L. Zavalij

624 total citations
14 papers, 523 citations indexed

About

L. Zavalij is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, L. Zavalij has authored 14 papers receiving a total of 523 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 3 papers in Aerospace Engineering. Recurrent topics in L. Zavalij's work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (7 papers) and Intermetallics and Advanced Alloy Properties (6 papers). L. Zavalij is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (7 papers) and Intermetallics and Advanced Alloy Properties (6 papers). L. Zavalij collaborates with scholars based in United States. L. Zavalij's co-authors include E. J. Cotts, L.P. Lehman, Peter Børgesen, A. Zribi, A. Clark, Yan Xing, Richard R. Chromik, Raj Patel, G.R. Westby and Anthony Primavera and has published in prestigious journals such as Journal of Applied Physics, Journal of Alloys and Compounds and Scripta Materialia.

In The Last Decade

L. Zavalij

14 papers receiving 498 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
L. Zavalij United States	12	492	351	129	61	59	14	523
H. K. Kim United States	7	502 1.0×	364 1.0×	67 0.5×	39 0.6×	34 0.6×	9	526
N. Kurokawa Japan	9	425 0.9×	455 1.3×	148 1.1×	63 1.0×	25 0.4×	10	560
Chi-Won Hwang Japan	10	489 1.0×	396 1.1×	95 0.7×	25 0.4×	23 0.4×	13	512
Moon Gi Cho South Korea	15	520 1.1×	381 1.1×	123 1.0×	42 0.7×	14 0.2×	26	554
M. Li Singapore	9	535 1.1×	404 1.2×	57 0.4×	23 0.4×	21 0.4×	10	557
J. Read Australia	14	630 1.3×	478 1.4×	147 1.1×	53 0.9×	22 0.4×	21	668
J. K. Lin United States	6	606 1.2×	428 1.2×	115 0.9×	30 0.5×	29 0.5×	8	616
A. M. El-Taher Egypt	13	664 1.3×	556 1.6×	146 1.1×	86 1.4×	43 0.7×	26	723
M.S. Park United States	7	337 0.7×	235 0.7×	153 1.2×	94 1.5×	9 0.2×	8	393
Bite Zhou United States	13	501 1.0×	321 0.9×	142 1.1×	94 1.5×	129 2.2×	20	535

Countries citing papers authored by L. Zavalij

Since Specialization

Citations

This map shows the geographic impact of L. Zavalij's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L. Zavalij with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L. Zavalij more than expected).

Fields of papers citing papers by L. Zavalij

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by L. Zavalij. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L. Zavalij. The network helps show where L. Zavalij may publish in the future.

Co-authorship network of co-authors of L. Zavalij

This figure shows the co-authorship network connecting the top 25 collaborators of L. Zavalij. A scholar is included among the top collaborators of L. Zavalij based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with L. Zavalij. L. Zavalij is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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14 of 14 papers shown

Lehman, L.P., Junling Wang, Yan Xing, et al.. (2005). Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints. 2. 674–681. 29 indexed citations

Lehman, L.P., et al.. (2005). Effect of Sample Size on the Solidification Temperature and Microstructure of SnAgCu Near Eutectic Alloys. Journal of materials research/Pratt's guide to venture capital sources. 20(11). 2914–2918. 96 indexed citations

Zavalij, L., et al.. (2004). Linear coefficients of thermal expansion of Au0.5Ni0.5Sn4, Au0.75Ni0.25Sn4, and AuSn4. Scripta Materialia. 51(7). 745–749. 12 indexed citations

Lehman, L.P., et al.. (2004). Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories. 1215–1221. 11 indexed citations

Lehman, L.P., Raj Patel, Yan Xing, et al.. (2004). Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder. Journal of Electronic Materials. 33(12). 1429–1439. 149 indexed citations

Zribi, A., et al.. (2003). Solder metallization interdiffusion in microelectronic interconnects. 451–457. 12 indexed citations

Zribi, A., L. Zavalij, Peter Børgesen, et al.. (2002). The kinetics of formation of ternary intermetallic alloys in Pb-Sn and Cu-Ag-Sn Pb-free electronic joints. 687–692. 13 indexed citations

Zavalij, L., et al.. (2002). Crystal structure of Au1−xNixSn4 intermetallic alloys. Journal of Alloys and Compounds. 334(1-2). 79–85. 17 indexed citations

Chromik, Richard R., L. Zavalij, Matthew D. Johnson, & E. J. Cotts. (2002). Calorimetric investigation of the formation of metastable silicides in Au/a-Si thin film multilayers. Journal of Applied Physics. 91(11). 8992–8998. 13 indexed citations

10.

Zribi, A., et al.. (2002). Aspects of the structural evolution of lead-free solder joints. JOM. 54(6). 38–40. 14 indexed citations

11.

Zribi, A., A. Clark, L. Zavalij, Peter Børgesen, & E. J. Cotts. (2001). The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure. Journal of Electronic Materials. 30(9). 1157–1164. 105 indexed citations

12.

Zribi, A., Peter Børgesen, L. Zavalij, & E. J. Cotts. (2000). Growth of Cu-Ni-Sn Alloys in Pb Free CuSnAg Solder/Au-Ni Metallization Reactions. MRS Proceedings. 652. 2 indexed citations

13.

Zribi, A., Richard R. Chromik, L. Zavalij, et al.. (2000). Solder metallization interdiffusion in microelectronic interconnects. IEEE Transactions on Components and Packaging Technologies. 23(2). 383–387. 49 indexed citations

14.

Zavalij, L., et al.. (1988). Crystal structure of ScB 12. 24(3). 506–507. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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