P.L. Tu

620 total citations
18 papers, 537 citations indexed

About

P.L. Tu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, P.L. Tu has authored 18 papers receiving a total of 537 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 4 papers in Mechanics of Materials. Recurrent topics in P.L. Tu's work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (15 papers) and Advanced Welding Techniques Analysis (6 papers). P.L. Tu is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (15 papers) and Advanced Welding Techniques Analysis (6 papers). P.L. Tu collaborates with scholars based in Hong Kong, United States and China. P.L. Tu's co-authors include J.K.L. Lai, Y.C. Chan, K.C. Hung, Y.C. Chan, Chengcheng Tang, A.C.K. So, Y. C. Chan, Yiping Wu, H. C. Ong and Chao Yang and has published in prestigious journals such as Scripta Materialia, Intermetallics and Materials Science and Engineering B.

In The Last Decade

P.L. Tu

18 papers receiving 519 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
P.L. Tu Hong Kong	10	510	358	66	47	42	18	537
G.Y. Li Singapore	8	298 0.6×	261 0.7×	71 1.1×	36 0.8×	20 0.5×	12	352
Tamás Hurtony Hungary	13	363 0.7×	243 0.7×	50 0.8×	35 0.7×	24 0.6×	43	411
Alice C. Kilgo United States	7	377 0.7×	356 1.0×	109 1.7×	60 1.3×	29 0.7×	26	454
Jong‐Kai Lin United States	12	381 0.7×	187 0.5×	33 0.5×	36 0.8×	19 0.5×	33	394
Guang Zeng China	11	548 1.1×	511 1.4×	112 1.7×	32 0.7×	39 0.9×	19	637
Pilin Liu United States	8	332 0.7×	169 0.5×	31 0.5×	42 0.9×	21 0.5×	20	377
Masazumi Amagai United States	9	508 1.0×	315 0.9×	72 1.1×	147 3.1×	15 0.4×	29	549
E. Meusel Germany	12	561 1.1×	271 0.8×	74 1.1×	112 2.4×	17 0.4×	26	594
B.S. Xiong Singapore	13	643 1.3×	387 1.1×	117 1.8×	114 2.4×	22 0.5×	16	661

Countries citing papers authored by P.L. Tu

Since Specialization

Citations

This map shows the geographic impact of P.L. Tu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P.L. Tu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P.L. Tu more than expected).

Fields of papers citing papers by P.L. Tu

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by P.L. Tu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P.L. Tu. The network helps show where P.L. Tu may publish in the future.

Co-authorship network of co-authors of P.L. Tu

This figure shows the co-authorship network connecting the top 25 collaborators of P.L. Tu. A scholar is included among the top collaborators of P.L. Tu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with P.L. Tu. P.L. Tu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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18 of 18 papers shown

Li, Xiaoqiang, Qing Jiang, P.L. Tu, et al.. (2025). Significant strength improvement in dissimilar TiAl/Ti2AlNb joints by pulsed-current diffusion welding with Ti-6Al-4V Interlayer: Multifaceted strengthening mechanisms and high-temperature performance. Intermetallics. 185. 108869–108869. 1 indexed citations

Li, Jianxing, et al.. (2011). High Melting Temperature Lead Free Solder for Die Attach Application. IMAPSource Proceedings. 2011(1). 322–326. 1 indexed citations

Chan, Y.C., Chengcheng Tang, & P.L. Tu. (2002). Endoscopic inspection of solder joint integrity in chip scale packages. 569–575. 5 indexed citations

Tang, Chengcheng, Y.C. Chan, K.C. Hung, & P.L. Tu. (2002). Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies. Journal of Electronic Packaging. 124(4). 397–402. 2 indexed citations

Tu, P.L., Y.C. Chan, Chengcheng Tang, & J.K.L. Lai. (2002). Vibration fatigue of μBGA solder joint. 1369–1375. 6 indexed citations

Tu, P.L., Y.C. Chan, K.C. Hung, & J.K.L. Lai. (2001). Growth kinetics of intermetallic compounds in chip scale package solder joint. Scripta Materialia. 44(2). 317–323. 125 indexed citations

Chan, Y.C., P.L. Tu, Chengcheng Tang, K.C. Hung, & J.K.L. Lai. (2001). Reliability studies μBGA solder joints-effect of Ni-Sn intermetallic compound. IEEE Transactions on Advanced Packaging. 24(1). 25–32. 56 indexed citations

Tu, P.L., Y.C. Chan, K.C. Hung, & J.K.L. Lai. (2001). Study of micro-BGA solder joint reliability. Microelectronics Reliability. 41(2). 287–293. 36 indexed citations

Tu, P.L., Y.C. Chan, & K.C. Hung. (2001). Reliability of microBGA assembly using no-flow underfill. Microelectronics Reliability. 41(12). 1993–2000. 9 indexed citations

10.

Tu, P.L., Y.C. Chan, & J.K.L. Lai. (2001). Effect of intermetallic compounds on vibration fatigue of μBGA solder joint. IEEE Transactions on Advanced Packaging. 24(2). 197–205. 43 indexed citations

11.

Tu, P.L.. (2001). Effecto of Intermetallic Compounds on Vibration Fatigue of μBGA Solder Joint. Medical Entomology and Zoology. 24(2). 197–205. 11 indexed citations

12.

Chan, Y.C., P.L. Tu, & K.C. Hung. (2001). Study of the self-alignment of no-flow underfill for micro-BGA assembly. Microelectronics Reliability. 41(11). 1867–1875. 14 indexed citations

13.

Hung, K.C., Y.C. Chan, H. C. Ong, P.L. Tu, & Chengcheng Tang. (2000). Effect of pinhole Au/Ni/Cu substrate on self-alignment of advanced packages. Materials Science and Engineering B. 76(2). 87–94. 9 indexed citations

14.

Lai, J.K.L., K.C. Hung, Y. C. Chan, & P.L. Tu. (2000). Comparative study of micro-BGA reliability under bending stress. IEEE Transactions on Advanced Packaging. 23(4). 750–756. 30 indexed citations

15.

Lai, J.K.L., D.P. Webb, H. C. Ong, et al.. (2000). Study of self-alignment of /spl mu/#x03BC;BGA packages. IEEE Transactions on Advanced Packaging. 23(4). 631–636. 2 indexed citations

16.

Wu, Yiping, P.L. Tu, & Y.C. Chan. (1999). The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies. Journal of Electronic Packaging. 123(3). 284–289. 7 indexed citations

17.

Tu, P.L., Y.C. Chan, & J.K.L. Lai. (1997). Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 20(1). 87–93. 122 indexed citations

18.

Chan, Y.C., P.L. Tu, A.C.K. So, & J.K.L. Lai. (1997). Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 20(4). 463–469. 58 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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