Myung-Jin Yim
- Electrical and Electronic Engineering top 10%
- Mechanics of Materials top 10%
- Biomedical Engineering
- Mechanical Engineering
- Polymers and Plastics
- Co-authors
- Kyung-Wook PaikKyung‐Wook PaikWoon‐Seong KwonJin-Sang HwangJoungho KimSoon-Bok LeeYoung-Doo JeonJun-Ho Lee
- Topics
- Electronic Packaging and Soldering Technologies (23 papers)3D IC and TSV technologies (18 papers)Advanced Sensor and Energy Harvesting Materials (6 papers)
- Journals
- Journal of Electronic MaterialsIEEE Transactions on Components and Packaging TechnologiesIEEE Transactions on Advanced Packaging
- Partner nations
- South KoreaUnited StatesSingapore
In The Last Decade
Myung-Jin Yim
24 papers receiving 510 citations
Peers
Comparison fields: 5 of 34
- Electrical and Electronic Engineering 524
- Mechanics of Materials 138
- Biomedical Engineering 124
- Mechanical Engineering 114
- Polymers and Plastics 28
Countries citing papers authored by Myung-Jin Yim
This map shows the geographic impact of Myung-Jin Yim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Myung-Jin Yim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Myung-Jin Yim more than expected).
Fields of papers citing papers by Myung-Jin Yim
This network shows the impact of papers produced by Myung-Jin Yim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Myung-Jin Yim. The network helps show where Myung-Jin Yim may publish in the future.
Co-authorship network of co-authors of Myung-Jin Yim
This figure shows the co-authorship network connecting the top 25 collaborators of Myung-Jin Yim. A scholar is included among the top collaborators of Myung-Jin Yim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Myung-Jin Yim. Myung-Jin Yim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 17 | |
| 2 | 11 | |
| 3 | 2 | |
| 4 | 43 | |
| 5 | 2 | |
| 6 | 3 | |
| 7 | 30 | |
| 8 | 6 | |
| 9 | 69 | |
| 10 | 4 | |
| 11 | 5 | |
| 12 | 36 | |
| 13 | 14 | |
| 14 | 1 | |
| 15 | FLIP CHIP ON ORGANIC BOARD TECHNOLOGY USING MODIFIED ANISOTROPIC CONDUCTIVE FILMS AND ELECTROLESS NICKEL/GOLD BUMP | 1 |
| 16 | 9 | |
| 17 | Microwave frequency model of flip-chip interconnects using anisotropic conductive film | 5 |
| 18 | 2 | |
| 19 | 106 | |
| 20 | 141 |
About Myung-Jin Yim
Myung-Jin Yim is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Industrial and Manufacturing Engineering, having authored 25 papers that have together received 557 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (18 papers) and Advanced Sensor and Energy Harvesting Materials (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (524 citations), Mechanics of Materials (138 citations) and Mechanical Engineering (114 citations). Myung-Jin Yim has collaborated with scholars based in South Korea, United States and Singapore. Frequent co-authors include Kyung-Wook Paik, Kyung‐Wook Paik, Woon‐Seong Kwon, Jin-Sang Hwang, Joungho Kim, Soon-Bok Lee, Young-Doo Jeon, Jun-Ho Lee, Seungyoung Ahn and Hyoung-Joon Kim. Their work appears in journals such as Journal of Electronic Materials, IEEE Transactions on Components and Packaging Technologies and IEEE Transactions on Advanced Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.