Yong Han

1.1k total citations
75 papers, 831 citations indexed

About

Yong Han is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Yong Han has authored 75 papers receiving a total of 831 indexed citations (citations by other indexed papers that have themselves been cited), including 36 papers in Mechanical Engineering, 35 papers in Electrical and Electronic Engineering and 16 papers in Materials Chemistry. Recurrent topics in Yong Han's work include Heat Transfer and Optimization (30 papers), 3D IC and TSV technologies (25 papers) and Electronic Packaging and Soldering Technologies (22 papers). Yong Han is often cited by papers focused on Heat Transfer and Optimization (30 papers), 3D IC and TSV technologies (25 papers) and Electronic Packaging and Soldering Technologies (22 papers). Yong Han collaborates with scholars based in Singapore, China and Germany. Yong Han's co-authors include Xiaowu Zhang, Boon Long Lau, Gongyue Tang, Jun Wei, Hongyang Jing, Xiangdong Liu, Lianyong Xu, Manuela Loeblein, Siu Hon Tsang and Edwin Hang Tong Teo and has published in prestigious journals such as ACS Nano, Materials Science and Engineering A and Corrosion Science.

In The Last Decade

Yong Han

66 papers receiving 810 citations

Peers

Yong Han
Raj Bhatti United Kingdom
Ayan Ray India
Yunna Sun China
Liangliang Yang China
Arkadeb Mukhopadhyay India
P.J. Bolt Netherlands
A. Tidu France
Darin J. Sharar United States
Nan Jiang China
Raj Bhatti United Kingdom
Yong Han
Citations per year, relative to Yong Han Yong Han (= 1×) peers Raj Bhatti

Countries citing papers authored by Yong Han

Since Specialization
Citations

This map shows the geographic impact of Yong Han's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yong Han with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yong Han more than expected).

Fields of papers citing papers by Yong Han

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yong Han. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yong Han. The network helps show where Yong Han may publish in the future.

Co-authorship network of co-authors of Yong Han

This figure shows the co-authorship network connecting the top 25 collaborators of Yong Han. A scholar is included among the top collaborators of Yong Han based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yong Han. Yong Han is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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Xu, Jing, Bo Guan, Yong Han, et al.. (2025). Synergistic enhancement of strength and conductivity of Cu-Ni-Co-Si alloys by Ag addition. Journal of Alloys and Compounds. 1040. 183477–183477. 2 indexed citations
4.
Peng, Chao, Zongxue Yu, Kexi Liao, et al.. (2025). Robust, photothermal superhydrophobic epoxy anti-corrosion coating based on micro nano structured Al2O3-TiN. Chemical Engineering Science. 315. 121843–121843. 4 indexed citations
5.
Zeng, Shanshan, Yong Li, Yong Han, et al.. (2025). Customized high-throughput microfluidic production of multifunctional porous microspheres for bone repair. Biomaterials Advances. 177. 214426–214426.
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Zhao, Nan, Yanfang Wang, Yong Han, et al.. (2025). Enhanced thermoelectric performance of PEDOT:PSS film by two-step post-treatment with mixed solvent based ionic liquid. Organic Electronics. 144. 107289–107289.
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Mao, Jiahui, Xiao Han, Yongbo Li, et al.. (2025). Self-healing, adhesive, hemostasis and anti-inflammation with a Schiff base-Crosslinked injectable hydrogel for burn wound healing. Applied Materials Today. 46. 102906–102906.
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Zhao, Nan, Yanfang Wang, Yong Han, et al.. (2025). Modulation for Seebeck coefficient and power factor of flexible PEDOT:PSS films by incorporating SnSe nanosheets and solvents treatment. Journal of Alloys and Compounds. 1022. 179793–179793. 2 indexed citations
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Han, Yong, et al.. (2024). Characteristics of energy release and ignition hazards of ammonium nitrate in storage under strong shock and accidental stimulation. Journal of Loss Prevention in the Process Industries. 94. 105522–105522.
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Chong, Chai Tai, et al.. (2021). Heterogeneous Integration with Embedded Fine Interconnect. 2216–2221. 9 indexed citations
11.
Chen, Zhaohui, Xiaowu Zhang, Boon Long Lau, et al.. (2018). Package Level Warpage Simulation of Fan-out Wafer Level Package (FOWLP) Considering Viscoelastic Material Properties. 836–842. 8 indexed citations
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Han, Yong, et al.. (2017). Package-Level Si Micro-Fluid Cooler with Enhanced Jet Array for High Performance 3D Systems. 4. 1654–1659. 1 indexed citations
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Loeblein, Manuela, Siu Hon Tsang, Yong Han, Xiaowu Zhang, & Edwin Hang Tong Teo. (2016). Heat Dissipation Enhancement of 2.5D Package with 3D Graphene and 3D Boron Nitride Networks as Thermal Interface Material (TIM). 707–713. 5 indexed citations
14.
Han, Yong, et al.. (2016). Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(1). 50–57. 24 indexed citations
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Han, Yong, Boon Long Lau, Gongyue Tang, & Xiaowu Zhang. (2015). Micro-channel heat sink with multiple interactive pressure-driven or electro-osmotic flows. 129. 1–5. 3 indexed citations
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Han, Yong, Boon Long Lau, Gongyue Tang, & Xiaowu Zhang. (2015). Heat dissipation improvement with diamond heat spreader on hybrid Si micro-cooler for GaN devices. 603–606. 4 indexed citations
18.
Ho, David, et al.. (2014). Development of low profile fan out PoP solution with embedded passive. 1. 597–600. 3 indexed citations
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Han, Yong, et al.. (2014). Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(6). 983–990. 41 indexed citations
20.
Lau, Boon Long, et al.. (2013). Development of package level hybrid silicon heat sink for hotspots cooling. 32. 741–746. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026