Hyungsoo Kim

1.1k total citations
79 papers, 863 citations indexed

About

Hyungsoo Kim is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Aerospace Engineering. According to data from OpenAlex, Hyungsoo Kim has authored 79 papers receiving a total of 863 indexed citations (citations by other indexed papers that have themselves been cited), including 68 papers in Electrical and Electronic Engineering, 9 papers in Biomedical Engineering and 7 papers in Aerospace Engineering. Recurrent topics in Hyungsoo Kim's work include Electromagnetic Compatibility and Noise Suppression (42 papers), 3D IC and TSV technologies (23 papers) and Advancements in PLL and VCO Technologies (11 papers). Hyungsoo Kim is often cited by papers focused on Electromagnetic Compatibility and Noise Suppression (42 papers), 3D IC and TSV technologies (23 papers) and Advancements in PLL and VCO Technologies (11 papers). Hyungsoo Kim collaborates with scholars based in South Korea, United States and Japan. Hyungsoo Kim's co-authors include Joungho Kim, Ji‐Woong Park, Min-Gu Han, Jia Li, Jun So Pak, Jingook Kim, Junwoo Lee, Jang Jo, Bogyu Lim and Dong‐Yu Kim and has published in prestigious journals such as Chemical Society Reviews, Advanced Materials and Applied Physics Letters.

In The Last Decade

Hyungsoo Kim

74 papers receiving 835 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Hyungsoo Kim South Korea 18 720 135 128 108 97 79 863
Byung-Hyun Lee South Korea 14 431 0.6× 77 0.6× 187 1.5× 40 0.4× 114 1.2× 41 569
Hyun‐Ho Yang South Korea 13 581 0.8× 38 0.3× 294 2.3× 50 0.5× 80 0.8× 45 700
Man Young Sung South Korea 13 570 0.8× 58 0.4× 144 1.1× 16 0.1× 375 3.9× 94 784
T. S. Sriram United States 12 147 0.2× 95 0.7× 57 0.4× 61 0.6× 130 1.3× 23 396
Jingchen Wang China 11 368 0.5× 89 0.7× 338 2.6× 214 2.0× 26 0.3× 51 596
Darsen D. Lu United States 18 1.1k 1.5× 50 0.4× 276 2.2× 11 0.1× 429 4.4× 63 1.4k
P.C. Chang United States 6 505 0.7× 91 0.7× 244 1.9× 33 0.3× 62 0.6× 8 591
Jingwen Li China 14 504 0.7× 177 1.3× 115 0.9× 22 0.2× 92 0.9× 58 684
Dongho Shin South Korea 12 189 0.3× 45 0.3× 55 0.4× 74 0.7× 151 1.6× 31 576

Countries citing papers authored by Hyungsoo Kim

Since Specialization
Citations

This map shows the geographic impact of Hyungsoo Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hyungsoo Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hyungsoo Kim more than expected).

Fields of papers citing papers by Hyungsoo Kim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hyungsoo Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hyungsoo Kim. The network helps show where Hyungsoo Kim may publish in the future.

Co-authorship network of co-authors of Hyungsoo Kim

This figure shows the co-authorship network connecting the top 25 collaborators of Hyungsoo Kim. A scholar is included among the top collaborators of Hyungsoo Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hyungsoo Kim. Hyungsoo Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lee, Kyungsoo, et al.. (2023). System Optimization of Data Analytics Platforms using Compute Express Link (CXL) Memory. 9–12. 4 indexed citations
2.
Kim, Hyungsoo, Jaesang Lee, Byung-Hee Son, et al.. (2021). Wideband Predistortion Technique With Dual-Parallel Schottky Diodes for Low Power RoF Systems. IEEE Photonics Technology Letters. 33(11). 569–572. 3 indexed citations
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Kim, Hyungsoo, et al.. (2019). Accuracy investigation of equivalent dipole arrays for near‐field estimation in presence of shielding or dielectric structures. Microwave and Optical Technology Letters. 62(4). 1724–1732. 5 indexed citations
5.
6.
Kim, Hyungsoo, et al.. (2017). A Study on Scale Determination of FO-RO Hybrid Process Based on FO Recovery Rate. Journal of Coastal Research. 79. 75–79. 2 indexed citations
7.
Choi, Sumin, Heegon Kim, D. Jung, et al.. (2015). Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. TS8.25.1–TS8.25.5. 2 indexed citations
8.
Choi, Sumin, Heegon Kim, Kiyeong Kim, et al.. (2014). Crosstalk included eye diagram estimation of high-speed and wide I/O interposer channel for 2.5D / 3D IC. 215–218. 5 indexed citations
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10.
Kim, Hyungsoo, et al.. (2010). 3 GHz Wide Frequency Model of Surface Mount Technology (SMT) Ferrite Bead for Power/Ground and I/O Line Noise Simulation of High-speed PCB. 181–284.
11.
Pak, Jun So, Hyungsoo Kim, Junwoo Lee, & Joungho Kim. (2007). Modeling and Measurement of Radiated Field Emission From a Power/Ground Plane Cavity Edge Excited by a Through-Hole Signal Via Based on a Balanced TLM and Via Coupling Model. IEEE Transactions on Advanced Packaging. 30(1). 73–85. 21 indexed citations
12.
Lee, Sang-Yong, Jin-Gul Hyun, Hyungsoo Kim, & Kyung‐Wook Paik. (2007). A Study on Dielectric Constants of ${\rm Epoxy/SrTiO}_{3}$ Composite for Embedded Capacitor Films (ECFs). IEEE Transactions on Advanced Packaging. 30(3). 428–433. 22 indexed citations
13.
Park, Jong‐Bae, Hyungsoo Kim, Jun So Pak, & Joungho Kim. (2006). Characterization of SSN coupling to signal via in multi-layer PCBs and packages. e86 b. 328–331. 3 indexed citations
14.
Lee, Junwoo, Mihai Rotaru, M.K. Iyer, Hyungsoo Kim, & Joungho Kim. (2005). Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs. IEEE Transactions on Advanced Packaging. 28(2). 298–309. 24 indexed citations
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Kim, Joungho, et al.. (2005). Noise generation, coupling, isolation, and EM radiation in high-speed package and PCB. 5766–5769 Vol. 6. 4 indexed citations
17.
Kim, Hyungsoo, et al.. (2005). Dynamic Self-Assembly of Polymer Colloids To Form Linear Patterns. Langmuir. 21(11). 4786–4789. 45 indexed citations
18.
Kim, Hyungsoo, et al.. (2004). Suppression of GHz range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in multilayer packages and PCBs. IEEE Microwave and Wireless Components Letters. 14(2). 71–73. 41 indexed citations
19.
Kim, Jonghoon, Hyungsoo Kim, & Joungho Kim. (2003). Efficient On-Chip Decoupling Capacitor Design on an 8-Bit Microcontroller to Reduce Simultaneous Switching Noise and Electromagnetic Radiated Emission(Electromagnetic Compatibility (EMC)). IEICE Transactions on Communications. 86(6). 2077–2080. 2 indexed citations
20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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