R.J. Stierman

1.1k total citations
20 papers, 918 citations indexed

About

R.J. Stierman is a scholar working on Electrical and Electronic Engineering, Condensed Matter Physics and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, R.J. Stierman has authored 20 papers receiving a total of 918 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 6 papers in Condensed Matter Physics and 6 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in R.J. Stierman's work include Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (11 papers) and Rare-earth and actinide compounds (6 papers). R.J. Stierman is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (11 papers) and Rare-earth and actinide compounds (6 papers). R.J. Stierman collaborates with scholars based in United States, United Kingdom and Germany. R.J. Stierman's co-authors include Kejun Zeng, Tz-Cheng Chiu, Darvin Edwards, K. N. Tu, D.J. Edwards, T. Tsang, K. A. Gschneidner, O.D. McMasters, Paul S. Ho and K. Ikeda and has published in prestigious journals such as Physical review. B, Condensed matter, Journal of Applied Physics and Thin Solid Films.

In The Last Decade

R.J. Stierman

18 papers receiving 885 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
R.J. Stierman United States 11 694 385 236 150 90 20 918
C.C. Lee United States 16 738 1.1× 194 0.5× 70 0.3× 189 1.3× 37 0.4× 44 877
James D. Scofield United States 18 901 1.3× 158 0.4× 151 0.6× 151 1.0× 14 0.2× 76 1.1k
Koji Takei Japan 11 402 0.6× 99 0.3× 129 0.5× 91 0.6× 12 0.1× 34 581
P. A. Totta United States 11 660 1.0× 319 0.8× 164 0.7× 10 0.1× 57 0.6× 22 761
S.-M. Kuo United States 12 459 0.7× 360 0.9× 135 0.6× 10 0.1× 89 1.0× 16 756
Jung-Goo Lee South Korea 13 174 0.3× 179 0.5× 273 1.2× 73 0.5× 19 0.2× 69 519
Cheng-Han Lin Taiwan 9 142 0.2× 161 0.4× 62 0.3× 69 0.5× 75 0.8× 16 450
G.R. Love United States 10 199 0.3× 143 0.4× 149 0.6× 115 0.8× 56 0.6× 17 694
S. Yamaura Japan 13 261 0.4× 277 0.7× 120 0.5× 24 0.2× 68 0.8× 47 582
Ogheneyunume Obi United States 19 384 0.6× 174 0.5× 930 3.9× 84 0.6× 164 1.8× 33 1.3k

Countries citing papers authored by R.J. Stierman

Since Specialization
Citations

This map shows the geographic impact of R.J. Stierman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R.J. Stierman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R.J. Stierman more than expected).

Fields of papers citing papers by R.J. Stierman

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by R.J. Stierman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R.J. Stierman. The network helps show where R.J. Stierman may publish in the future.

Co-authorship network of co-authors of R.J. Stierman

This figure shows the co-authorship network connecting the top 25 collaborators of R.J. Stierman. A scholar is included among the top collaborators of R.J. Stierman based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with R.J. Stierman. R.J. Stierman is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lång, Christian, et al.. (2012). A Method For In-Situ Measurement Of The Film Thickness And Composition Of Films Deposited by Gas Injection In The FIB-SEM. Microscopy and Microanalysis. 18(S2). 620–621.
2.
Zeng, Kejun, et al.. (2006). Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating. 28. 1111–1119. 15 indexed citations
3.
Zeng, Kejun, et al.. (2006). The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating. JOM. 58(6). 75–79. 66 indexed citations
4.
Gupta, Vijay, et al.. (2004). Measurement of Solder Joint Strength and Its Dependence on Thermal Aging in Freestanding and Board-Mounted Packages using a Laser Spallation Technique. Proceedings - International Symposium for Testing and Failure Analysis. 30873. 267–276. 2 indexed citations
5.
Chiu, Tz-Cheng, et al.. (2004). Effect of thermal aging on board level drop reliability for Pb-free BGA packages. 1256–1262. 203 indexed citations
6.
Zeng, Kejun, et al.. (2004). Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability. Journal of Applied Physics. 97(2). 369 indexed citations
7.
Edwards, Darvin, et al.. (2003). Multichip assembly with flipped integrated circuits. 672–680. 5 indexed citations
8.
Amador, Guillermo J., et al.. (2002). Tacky Dots/sup TM/ transfer of solder spheres for flip chip and electronic package applications. 1. 434–441. 2 indexed citations
9.
Amador, Guillermo J., et al.. (2002). Tacky Dots/sup TM/ technology for flip chip and BGA solder bumping. 448–453.
10.
Stierman, R.J., et al.. (2002). Wire bonds over active circuits. 922–928. 14 indexed citations
11.
Edwards, Darvin, et al.. (2001). Wafer level packaging of a tape flip-chip chip scale packages. Microelectronics Reliability. 41(5). 705–713. 9 indexed citations
12.
Ho, Paul S., et al.. (1999). Thickness dependence of the anisotropy in thermal expansion of PMDA-ODA and BPDA-PDA thin films. Thin Solid Films. 339(1-2). 68–73. 44 indexed citations
13.
Edwards, Darvin, et al.. (1989). Multichip assembly with flipped integrated circuits. IEEE Transactions on Components Hybrids and Manufacturing Technology. 12(4). 650–657. 27 indexed citations
14.
Malhi, S.D.S., et al.. (1987). Orthogonal chip mount - A 3D hybrid wafer scale integration technology. 104–106. 4 indexed citations
15.
Gschneidner, K. A., S. K. Dhar, R.J. Stierman, T. Tsang, & O.D. McMasters. (1985). Influence of composition on some physical properties of the narrow band material CeSn3. Journal of Magnetism and Magnetic Materials. 47-48. 51–56. 27 indexed citations
16.
Gschneidner, K. A., K. Ikeda, T. Tsang, et al.. (1985). Influence of high magnetic fields (10 T) on paramagnons in rare-earth intermetallic compounds. Physica B+C. 130(1-3). 202–206. 4 indexed citations
17.
Ikeda, K., K. A. Gschneidner, R.J. Stierman, T. Tsang, & O.D. McMasters. (1984). Quenching of spin fluctuations in the highly enhanced paramagnetsRCo2(R=Sc,Y,orLu). Physical review. B, Condensed matter. 29(9). 5039–5052. 70 indexed citations
18.
Tsang, T., K. A. Gschneidner, O.D. McMasters, R.J. Stierman, & S. K. Dhar. (1984). Anisotropic spin fluctuations in cubic CeSn3. Physical review. B, Condensed matter. 29(7). 4185–4188. 22 indexed citations
19.
Stierman, R.J. & K. A. Gschneidner. (1984). The magnetic susceptibility of lutetium-hydrogen solid solution alloys from 2 to 300 K and a re-evaluation of the low temperature heat capacity results. Journal of Magnetism and Magnetic Materials. 42(3). 309–316. 6 indexed citations
20.
Stierman, R.J., K. A. Gschneidner, T. Tsang, et al.. (1983). Magnetic susceptibility and electrical resistivity of electrotransport purified scandium single crystals from ≈ 1 to 300 k. Journal of Magnetism and Magnetic Materials. 36(3). 249–254. 29 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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