Adwait U. Telang

537 total citations
9 papers, 476 citations indexed

About

Adwait U. Telang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, Adwait U. Telang has authored 9 papers receiving a total of 476 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 3 papers in Aerospace Engineering. Recurrent topics in Adwait U. Telang's work include Electronic Packaging and Soldering Technologies (9 papers), Advanced Welding Techniques Analysis (4 papers) and Aluminum Alloy Microstructure Properties (3 papers). Adwait U. Telang is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), Advanced Welding Techniques Analysis (4 papers) and Aluminum Alloy Microstructure Properties (3 papers). Adwait U. Telang collaborates with scholars based in United States. Adwait U. Telang's co-authors include Thomas R. Bieler, A. Zamiri, Farhang Pourboghrat, K. N. Subramanian, L.P. Lehman, J. P. Lucas, Yan Xing, E. J. Cotts, M.A. Crimp and D.E. Mason and has published in prestigious journals such as Acta Materialia, Materials Science and Engineering A and Scripta Materialia.

In The Last Decade

Adwait U. Telang

9 papers receiving 457 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Adwait U. Telang United States	7	438	310	127	106	99	9	476
Bite Zhou United States	13	501 1.1×	321 1.0×	142 1.1×	129 1.2×	94 0.9×	20	535
Timothy Gosselin United States	8	759 1.7×	557 1.8×	203 1.6×	72 0.7×	59 0.6×	8	778
Zijie Cai United States	8	661 1.5×	430 1.4×	243 1.9×	141 1.3×	32 0.3×	12	678
Hirohiko Watanabe Japan	10	177 0.4×	285 0.9×	43 0.3×	74 0.7×	163 1.6×	31	357
Zhixian Min China	14	440 1.0×	439 1.4×	102 0.8×	23 0.2×	113 1.1×	29	554
Kazuya Miyahara Japan	12	109 0.2×	295 1.0×	100 0.8×	83 0.8×	193 1.9×	42	412
Polina Snugovsky Canada	12	344 0.8×	212 0.7×	88 0.7×	30 0.3×	33 0.3×	30	372
T. Shoji Japan	6	313 0.7×	301 1.0×	33 0.3×	42 0.4×	114 1.2×	8	425
Janne J. Sundelin Finland	8	304 0.7×	188 0.6×	63 0.5×	46 0.4×	36 0.4×	12	343
C.J. Hang China	8	280 0.6×	223 0.7×	69 0.5×	49 0.5×	55 0.6×	9	381

Countries citing papers authored by Adwait U. Telang

Since Specialization

Citations

This map shows the geographic impact of Adwait U. Telang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Adwait U. Telang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Adwait U. Telang more than expected).

Fields of papers citing papers by Adwait U. Telang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Adwait U. Telang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Adwait U. Telang. The network helps show where Adwait U. Telang may publish in the future.

Co-authorship network of co-authors of Adwait U. Telang

This figure shows the co-authorship network connecting the top 25 collaborators of Adwait U. Telang. A scholar is included among the top collaborators of Adwait U. Telang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Adwait U. Telang. Adwait U. Telang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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9 of 9 papers shown

Bieler, Thomas R. & Adwait U. Telang. (2009). Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During Simple Shear at 25°C and 0.1/s. Journal of Electronic Materials. 38(12). 2694–2701. 38 indexed citations

Telang, Adwait U., Thomas R. Bieler, A. Zamiri, & Farhang Pourboghrat. (2007). Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint. Acta Materialia. 55(7). 2265–2277. 98 indexed citations

Telang, Adwait U. & Thomas R. Bieler. (2005). The Role of Special Boundaries during Solidification and Microstructure Evolution in Lead Free Solder Joints. Materials science forum. 495-497. 1419–1424. 4 indexed citations

Telang, Adwait U., Thomas R. Bieler, & M.A. Crimp. (2005). Grain boundary sliding on near-7°, 14°, and 22° special boundaries during thermomechanical cycling in surface-mount lead-free solder joint specimens. Materials Science and Engineering A. 421(1-2). 22–34. 32 indexed citations

Telang, Adwait U. & Thomas R. Bieler. (2005). Characterization of microstructure and crystal orientation of the tin phase in single shear lap Sn–3.5Ag solder joint specimens. Scripta Materialia. 52(10). 1027–1031. 68 indexed citations

Telang, Adwait U. & Thomas R. Bieler. (2005). The orientation imaging microscopy of lead-free Sn-Ag solder joints. JOM. 57(6). 44–49. 81 indexed citations

Telang, Adwait U. & Thomas R. Bieler. (2005). Dislocation Activity and Slip Analysis Contributing to Grain Boundary Sliding and Damage during Thermomechanical Fatigue in Dual Shear Lead-Free Solder Joint Specimens. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 105. 219–226. 6 indexed citations

Telang, Adwait U., Thomas R. Bieler, J. P. Lucas, et al.. (2004). Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys. Journal of Electronic Materials. 33(12). 1412–1423. 121 indexed citations

Telang, Adwait U., Thomas R. Bieler, D.E. Mason, & K. N. Subramanian. (2003). Comparisons of experimental and computed crystal rotations caused by slip in crept and thermomechanically fatigued dual-shear eutectic Sn-Ag solder joints. Journal of Electronic Materials. 32(12). 1455–1462. 28 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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