J. K. Lin

705 total citations
8 papers, 616 citations indexed

About

J. K. Lin is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, J. K. Lin has authored 8 papers receiving a total of 616 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 1 paper in Automotive Engineering. Recurrent topics in J. K. Lin's work include Electronic Packaging and Soldering Technologies (7 papers), Intermetallics and Advanced Alloy Properties (5 papers) and 3D IC and TSV technologies (4 papers). J. K. Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Intermetallics and Advanced Alloy Properties (5 papers) and 3D IC and TSV technologies (4 papers). J. K. Lin collaborates with scholars based in United States, South Korea and Finland. J. K. Lin's co-authors include D. R. Frear, Jihun Jang, J. W. Jang, K. N. Tu, Woon‐Seop Choi, Ke Zeng, J.K. Kivilahti, S.-M. Kuo, Douglas C. Hopkins and Cemal Basaran and has published in prestigious journals such as Applied Physics Letters, Journal of materials research/Pratt's guide to venture capital sources and JOM.

In The Last Decade

J. K. Lin

7 papers receiving 586 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
J. K. Lin United States	6	606	428	115	54	41	8	616
M. Li Singapore	9	535 0.9×	404 0.9×	57 0.5×	61 1.1×	46 1.1×	10	557
Yi-Wun Wang Taiwan	14	684 1.1×	535 1.3×	82 0.7×	84 1.6×	55 1.3×	35	750
Omid Mokhtari Japan	14	739 1.2×	610 1.4×	116 1.0×	30 0.6×	44 1.1×	38	796
J. Read Australia	14	630 1.0×	478 1.1×	147 1.3×	25 0.5×	74 1.8×	21	668
H. K. Kim United States	7	502 0.8×	364 0.9×	67 0.6×	38 0.7×	47 1.1×	9	526
J. W. Jang United States	5	385 0.6×	292 0.7×	74 0.6×	38 0.7×	28 0.7×	6	396
Moon Gi Cho South Korea	15	520 0.9×	381 0.9×	123 1.1×	48 0.9×	53 1.3×	26	554
A. M. El-Taher Egypt	13	664 1.1×	556 1.3×	146 1.3×	59 1.1×	40 1.0×	26	723
Jerome A. Rejent United States	15	783 1.3×	593 1.4×	193 1.7×	55 1.0×	80 2.0×	41	839
Chi-Won Hwang Japan	10	489 0.8×	396 0.9×	95 0.8×	14 0.3×	58 1.4×	13	512

Countries citing papers authored by J. K. Lin

Since Specialization

Citations

This map shows the geographic impact of J. K. Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. K. Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. K. Lin more than expected).

Fields of papers citing papers by J. K. Lin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. K. Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. K. Lin. The network helps show where J. K. Lin may publish in the future.

Co-authorship network of co-authors of J. K. Lin

This figure shows the co-authorship network connecting the top 25 collaborators of J. K. Lin. A scholar is included among the top collaborators of J. K. Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. K. Lin. J. K. Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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8 of 8 papers shown

1.

Lai, Ching‐Ming, et al.. (2023). A Novel Wireless Power Transfer System with Reflex-Charging and Cell-Balancing Functions. 1–6.

2.

Jang, Jihun, J. K. Lin, & D. R. Frear. (2007). Failure Morphology after the Drop Impact Test of the Ball Grid Array Package with Lead-Free Sn-3.8Ag-0.7Cu on Cu and Ni Under-Bump Metallurgies. Journal of Electronic Materials. 36(3). 207–213. 12 indexed citations

3.

Jang, J. W., et al.. (2007). Ripening-assisted void formation in the matrix of lead-free solder joints during solid-state aging. Journal of materials research/Pratt's guide to venture capital sources. 22(4). 826–830. 3 indexed citations

4.

Jang, Jihun, et al.. (2005). Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy. Journal of Electronic Materials. 34(10). L43–L46. 34 indexed citations

5.

Basaran, Cemal, et al.. (2004). Failure Modes of Flip Chip Solder Joints Under High Electric Current Density. Journal of Electronic Packaging. 127(2). 157–163. 43 indexed citations

6.

Choi, Woon‐Seop, K. N. Tu, J. W. Jang, et al.. (2002). Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu. Journal of materials research/Pratt's guide to venture capital sources. 17(2). 291–301. 227 indexed citations

7.

Jang, Jin‐Wook, et al.. (2001). Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology. Applied Physics Letters. 79(4). 482–484. 26 indexed citations

8.

Frear, D. R., et al.. (2001). Pb-free solders for flip-chip interconnects. JOM. 53(6). 28–33. 271 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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