Masahiro Sunohara

699 total citations
18 papers, 578 citations indexed

About

Masahiro Sunohara is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, Masahiro Sunohara has authored 18 papers receiving a total of 578 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Electrical and Electronic Engineering, 8 papers in Biomedical Engineering and 3 papers in Automotive Engineering. Recurrent topics in Masahiro Sunohara's work include 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (12 papers) and Nanofabrication and Lithography Techniques (5 papers). Masahiro Sunohara is often cited by papers focused on 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (12 papers) and Nanofabrication and Lithography Techniques (5 papers). Masahiro Sunohara collaborates with scholars based in Japan and France. Masahiro Sunohara's co-authors include Mitsutoshi Higashi, Takashi Kurihara, Takashi Tokunaga, Kenji Takahashi, M. Hoshino, T. Sato, Kei Murayama, Yoshihiro TOMITA, Hiroshi Terao and Yuichi Taguchi and has published in prestigious journals such as Japanese Journal of Applied Physics, JOURNAL OF CHEMICAL ENGINEERING OF JAPAN and Biorheology.

In The Last Decade

Masahiro Sunohara

16 papers receiving 562 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Masahiro Sunohara Japan 12 550 141 83 53 33 18 578
W.C. Chiou Taiwan 11 467 0.8× 75 0.5× 50 0.6× 60 1.1× 49 1.5× 22 517
S. Chéramy France 14 490 0.9× 71 0.5× 104 1.3× 40 0.8× 41 1.2× 61 522
M. J. Interrante United States 6 463 0.8× 71 0.5× 77 0.9× 27 0.5× 52 1.6× 7 487
R. Yu United States 6 370 0.7× 88 0.6× 47 0.6× 24 0.5× 59 1.8× 10 403
Yoichiro Kurita Japan 9 374 0.7× 67 0.5× 47 0.6× 18 0.3× 37 1.1× 32 387
A. Sharma United States 6 327 0.6× 46 0.3× 47 0.6× 25 0.5× 29 0.9× 8 362
H. Itani Japan 8 433 0.8× 123 0.9× 80 1.0× 15 0.3× 19 0.6× 9 462
Robert Wieland Germany 12 440 0.8× 90 0.6× 92 1.1× 12 0.2× 25 0.8× 32 483
Kwang-Yoo Byun South Korea 8 711 1.3× 84 0.6× 61 0.7× 19 0.4× 64 1.9× 18 736
Tapobrata Bandyopadhyay United States 11 753 1.4× 137 1.0× 71 0.9× 13 0.2× 65 2.0× 12 791

Countries citing papers authored by Masahiro Sunohara

Since Specialization
Citations

This map shows the geographic impact of Masahiro Sunohara's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Masahiro Sunohara with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Masahiro Sunohara more than expected).

Fields of papers citing papers by Masahiro Sunohara

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Masahiro Sunohara. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Masahiro Sunohara. The network helps show where Masahiro Sunohara may publish in the future.

Co-authorship network of co-authors of Masahiro Sunohara

This figure shows the co-authorship network connecting the top 25 collaborators of Masahiro Sunohara. A scholar is included among the top collaborators of Masahiro Sunohara based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Masahiro Sunohara. Masahiro Sunohara is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

18 of 18 papers shown
1.
Sunohara, Masahiro, et al.. (2025). Development of Glass Core Build-up Substrate with TGV. 1021–1026.
2.
3.
Murayama, Kei, K. Hara, Masahiro Sunohara, et al.. (2013). Warpage control of silicon interposer for 2.5D package application. 879–884. 32 indexed citations
4.
Charbonnier, Jean, M. Assous, Masahiro Sunohara, et al.. (2012). High density 3D silicon interposer technology development and electrical characterization for high end applications. 1–7. 11 indexed citations
5.
Sunohara, Masahiro, Jean Charbonnier, M. Assous, et al.. (2012). Full Integration and Electrical Characterization of 3D Silicon Interposer Demonstrator Incorporating High Density TSVs and Interconnects. IMAPSource Proceedings. 2012(1). 984–990. 5 indexed citations
6.
Sunohara, Masahiro, et al.. (2011). Development of Si interposer with low inductance decoupling capacitor. 849–854. 13 indexed citations
7.
Sunohara, Masahiro, et al.. (2010). Studies on electrical performance and thermal stress of a silicon interposer with TSVs. 1088–1093. 44 indexed citations
8.
Sunohara, Masahiro, et al.. (2009). Development of silicon module with TSVs and global wiring (L/S=0.8/0.8µm). j91 c. 25–31. 24 indexed citations
9.
Sunohara, Masahiro, Takashi Tokunaga, Takashi Kurihara, & Mitsutoshi Higashi. (2008). Silicon interposer with TSVs (Through Silicon Vias) and fine multilayer wiring. 847–852. 129 indexed citations
10.
Sunohara, Masahiro, et al.. (2008). A Silicon interposer BGA package with Cu-filled TSV and multi-layer Cu-plating interconnect. 571–576. 72 indexed citations
11.
Sunohara, Masahiro, et al.. (2004). Development of interconnect technologies for embedded organic packages. 1484–1489. 12 indexed citations
12.
Sunohara, Masahiro, et al.. (2003). Development of wafer thinning and double-sided bumping technologies for the three-dimensional stacked LSI. 238–245. 15 indexed citations
13.
TOMITA, Yoshihiro, et al.. (2003). Cu Bump Interconnections in 20.MU.m-Pitch at Low Temperature Utilizing Electroless Tin-Plating on 3D Stacked LSI.. JOURNAL OF CHEMICAL ENGINEERING OF JAPAN. 36(2). 119–125. 8 indexed citations
14.
15.
Yamaji, Youhei, et al.. (2002). Thermal characterization of bare-die stacked modules with Cu through-vias. 3582. 730–732. 17 indexed citations
16.
Takahashi, Kenji, et al.. (2002). Development of advanced 3D chip stacking technology with ultra-fine interconnection. 541–546. 37 indexed citations
17.
Takahashi, Kenji, Hiroshi Terao, Yoshihiro TOMITA, et al.. (2001). Current Status of Research and Development for Three-Dimensional Chip Stack Technology. Japanese Journal of Applied Physics. 40(4S). 3032–3032. 143 indexed citations
18.
Iizuka, Eisaku, Akira Hachimori, Kôji Abe, et al.. (1983). Comparative study on the mechanical property of silk thread from cocoons of Bombyx mori L.. Biorheology. 20(5). 459–470. 12 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026