Jie Xue

430 total citations
37 papers, 308 citations indexed

About

Jie Xue is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Jie Xue has authored 37 papers receiving a total of 308 indexed citations (citations by other indexed papers that have themselves been cited), including 33 papers in Electrical and Electronic Engineering, 6 papers in Mechanics of Materials and 6 papers in Mechanical Engineering. Recurrent topics in Jie Xue's work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (27 papers) and Electromagnetic Compatibility and Noise Suppression (5 papers). Jie Xue is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (27 papers) and Electromagnetic Compatibility and Noise Suppression (5 papers). Jie Xue collaborates with scholars based in United States, China and Taiwan. Jie Xue's co-authors include Kuo-Chuan Liu, Tae-Kyu Lee, Hongtao Ma, Li Li, M. Brillhart, J. W. Morris, Peng Su, Weidong Xie, Vipul Patel and Peter De Dobbelaere and has published in prestigious journals such as Journal of Electronic Materials, Electronics and Journal of Materials Engineering and Performance.

In The Last Decade

Jie Xue

36 papers receiving 278 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jie Xue United States 9 284 84 42 24 24 37 308
Chih-Pin Hung Taiwan 11 268 0.9× 44 0.5× 33 0.8× 25 1.0× 22 0.9× 50 291
E Perfecto United States 10 222 0.8× 60 0.7× 14 0.3× 20 0.8× 19 0.8× 48 257
Pilin Liu United States 8 332 1.2× 169 2.0× 31 0.7× 18 0.8× 76 3.2× 20 377
Jong‐Kai Lin United States 12 381 1.3× 187 2.2× 33 0.8× 21 0.9× 16 0.7× 33 394
E. Auerswald Germany 7 358 1.3× 159 1.9× 49 1.2× 34 1.4× 36 1.5× 22 399
Ivy Qin United States 11 302 1.1× 145 1.7× 25 0.6× 37 1.5× 47 2.0× 34 361
Kazushige Toriyama Japan 10 321 1.1× 96 1.1× 12 0.3× 40 1.7× 14 0.6× 32 335
Chai Tai Chong Singapore 10 422 1.5× 46 0.5× 33 0.8× 78 3.3× 19 0.8× 50 463
Ahmer Syed United States 13 401 1.4× 153 1.8× 51 1.2× 15 0.6× 13 0.5× 36 422
Srikrishna Sitaraman United States 13 516 1.8× 57 0.7× 82 2.0× 76 3.2× 33 1.4× 56 567

Countries citing papers authored by Jie Xue

Since Specialization
Citations

This map shows the geographic impact of Jie Xue's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jie Xue with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jie Xue more than expected).

Fields of papers citing papers by Jie Xue

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jie Xue. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jie Xue. The network helps show where Jie Xue may publish in the future.

Co-authorship network of co-authors of Jie Xue

This figure shows the co-authorship network connecting the top 25 collaborators of Jie Xue. A scholar is included among the top collaborators of Jie Xue based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jie Xue. Jie Xue is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Xue, Jie, et al.. (2025). A Multi-Receiver Pulse Deinterleaving Method Based on SSC-DBSCAN and TDOA Mapping. Electronics. 14(9). 1833–1833. 1 indexed citations
2.
Dobbelaere, Peter De, et al.. (2022). Advanced 2.5D and 3D packaging technologies for next generation Silicon Photonics in high performance networking applications. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 428–435. 19 indexed citations
3.
Zhang, Zhihao, Jie Xue, & Yanbin Jiang. (2017). Enhanced Homogeneities of Microstructure and Property in Al-Zn-Mg-Cu Extruded Product by Cooling Rate After Homogenization Treatment. Journal of Materials Engineering and Performance. 26(8). 3993–4000. 3 indexed citations
4.
Cui, Yi, et al.. (2014). Research on Elements Distribution in Hot Dip Aluminum Silicon Coating of Hot Stamping Steel. Advanced materials research. 1063. 73–77. 2 indexed citations
5.
Lau, John H., Pei-Jer Tzeng, Chau‐Jie Zhan, et al.. (2012). Large Size Silicon Interposer and 3D IC Integration for System-in-Packaging (SiP). IMAPSource Proceedings. 2012(1). 1209–1214. 6 indexed citations
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Li, Li, Peng Su, Jie Xue, et al.. (2012). Addressing bandwidth challenges in next generation high performance network systems with 3D IC integration. 1040–1046. 29 indexed citations
8.
Xie, Weidong, Tae-Kyu Lee, Kuo-Chuan Liu, & Jie Xue. (2010). Pb-free solder joint reliability of fine pitch chip-scale packages. 1587–1590. 11 indexed citations
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Lee, Tae-Kyu, Hongtao Ma, Kuo-Chuan Liu, & Jie Xue. (2010). Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects. Journal of Electronic Materials. 39(12). 2564–2573. 66 indexed citations
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Liu, Kuo-Chuan, et al.. (2008). Manufacturability and reliability of a high-speed CSP SRAM on an interposer package. 374–381. 1 indexed citations
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Li, Li, et al.. (2006). Materials Effects on Reliability of FC-PBGA Packages for Cu/low-k Chips. 1590–1594. 8 indexed citations
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Li, Li, et al.. (2005). Design optimization of a high performance FCAMP package for manufacturability and reliability. 2. 1497–1499. 6 indexed citations
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Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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