarish Mukund Sule, Christopher Mineo and Hua Hao. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Advanced Packaging, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE Transactions on Circuits and Systems I Regular Papers and IEEE Transactions on Microwave Theory and Techniques.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.