Hidekazu Kikuchi

456 total citations
21 papers, 258 citations indexed

About

Hidekazu Kikuchi is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Computer Vision and Pattern Recognition. According to data from OpenAlex, Hidekazu Kikuchi has authored 21 papers receiving a total of 258 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 6 papers in Automotive Engineering and 3 papers in Computer Vision and Pattern Recognition. Recurrent topics in Hidekazu Kikuchi's work include 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (11 papers) and Additive Manufacturing and 3D Printing Technologies (6 papers). Hidekazu Kikuchi is often cited by papers focused on 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (11 papers) and Additive Manufacturing and 3D Printing Technologies (6 papers). Hidekazu Kikuchi collaborates with scholars based in Japan, United States and Taiwan. Hidekazu Kikuchi's co-authors include Yasumitsu Orii, Fumiaki Yamada, Katsuyuki Sakuma, S. Matsui, Keiji Matsumoto, Osamu Kato, Hiroaki Ikeda, Yoichiro Kurita, Junji Yamada and Nobuaki Takahashi and has published in prestigious journals such as Japanese Journal of Applied Physics, IEEE Transactions on Nuclear Science and Echocardiography.

In The Last Decade

Hidekazu Kikuchi

21 papers receiving 242 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Hidekazu Kikuchi Japan 8 237 61 39 19 16 21 258
T. Enot France 10 241 1.0× 58 1.0× 93 2.4× 15 0.8× 11 0.7× 21 278
M. Matsuo Japan 8 270 1.1× 41 0.7× 53 1.4× 16 0.8× 25 1.6× 21 284
Gokul Kumar United States 6 223 0.9× 22 0.4× 48 1.2× 11 0.6× 10 0.6× 15 243
Yoichiro Kurita Japan 9 374 1.6× 47 0.8× 67 1.7× 19 1.0× 18 1.1× 32 387
Dongseok Shin United States 8 345 1.5× 86 1.4× 47 1.2× 13 0.7× 11 0.7× 20 355
Riko Radojcic United States 11 282 1.2× 37 0.6× 38 1.0× 12 0.6× 38 2.4× 45 312
K. Soejima Japan 8 272 1.1× 33 0.5× 46 1.2× 16 0.8× 14 0.9× 16 297
Kazumasa Tanida Japan 7 344 1.5× 60 1.0× 65 1.7× 64 3.4× 15 0.9× 14 360
H.Y. Li Singapore 10 304 1.3× 44 0.7× 77 2.0× 17 0.9× 7 0.4× 35 328
Yusuke Yamada Japan 9 388 1.6× 44 0.7× 74 1.9× 47 2.5× 7 0.4× 42 415

Countries citing papers authored by Hidekazu Kikuchi

Since Specialization
Citations

This map shows the geographic impact of Hidekazu Kikuchi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hidekazu Kikuchi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hidekazu Kikuchi more than expected).

Fields of papers citing papers by Hidekazu Kikuchi

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hidekazu Kikuchi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hidekazu Kikuchi. The network helps show where Hidekazu Kikuchi may publish in the future.

Co-authorship network of co-authors of Hidekazu Kikuchi

This figure shows the co-authorship network connecting the top 25 collaborators of Hidekazu Kikuchi. A scholar is included among the top collaborators of Hidekazu Kikuchi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hidekazu Kikuchi. Hidekazu Kikuchi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Izumo, Masaki, Yukio Satô, Junko Miyamoto, et al.. (2022). Additive value of the right parasternal view for the assessment of aortic stenosis. Echocardiography. 39(10). 1338–1343. 1 indexed citations
2.
Watanabe, Naoya, Hidekazu Kikuchi, H. Shimamoto, et al.. (2019). Fabrication and stacking of through-silicon-via array chip formed by notchless Si etching and wet cleaning of first metal layer. Japanese Journal of Applied Physics. 58(SD). SDDL09–SDDL09. 2 indexed citations
3.
Watanabe, Naoya, Hidekazu Kikuchi, H. Shimamoto, et al.. (2017). Metal Contamination Evaluation of Via-Last Cu TSV Process Using Notchless Si Etching and Wet Cleaning of the First Metal Layer. 655–660. 1 indexed citations
4.
Watanabe, Naoya, Hidekazu Kikuchi, H. Shimamoto, et al.. (2017). Development of a high-yield via-last through silicon via process using notchless silicon etching and wet cleaning of the first metal layer. Japanese Journal of Applied Physics. 56(7S2). 07KE02–07KE02. 8 indexed citations
5.
Kikuchi, Hidekazu, et al.. (2016). Real-world live 4K ultra HD broadcasting with high dynamic range. 3 (8 .)–3 (8 .). 1 indexed citations
6.
Watanabe, Naoya, H. Shimamoto, Katsuya Kikuchi, et al.. (2016). Wet cleaning process for high-yield via-last TSV formation. 1–4. 3 indexed citations
7.
Furuta, F., et al.. (2013). Fabricating 3D integrated CMOS devices by using wafer stacking and via-last TSV technologies. 12. 29.5.1–29.5.4. 26 indexed citations
8.
Matsumoto, K., Katsuyuki Sakuma, Hidekazu Kikuchi, et al.. (2013). Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack. 1–8. 1 indexed citations
9.
Matsumoto, Keiji, Katsuyuki Sakuma, Hidekazu Kikuchi, et al.. (2013). Thermal design guidelines for a three-dimensional (3D) chip stack, including cooling solutions. 1–6. 12 indexed citations
10.
11.
Takeda, Ken’ichi, et al.. (2012). Three-dimensional integration scheme using hybrid wafer bonding and via-last TSV process. 1–4. 2 indexed citations
12.
Matsumoto, Keiji, et al.. (2011). Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack. 26 indexed citations
13.
Yamada, Fumiaki, et al.. (2011). TSV diagnostics by X-ray microscopy. 695–698. 7 indexed citations
14.
Matsumoto, K., et al.. (2010). Thermal resistance evaluation of a three-dimensional (3D) chip stack. 23. 614–619. 5 indexed citations
15.
Sakuma, Katsuyuki, Sayuri Kohara, K. Matsumoto, et al.. (2010). High density 3D integration by pre-applied Inter Chip Fill. j88 c. 1–5. 2 indexed citations
16.
Kurita, Yoichiro, S. Matsui, Nobuaki Takahashi, et al.. (2007). A 3D Stacked Memory Integrated on a Logic Device Using SMAFTI Technology. 821–829. 53 indexed citations
17.
Kato, Osamu, Hidekazu Kikuchi, Junji Yamada, et al.. (2006). Development of 3D-Packaging Process Technology for Stacked Memory Chips. MRS Proceedings. 970. 22 indexed citations
18.
Kawano, M., Nobuaki Takahashi, Yoichiro Kurita, et al.. (2006). A 3D Packaging Technology for 4 Gbit Stacked DRAM with 3 Gbps Data Transfer. 1–4. 59 indexed citations
19.
Kikuchi, Hidekazu, et al.. (2002). TWIN: a parallel scheme for a production system featuring both control and data parallelism. i. 64–70. 1 indexed citations
20.
Kikuchi, Hidekazu, et al.. (1999). A 1‐bit serial transceiver chip set for full‐color XGA pictures. SID Symposium Digest of Technical Papers. 30(1). 122–125. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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