Myung-Jin Yim

680 total citations
25 papers, 557 citations indexed

About

Myung-Jin Yim is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanics of Materials. According to data from OpenAlex, Myung-Jin Yim has authored 25 papers receiving a total of 557 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 6 papers in Mechanics of Materials. Recurrent topics in Myung-Jin Yim's work include Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (18 papers) and Advanced Sensor and Energy Harvesting Materials (6 papers). Myung-Jin Yim is often cited by papers focused on Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (18 papers) and Advanced Sensor and Energy Harvesting Materials (6 papers). Myung-Jin Yim collaborates with scholars based in South Korea, United States and Singapore. Myung-Jin Yim's co-authors include Kyung-Wook Paik, Kyung‐Wook Paik, Woon‐Seong Kwon, Young-Doo Jeon, Soon-Bok Lee, Joungho Kim, Jin-Sang Hwang, Jun-Ho Lee, Seungyoung Ahn and Hyoung-Joon Kim and has published in prestigious journals such as Journal of Electronic Materials, IEEE Transactions on Components and Packaging Technologies and IEEE Transactions on Advanced Packaging.

In The Last Decade

Myung-Jin Yim

24 papers receiving 510 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Myung-Jin Yim South Korea 10 524 138 124 114 28 25 557
Woon‐Seong Kwon South Korea 15 450 0.9× 102 0.7× 88 0.7× 72 0.6× 34 1.2× 30 487
J. Liu Sweden 15 432 0.8× 163 1.2× 136 1.1× 96 0.8× 55 2.0× 40 550
Olaf Wittler Germany 13 468 0.9× 150 1.1× 88 0.7× 151 1.3× 20 0.7× 97 598
Poi-Siong Teo Singapore 11 298 0.6× 73 0.5× 52 0.4× 136 1.2× 20 0.7× 18 372
H. Frémont France 12 365 0.7× 73 0.5× 62 0.5× 129 1.1× 14 0.5× 68 424
Jan Felba Poland 11 314 0.6× 61 0.4× 127 1.0× 94 0.8× 8 0.3× 81 416
Ser Choong Chong Singapore 12 446 0.9× 35 0.3× 99 0.8× 58 0.5× 15 0.5× 96 488
Su‐Tsai Lu Taiwan 11 322 0.6× 48 0.3× 51 0.4× 103 0.9× 8 0.3× 32 369
Changsoo Jang United States 12 273 0.5× 133 1.0× 64 0.5× 107 0.9× 32 1.1× 37 384
Klaus-Juergen Wolter Germany 12 318 0.6× 56 0.4× 62 0.5× 164 1.4× 21 0.8× 48 393

Countries citing papers authored by Myung-Jin Yim

Since Specialization
Citations

This map shows the geographic impact of Myung-Jin Yim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Myung-Jin Yim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Myung-Jin Yim more than expected).

Fields of papers citing papers by Myung-Jin Yim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Myung-Jin Yim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Myung-Jin Yim. The network helps show where Myung-Jin Yim may publish in the future.

Co-authorship network of co-authors of Myung-Jin Yim

This figure shows the co-authorship network connecting the top 25 collaborators of Myung-Jin Yim. A scholar is included among the top collaborators of Myung-Jin Yim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Myung-Jin Yim. Myung-Jin Yim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kim, Hyoung-Joon, et al.. (2009). Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection. IEEE Transactions on Electronics Packaging Manufacturing. 32(4). 241–247. 17 indexed citations
2.
Son, Hwa–Young, et al.. (2007). Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs). IEEE Transactions on Electronics Packaging Manufacturing. 30(3). 221–227. 11 indexed citations
3.
4.
Kwon, Woon‐Seong, et al.. (2005). Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation. Journal of Electronic Packaging. 127(2). 86–90. 43 indexed citations
5.
Yim, Myung-Jin, Jin-Sang Hwang, Jingu Kim, et al.. (2004). Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications. 159–164. 2 indexed citations
6.
7.
Yim, Myung-Jin, et al.. (2003). Highly reliable non-conductive adhesives for flip chip CSP applications. IEEE Transactions on Electronics Packaging Manufacturing. 26(2). 150–155. 30 indexed citations
8.
Kwon, Woon‐Seong, et al.. (2002). High- reliability nonconductive adhesives for flip chip interconnections. 22. 34–38. 6 indexed citations
9.
Yim, Myung-Jin & Kyung‐Wook Paik. (2002). Design and understanding of anisotropic conductive films (ACFs) for LCD packaging. 233–242. 3 indexed citations
10.
Paik, Kyung-Wook, Myung-Jin Yim, & Young-Doo Jeon. (2002). Flip chip assembly on organic boards using anisotropic conductive adhesives (ACAs) and nickel/gold bumps. 378–384. 7 indexed citations
11.
Yim, Myung-Jin & Kyung-Wook Paik. (2001). Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates. IEEE Transactions on Components and Packaging Technologies. 24(1). 24–32. 36 indexed citations
12.
Yim, Myung-Jin, et al.. (2000). High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm. IEEE Transactions on Components and Packaging Technologies. 23(3). 542–545. 14 indexed citations
13.
Yim, Myung-Jin, et al.. (2000). Anisotropic conductive film (ACF) flip-chip interconnect in over GHz RF clock distribution system. 153–158. 1 indexed citations
14.
Yim, Myung-Jin, Young-Doo Jeon, & Kyung‐Wook Paik. (1999). FLIP CHIP ON ORGANIC BOARD TECHNOLOGY USING MODIFIED ANISOTROPIC CONDUCTIVE FILMS AND ELECTROLESS NICKEL/GOLD BUMP. Journal of the Microelectronics and Packaging Society. 6(2). 13–21. 1 indexed citations
15.
Ahn, Seungyoung, Myung-Jin Yim, Jun-Ho Lee, et al.. (1999). Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls. 421–425. 9 indexed citations
16.
Yim, Myung-Jin, Junho Lee, Young-Doo Jeon, et al.. (1999). Microwave frequency model of flip-chip interconnects using anisotropic conductive film. 3830. 311–315. 5 indexed citations
17.
18.
Yim, Myung-Jin & Kyung-Wook Paik. (1999). The contact resistance and reliability of anisotropically conductive film (ACF). IEEE Transactions on Advanced Packaging. 22(2). 166–173. 106 indexed citations
19.
Yim, Myung-Jin, Young-Doo Jeon, Jun-Ho Lee, et al.. (1999). Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications. IEEE Transactions on Components and Packaging Technologies. 22(4). 575–581. 32 indexed citations
20.
Yim, Myung-Jin & Kyung-Wook Paik. (1998). Design and understanding of anisotropic conductive films (ACF's) for LCD packaging. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 21(2). 226–234. 141 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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