J. K. Lin
Impact in
- General Materials Science top 2%
- Metallurgical and Alloy Processes
- Mechanical Engineering top 5%
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloys Composites Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 7
- 3D IC and TSV technologies 4
- Wireless Power Transfer Systems 1
-
- Intermetallics and Advanced Alloy Properties 5
- Advanced Welding Techniques Analysis 2
- Aluminum Alloys Composites Properties 1
- Co-authors
- D. R. Frear (7 shared papers)Jihun Jang (3 shared papers)J. W. Jang (2 shared papers)J.K. Kivilahti (1 shared paper)K. N. Tu (1 shared paper)S.-M. Kuo (1 shared paper)Woon‐Seop Choi (1 shared paper)Ke Zeng (1 shared paper)
- Journals
- Journal of Electronic Materials (2 papers)Journal of materials research/Pratt's guide to venture capital sources (2 papers)Journal of Electronic Packaging (1 paper)Applied Physics Letters (1 paper)JOM (1 paper)
- Partner nations
- United StatesTaiwanSouth Korea
In The Last Decade
J. K. Lin
7 papers receiving 586 citations
Peers
Comparison fields: 5 of 23
- General Materials Science 41
- Mechanical Engineering 428
- Electrical and Electronic Engineering 606
- Aerospace Engineering 115
- Electronic, Optical and Magnetic Materials 54
Countries citing papers authored by J. K. Lin
This map shows the geographic impact of J. K. Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. K. Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. K. Lin more than expected).
Fields of papers citing papers by J. K. Lin
This network shows the impact of papers produced by J. K. Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. K. Lin. The network helps show where J. K. Lin may publish in the future.
Co-authors
The 14 scholars most cited alongside J. K. Lin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2001 | 271 | |
| 2 | 2002 | 227 | |
| 3 | 2004 | 43 | |
| 4 | 2005 | 34 | |
| 5 | 2001 | 26 | |
| 6 | 2007 | 12 | |
| 7 | 2007 | 3 | |
| 8 | 2023 | 0 |
About J. K. Lin
J. K. Lin is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Automotive Engineering, Aerospace Engineering and Electronic, Optical and Magnetic Materials, having authored 8 papers that have together received 616 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (7 papers), Intermetallics and Advanced Alloy Properties (5 papers), 3D IC and TSV technologies (4 papers), Advanced Welding Techniques Analysis (2 papers), Aluminum Alloys Composites Properties (1 paper), Copper Interconnects and Reliability (1 paper), Wireless Power Transfer Systems (1 paper) and Advanced Battery Technologies Research (1 paper). The work is most often cited by research in General Materials Science (41 citations), Mechanical Engineering (428 citations), Electrical and Electronic Engineering (606 citations), Aerospace Engineering (115 citations) and Electronic, Optical and Magnetic Materials (54 citations). J. K. Lin has collaborated with scholars based in United States, Taiwan and South Korea. Frequent co-authors include D. R. Frear, Jihun Jang, J. W. Jang, J.K. Kivilahti, K. N. Tu, S.-M. Kuo, Woon‐Seop Choi, Ke Zeng, Douglas C. Hopkins and Cemal Basaran. Their work appears in journals such as Journal of Electronic Materials, Journal of materials research/Pratt's guide to venture capital sources, Journal of Electronic Packaging, Applied Physics Letters and JOM.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.