Q.K. Tong
- Electrical and Electronic Engineering top 10%
- Biomedical Engineering
- Mechanics of Materials top 10%
- Mechanical Engineering
- Polymers and Plastics
- Co-authors
- Daoqiang LuC.P. WongChing‐Ping WongA. SavocaDabiao LuSongtao WuLuu NguyenJing Wang
- Topics
- Electronic Packaging and Soldering Technologies (21 papers)3D IC and TSV technologies (14 papers)Advanced Sensor and Energy Harvesting Materials (5 papers)
- Journals
- SHILAP Revista de lepidopterologíaInformation SciencesNeural Networks
- Partner nations
- United StatesChinaSingapore
In The Last Decade
Q.K. Tong
36 papers receiving 581 citations
Peers
Comparison fields: 5 of 57
- Electrical and Electronic Engineering 483
- Biomedical Engineering 159
- Mechanics of Materials 146
- Mechanical Engineering 119
- Polymers and Plastics 96
Countries citing papers authored by Q.K. Tong
This map shows the geographic impact of Q.K. Tong's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Q.K. Tong with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Q.K. Tong more than expected).
Fields of papers citing papers by Q.K. Tong
This network shows the impact of papers produced by Q.K. Tong. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Q.K. Tong. The network helps show where Q.K. Tong may publish in the future.
Co-authorship network of co-authors of Q.K. Tong
This figure shows the co-authorship network connecting the top 25 collaborators of Q.K. Tong. A scholar is included among the top collaborators of Q.K. Tong based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Q.K. Tong. Q.K. Tong is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 8 | |
| 3 | 1 | |
| 4 | 26 | |
| 5 | 1 | |
| 6 | 11 | |
| 7 | 14 | |
| 8 | 1 | |
| 9 | 3 | |
| 10 | 1 | |
| 11 | 2 | |
| 12 | 68 | |
| 13 | 1 | |
| 14 | 16 | |
| 15 | 22 | |
| 16 | 3 | |
| 17 | 13 | |
| 18 | Wafer level application of reworkable underfill | 3 |
| 19 | Reworkable Flip Chip underfill : Materials and processes | 11 |
| 20 | 41 |
About Q.K. Tong
Q.K. Tong is a scholar working on Industrial and Manufacturing Engineering, Media Technology and Electrical and Electronic Engineering, having authored 37 papers that have together received 621 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (14 papers) and Advanced Sensor and Energy Harvesting Materials (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (483 citations), Polymers and Plastics (96 citations) and Mechanics of Materials (146 citations). Q.K. Tong has collaborated with scholars based in United States, China and Singapore. Frequent co-authors include Daoqiang Lu, C.P. Wong, Ching‐Ping Wong, A. Savoca, Dabiao Lu, Songtao Wu, Luu Nguyen, Jing Wang, Zhiqiang Yuan and Chen Sun. Their work appears in journals such as SHILAP Revista de lepidopterología, Information Sciences and Neural Networks.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.