Tz-Cheng Chiu
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 5%
- Mechanics of Materials top 5%
- Electronic, Optical and Magnetic Materials top 10%
- Aerospace Engineering top 10%
- Co-authors
- Kejun ZengR.J. StiermanDarvin EdwardsK. N. TuF. ErdoğanD.J. EdwardsE.T. OgawaHongwei Huang
- Topics
- Electronic Packaging and Soldering Technologies (42 papers)Mechanical Behavior of Composites (22 papers)3D IC and TSV technologies (16 papers)
- Journals
- Journal of Applied PhysicsInternational Journal of Heat and Mass TransferJournal of Sound and Vibration
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
Tz-Cheng Chiu
63 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 47
- Electrical and Electronic Engineering 907
- Mechanical Engineering 435
- Mechanics of Materials 316
- Electronic, Optical and Magnetic Materials 229
- Aerospace Engineering 100
Countries citing papers authored by Tz-Cheng Chiu
This map shows the geographic impact of Tz-Cheng Chiu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tz-Cheng Chiu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tz-Cheng Chiu more than expected).
Fields of papers citing papers by Tz-Cheng Chiu
This network shows the impact of papers produced by Tz-Cheng Chiu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tz-Cheng Chiu. The network helps show where Tz-Cheng Chiu may publish in the future.
Co-authorship network of co-authors of Tz-Cheng Chiu
This figure shows the co-authorship network connecting the top 25 collaborators of Tz-Cheng Chiu. A scholar is included among the top collaborators of Tz-Cheng Chiu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tz-Cheng Chiu. Tz-Cheng Chiu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 1 | |
| 3 | 6 | |
| 4 | 5 | |
| 5 | 7 | |
| 6 | 6 | |
| 7 | 2 | |
| 8 | 5 | |
| 9 | 14 | |
| 10 | 22 | |
| 11 | 1 | |
| 12 | 2 | |
| 13 | 2 | |
| 14 | 11 | |
| 15 | 4 | |
| 16 | 7 | |
| 17 | 3 | |
| 18 | 203 | |
| 19 | Buckling of graded coatings: A continuum model | 3 |
| 20 | 84 |
About Tz-Cheng Chiu
Tz-Cheng Chiu is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Mechanical Engineering, having authored 67 papers that have together received 1.2k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (42 papers), Mechanical Behavior of Composites (22 papers) and 3D IC and TSV technologies (16 papers). The work is most often cited by research in Electrical and Electronic Engineering (907 citations), General Materials Science (40 citations) and Mechanics of Materials (316 citations). Tz-Cheng Chiu has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include Kejun Zeng, R.J. Stierman, Darvin Edwards, K. N. Tu, F. Erdoğan, D.J. Edwards, E.T. Ogawa, Hongwei Huang, Fazil Erdögan and T. Bonifield. Their work appears in journals such as Journal of Applied Physics, International Journal of Heat and Mass Transfer and Journal of Sound and Vibration.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.