Yong Han
- Mechanical Engineering top 5%
- Electrical and Electronic Engineering top 10%
- Materials Chemistry
- Biomedical Engineering
- Civil and Structural Engineering
- Co-authors
- Xiaowu ZhangBoon Long LauGongyue TangJun WeiHongyang JingXiangdong LiuLianyong XuManuela Loeblein
- Topics
- Heat Transfer and Optimization (30 papers)3D IC and TSV technologies (25 papers)Electronic Packaging and Soldering Technologies (22 papers)
In The Last Decade
Yong Han
66 papers receiving 810 citations
Peers
Comparison fields: 5 of 54
- Mechanical Engineering 473
- Electrical and Electronic Engineering 377
- Materials Chemistry 259
- Biomedical Engineering 102
- Civil and Structural Engineering 63
Countries citing papers authored by Yong Han
This map shows the geographic impact of Yong Han's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yong Han with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yong Han more than expected).
Fields of papers citing papers by Yong Han
This network shows the impact of papers produced by Yong Han. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yong Han. The network helps show where Yong Han may publish in the future.
Co-authorship network of co-authors of Yong Han
This figure shows the co-authorship network connecting the top 25 collaborators of Yong Han. A scholar is included among the top collaborators of Yong Han based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yong Han. Yong Han is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 1 | |
| 3 | 2 | |
| 4 | 4 | |
| 5 | 0 | |
| 6 | 0 | |
| 7 | 0 | |
| 8 | 2 | |
| 9 | 0 | |
| 10 | 9 | |
| 11 | 8 | |
| 12 | 1 | |
| 13 | 5 | |
| 14 | 24 | |
| 15 | 8 | |
| 16 | 3 | |
| 17 | 4 | |
| 18 | 3 | |
| 19 | 41 | |
| 20 | 4 |
About Yong Han
Yong Han is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Hardware and Architecture, having authored 75 papers that have together received 831 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (30 papers), 3D IC and TSV technologies (25 papers) and Electronic Packaging and Soldering Technologies (22 papers). The work is most often cited by research in Mechanical Engineering (473 citations), Electrical and Electronic Engineering (377 citations) and Materials Chemistry (259 citations). Yong Han has collaborated with scholars based in Singapore, China and Germany. Frequent co-authors include Xiaowu Zhang, Boon Long Lau, Gongyue Tang, Jun Wei, Hongyang Jing, Xiangdong Liu, Lianyong Xu, Manuela Loeblein, Siu Hon Tsang and Edwin Hang Tong Teo. Their work appears in journals such as ACS Nano, Materials Science and Engineering A and Corrosion Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.