Pearl Agyakwa

1.4k total citations · 1 hit paper
39 papers, 1.1k citations indexed

About

Pearl Agyakwa is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Pearl Agyakwa has authored 39 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Electrical and Electronic Engineering, 23 papers in Mechanical Engineering and 8 papers in Materials Chemistry. Recurrent topics in Pearl Agyakwa's work include Electronic Packaging and Soldering Technologies (26 papers), Aluminum Alloys Composites Properties (11 papers) and Silicon Carbide Semiconductor Technologies (9 papers). Pearl Agyakwa is often cited by papers focused on Electronic Packaging and Soldering Technologies (26 papers), Aluminum Alloys Composites Properties (11 papers) and Silicon Carbide Semiconductor Technologies (9 papers). Pearl Agyakwa collaborates with scholars based in United Kingdom, Egypt and China. Pearl Agyakwa's co-authors include C. Mark Johnson, Jianfeng Li, Li Yang, Martin Corfield, Paul Evans, Mohd. Amir Eleffendi, Bassem Mouawad, D.G. McCartney, Tanvir Hussain and Alberto Castellazzi and has published in prestigious journals such as Acta Materialia, Journal of Materials Science and Journal of Alloys and Compounds.

In The Last Decade

Pearl Agyakwa

38 papers receiving 1.1k citations

Hit Papers

align trajectories sort by overperformance

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

2010 329 citations Jianfeng Li, Pearl Agyakwa et al. profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Pearl Agyakwa United Kingdom	15	970	648	121	112	98	39	1.1k
Darvin Edwards United States	15	781 0.8×	424 0.7×	77 0.6×	91 0.8×	159 1.6×	35	991
Yiyu Qian China	15	446 0.5×	627 1.0×	126 1.0×	133 1.2×	75 0.8×	41	827
Won Kyoung Choi South Korea	16	977 1.0×	628 1.0×	179 1.5×	73 0.7×	43 0.4×	32	1.0k
R. Sidhu United States	16	575 0.6×	662 1.0×	155 1.3×	178 1.6×	239 2.4×	27	937
Tz-Cheng Chiu Taiwan	13	907 0.9×	435 0.7×	100 0.8×	88 0.8×	316 3.2×	67	1.2k
M. Roellig Germany	13	483 0.5×	287 0.4×	77 0.6×	62 0.6×	129 1.3×	89	592
Yvan Avenas France	19	1.4k 1.5×	466 0.7×	60 0.5×	119 1.1×	57 0.6×	77	1.8k
Zhaolong Ma China	20	526 0.5×	1.0k 1.6×	636 5.3×	315 2.8×	112 1.1×	60	1.4k
Laura J. Evans United States	16	399 0.4×	304 0.5×	91 0.8×	187 1.7×	109 1.1×	39	788
T.H. Low Singapore	12	754 0.8×	436 0.7×	145 1.2×	42 0.4×	123 1.3×	18	796

Countries citing papers authored by Pearl Agyakwa

Since Specialization

Citations

This map shows the geographic impact of Pearl Agyakwa's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Pearl Agyakwa with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Pearl Agyakwa more than expected).

Fields of papers citing papers by Pearl Agyakwa

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Pearl Agyakwa. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Pearl Agyakwa. The network helps show where Pearl Agyakwa may publish in the future.

Co-authorship network of co-authors of Pearl Agyakwa

This figure shows the co-authorship network connecting the top 25 collaborators of Pearl Agyakwa. A scholar is included among the top collaborators of Pearl Agyakwa based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Pearl Agyakwa. Pearl Agyakwa is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Lye, R. G., Antonio Pellegrino, C.J. Bennett, et al.. (2025). Influence of Temperature, Strain Rate, and Condition on the Mechanical Response of an AlSi-PES Abradable. Experimental Mechanics. 65(8). 1259–1278. 1 indexed citations

Gao, Xiangyun, et al.. (2025). Tailored droplet deposition strategies for direct printing of fully functional components via molten metal jetting. Journal of Manufacturing Processes. 151. 206–213. 2 indexed citations

Agyakwa, Pearl, Reda M. Felfel, R.J. Homer, et al.. (2024). Self-assembled titanium-based macrostructures with hierarchical (macro-, micro-, and nano) porosities: A fundamental study. Materials & Design. 240. 112835–112835. 1 indexed citations

Agyakwa, Pearl, Stuart Robertson, Bassem Mouawad, et al.. (2024). Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling. Journal of Electronic Materials. 53(3). 1374–1398. 7 indexed citations

Mouawad, Bassem, Li Yang, Pearl Agyakwa, Martin Corfield, & C. Mark Johnson. (2020). Packaging degradation studies of High Temperature SiC MOSFET discrete packages. 90–93. 9 indexed citations

Eleffendi, Mohd. Amir, Li Yang, Pearl Agyakwa, & C. Mark Johnson. (2016). Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement. Microelectronics Reliability. 59. 73–83. 26 indexed citations

Agyakwa, Pearl, et al.. (2016). Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator. IEEE Transactions on Components Packaging and Manufacturing Technology. 6(5). 814–821. 12 indexed citations

Agyakwa, Pearl, et al.. (2014). Interdiffusion coefficients of binary multiphase systems with consideration of variation in Molar volumes. Nottingham ePrints (University of Nottingham). 12(1).

Wang, Yun, Jianfeng Li, Pearl Agyakwa, C. Mark Johnson, & Shuguang Li. (2014). Quantitative Microstructure Characterization of Ag Nanoparticle Sintered Joints for Power Die Attachment. Molecular Crystals and Liquid Crystals. 604(1). 11–26. 1 indexed citations

10.

Agyakwa, Pearl, et al.. (2014). Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods. Microelectronics Reliability. 54(9-10). 2006–2012. 10 indexed citations

11.

Li, Jianfeng, Pearl Agyakwa, & C. Mark Johnson. (2014). Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient liquid-phase Joints Used for Power Die Attachment. Journal of Electronic Materials. 43(4). 983–995. 24 indexed citations

12.

Agyakwa, Pearl, Yang Li, Martin Corfield, & C. Mark Johnson. (2014). A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography. Repository@Nottingham (University of Nottingham). 2 indexed citations

13.

Li, Jianfeng, et al.. (2014). Packaging/assembling technologies for a high performance SiC-based planar power module. Repository@Nottingham (University of Nottingham). 2 indexed citations

14.

Li, Jianfeng, Pearl Agyakwa, & C. Mark Johnson. (2013). A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds. Intermetallics. 40. 50–59. 15 indexed citations

15.

Agyakwa, Pearl, et al.. (2013). Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires. Journal of Electronic Materials. 42(3). 537–544. 10 indexed citations

16.

Johnson, C. Mark, et al.. (2012). Integrated High Power Modules. 1–10. 16 indexed citations

17.

Yang, Li, Pearl Agyakwa, & C. Mark Johnson. (2012). Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules. IEEE Transactions on Device and Materials Reliability. 13(1). 9–17. 145 indexed citations

18.

Yang, Li, Pearl Agyakwa, & C. Mark Johnson. (2011). A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects. Microelectronics Reliability. 51(9-11). 1882–1886. 23 indexed citations

19.

Li, Jianfeng, Pearl Agyakwa, C. Mark Johnson, et al.. (2009). Characterization and solderability of cold sprayed Sn–Cu coatings on Al and Cu substrates. Surface and Coatings Technology. 204(9-10). 1395–1404. 27 indexed citations

20.

Castellazzi, Alberto, et al.. (2009). A highly integrated high-voltage bi-directional switch. 1–2. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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