Bite Zhou

625 total citations
20 papers, 535 citations indexed

About

Bite Zhou is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering and Mechanical Engineering. According to data from OpenAlex, Bite Zhou has authored 20 papers receiving a total of 535 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Electrical and Electronic Engineering, 9 papers in Aerospace Engineering and 6 papers in Mechanical Engineering. Recurrent topics in Bite Zhou's work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (13 papers) and Aluminum Alloy Microstructure Properties (9 papers). Bite Zhou is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (13 papers) and Aluminum Alloy Microstructure Properties (9 papers). Bite Zhou collaborates with scholars based in United States, China and Germany. Bite Zhou's co-authors include Thomas R. Bieler, Tae-Kyu Lee, Quan Zhou, A. Zamiri, Farhang Pourboghrat, Wenjun Liu, Abhijit Dasgupta, Chad M. Parish, Bo Liu and Kuo-Chuan Liu and has published in prestigious journals such as Journal of Electronic Materials, IEEE Transactions on Components Packaging and Manufacturing Technology and Michigan State University Libraries.

In The Last Decade

Bite Zhou

20 papers receiving 519 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Bite Zhou United States 13 501 321 142 129 94 20 535
Adwait U. Telang United States 7 438 0.9× 310 1.0× 127 0.9× 106 0.8× 99 1.1× 9 476
Zijie Cai United States 8 661 1.3× 430 1.3× 243 1.7× 141 1.1× 32 0.3× 12 678
Timothy Gosselin United States 8 759 1.5× 557 1.7× 203 1.4× 72 0.6× 59 0.6× 8 778
L. Zavalij United States 12 492 1.0× 351 1.1× 129 0.9× 59 0.5× 61 0.6× 14 523
Sudan Ahmed United States 13 471 0.9× 269 0.8× 179 1.3× 88 0.7× 24 0.3× 25 493
Polina Snugovsky Canada 12 344 0.7× 212 0.7× 88 0.6× 30 0.2× 33 0.4× 30 372
S. G. Jadhav United States 8 262 0.5× 201 0.6× 88 0.6× 42 0.3× 50 0.5× 12 293
Zhixian Min China 14 440 0.9× 439 1.4× 102 0.7× 23 0.2× 113 1.2× 29 554
A. Fawzy Egypt 13 687 1.4× 663 2.1× 157 1.1× 48 0.4× 71 0.8× 24 767
G.Y. Li Singapore 8 298 0.6× 261 0.8× 71 0.5× 36 0.3× 28 0.3× 12 352

Countries citing papers authored by Bite Zhou

Since Specialization
Citations

This map shows the geographic impact of Bite Zhou's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bite Zhou with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bite Zhou more than expected).

Fields of papers citing papers by Bite Zhou

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Bite Zhou. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bite Zhou. The network helps show where Bite Zhou may publish in the future.

Co-authorship network of co-authors of Bite Zhou

This figure shows the co-authorship network connecting the top 25 collaborators of Bite Zhou. A scholar is included among the top collaborators of Bite Zhou based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Bite Zhou. Bite Zhou is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhou, Quan, Bite Zhou, Tae-Kyu Lee, & Thomas R. Bieler. (2016). Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling. Journal of Electronic Materials. 45(6). 3013–3024. 22 indexed citations
2.
3.
Zhou, Bite, et al.. (2015). Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages. Journal of Electronic Materials. 44(3). 895–908. 42 indexed citations
4.
Dasgupta, Abhijit, et al.. (2014). Multiscale Modeling of the Effect of Micro-alloying Mn and Sb on the Viscoplastic Response of SAC105 Solder. Journal of Electronic Materials. 43(4). 1119–1130. 9 indexed citations
5.
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Zhou, Bite, et al.. (2013). Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications. Journal of Electronic Materials. 43(1). 57–68. 22 indexed citations
7.
Lee, Tae-Kyu, Bite Zhou, & Thomas R. Bieler. (2012). Impact of Isothermal Aging and Sn Grain Orientation on the Long-Term Reliability of Wafer-Level Chip-Scale Package Sn–Ag–Cu Solder Interconnects. IEEE Transactions on Components Packaging and Manufacturing Technology. 2(3). 496–501. 14 indexed citations
8.
Zhou, Bite, et al.. (2012). The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance. Journal of Electronic Materials. 42(2). 215–223. 15 indexed citations
9.
Zhou, Bite, Thomas R. Bieler, Tae-Kyu Lee, & Wenjun Liu. (2012). Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD. Journal of Electronic Materials. 42(2). 319–331. 31 indexed citations
10.
Zhou, Bite. (2012). Characterization of tin crystal orientation evolution during thermal cycling in lead-free solder joints. Michigan State University Libraries. 8 indexed citations
11.
Lee, Tae-Kyu, Weidong Xie, Bite Zhou, Thomas R. Bieler, & Kuo-Chuan Liu. (2011). Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects. Journal of Electronic Materials. 40(9). 1967–1976. 13 indexed citations
12.
Bieler, Thomas R., et al.. (2011). The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints. Journal of Electronic Materials. 41(2). 283–301. 99 indexed citations
13.
Zhou, Bite, et al.. (2011). In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders. Journal of Electronic Materials. 41(2). 262–272. 9 indexed citations
14.
Bieler, Thomas R., Bite Zhou, A. Zamiri, et al.. (2011). The role of elastic and plastic anisotropy of Sn on microstructure and damage evolution in lead-free solder joints. 5F.1.1–5F.1.9. 7 indexed citations
15.
Lee, Tae-Kyu, et al.. (2011). Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects. Journal of Electronic Materials. 40(9). 1895–1902. 21 indexed citations
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19.
Zhou, Bite, et al.. (2010). Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface. Journal of Electronic Materials. 39(12). 2669–2679. 59 indexed citations
20.
Zhou, Bite, et al.. (2009). Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear. Journal of Electronic Materials. 38(12). 2702–2711. 57 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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