A. M. El-Taher

862 total citations
26 papers, 723 citations indexed

About

A. M. El-Taher is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, A. M. El-Taher has authored 26 papers receiving a total of 723 indexed citations (citations by other indexed papers that have themselves been cited), including 26 papers in Electrical and Electronic Engineering, 24 papers in Mechanical Engineering and 6 papers in Aerospace Engineering. Recurrent topics in A. M. El-Taher's work include Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (10 papers) and Advanced Welding Techniques Analysis (9 papers). A. M. El-Taher is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (10 papers) and Advanced Welding Techniques Analysis (9 papers). A. M. El-Taher collaborates with scholars based in Egypt, Saudi Arabia and Palestinian Territory. A. M. El-Taher's co-authors include A.A. El-Daly, A. Fawzy, S.A. Mazen, A.E. Hammad, A.A. Ibrahiem, H. Algarni, H. Elhosiny Ali and Shehab A. Mansour and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Journal of Alloys and Compounds.

In The Last Decade

A. M. El-Taher

25 papers receiving 711 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
A. M. El-Taher Egypt 13 664 556 146 86 59 26 723
Yi-Wun Wang Taiwan 14 684 1.0× 535 1.0× 82 0.6× 58 0.7× 84 1.4× 35 750
Omid Mokhtari Japan 14 739 1.1× 610 1.1× 116 0.8× 52 0.6× 30 0.5× 38 796
J. Read Australia 14 630 0.9× 478 0.9× 147 1.0× 53 0.6× 25 0.4× 21 668
Moon Gi Cho South Korea 15 520 0.8× 381 0.7× 123 0.8× 42 0.5× 48 0.8× 26 554
J. K. Lin United States 6 606 0.9× 428 0.8× 115 0.8× 30 0.3× 54 0.9× 8 616
H. K. Kim United States 7 502 0.8× 364 0.7× 67 0.5× 39 0.5× 38 0.6× 9 526
K. N. Tu United States 9 813 1.2× 398 0.7× 109 0.7× 67 0.8× 301 5.1× 12 848
Zhixian Min China 14 440 0.7× 439 0.8× 102 0.7× 113 1.3× 15 0.3× 29 554
Timothy Gosselin United States 8 759 1.1× 557 1.0× 203 1.4× 59 0.7× 30 0.5× 8 778
G.T. Galyon United States 9 424 0.6× 243 0.4× 72 0.5× 77 0.9× 101 1.7× 15 488

Countries citing papers authored by A. M. El-Taher

Since Specialization
Citations

This map shows the geographic impact of A. M. El-Taher's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. M. El-Taher with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. M. El-Taher more than expected).

Fields of papers citing papers by A. M. El-Taher

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by A. M. El-Taher. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. M. El-Taher. The network helps show where A. M. El-Taher may publish in the future.

Co-authorship network of co-authors of A. M. El-Taher

This figure shows the co-authorship network connecting the top 25 collaborators of A. M. El-Taher. A scholar is included among the top collaborators of A. M. El-Taher based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with A. M. El-Taher. A. M. El-Taher is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
El-Taher, A. M., et al.. (2025). Optimizing the performance of Sn–Cu alloys via microalloying with Ni and Zn: a study on microstructure, thermal, and mechanical properties. Journal of Materials Science Materials in Electronics. 36(2). 4 indexed citations
3.
Ali, H. Elhosiny, A. M. El-Taher, & H. Algarni. (2024). Influence of bismuth addition on the physical and mechanical properties of low silver/lead-free Sn-Ag-Cu solder. Materials Today Communications. 39. 109113–109113. 6 indexed citations
4.
El-Taher, A. M., H. Elhosiny Ali, & H. Algarni. (2024). Investigating the influence of rotating magnetic field (RMF) on intermetallic compound crystallization, thermal and mechanical properties in lead-free Sn-Ag-Cu solder alloys during solidification. Materials Today Communications. 39. 109002–109002. 1 indexed citations
5.
El-Taher, A. M., H. Elhosiny Ali, & H. Algarni. (2024). Enhancing performance of Sn–Ag–Cu alloy through germanium additions: Investigating microstructure, thermal characteristics, and mechanical properties. Materials Today Communications. 38. 108315–108315. 5 indexed citations
6.
El-Taher, A. M., et al.. (2023). Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy. Journal of Materials Science Materials in Electronics. 34(7). 12 indexed citations
7.
El-Taher, A. M., et al.. (2023). Robust effects of In, Fe, and Co additions on microstructures, thermal, and mechanical properties of hypoeutectic Sn–Zn-based lead-free solder alloy. Journal of Materials Science Materials in Electronics. 34(7). 6 indexed citations
8.
El-Taher, A. M.. (2023). A high-performance Sn–Sb–Cu alloy processed by pressure heat treatment: microstructure, thermal and mechanical properties. Journal of Materials Science Materials in Electronics. 34(23). 1 indexed citations
9.
Mansour, Shehab A., et al.. (2022). The dynamic and static mechanical characteristics of Sn-7Zn-based solder alloy modified with microalloying of In, Fe and Co elements. Journal of Materials Science Materials in Electronics. 33(36). 26728–26743. 4 indexed citations
10.
El-Taher, A. M., et al.. (2021). Viscoplastic Creep Characterization of Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free Solders for Electronics Applications. Arab Journal of Nuclear Sciences and Applications. 54(1). 85–96. 1 indexed citations
11.
El-Taher, A. M., et al.. (2021). Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field. Journal of Materials Science Materials in Electronics. 32(5). 6199–6213. 12 indexed citations
12.
El-Taher, A. M., et al.. (2020). Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead-Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi. Metals and Materials International. 27(10). 4294–4305. 24 indexed citations
13.
El-Daly, A.A., et al.. (2014). Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products. Materials & Design (1980-2015). 65. 796–805. 84 indexed citations
14.
El-Daly, A.A., et al.. (2014). Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly. Journal of Alloys and Compounds. 627. 268–275. 118 indexed citations
15.
El-Daly, A.A. & A. M. El-Taher. (2013). Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters. Materials & Design (1980-2015). 47. 607–614. 59 indexed citations
16.
El-Daly, A.A., et al.. (2013). Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders. Materials & Design (1980-2015). 55. 309–318. 56 indexed citations
17.
El-Daly, A.A., et al.. (2013). Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder. Journal of Alloys and Compounds. 587. 32–39. 75 indexed citations
18.
El-Daly, A.A., et al.. (2011). Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu. Journal of Alloys and Compounds. 509(13). 4574–4582. 84 indexed citations
19.
El-Daly, A.A., et al.. (2010). Creep behavior of near-peritectic Sn–5Sb solders containing small amount of Ag and Cu. Materials Science and Engineering A. 528(3). 1055–1062. 46 indexed citations
20.
Mazen, S.A. & A. M. El-Taher. (2010). The conduction mechanism of Cu–Ge ferrite. Solid State Communications. 150(35-36). 1719–1724. 24 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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