Youngwoo Kim
- Electrical and Electronic Engineering top 2%
- Materials Chemistry top 10%
- Biomedical Engineering top 10%
- Polymers and Plastics top 10%
- Automotive Engineering top 10%
- Topics
- 3D IC and TSV technologies (49 papers)Electromagnetic Compatibility and Noise Suppression (39 papers)Electronic Packaging and Soldering Technologies (19 papers)
- Partner nations
- South KoreaUnited StatesJapan
In The Last Decade
Youngwoo Kim
111 papers receiving 1.9k citations
Peers
Comparison fields: 5 of 82
- Electrical and Electronic Engineering 1.6k
- Materials Chemistry 558
- Biomedical Engineering 263
- Polymers and Plastics 137
- Automotive Engineering 120
Countries citing papers authored by Youngwoo Kim
This map shows the geographic impact of Youngwoo Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Youngwoo Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Youngwoo Kim more than expected).
Fields of papers citing papers by Youngwoo Kim
This network shows the impact of papers produced by Youngwoo Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Youngwoo Kim. The network helps show where Youngwoo Kim may publish in the future.
Co-authorship network of co-authors of Youngwoo Kim
This figure shows the co-authorship network connecting the top 25 collaborators of Youngwoo Kim. A scholar is included among the top collaborators of Youngwoo Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Youngwoo Kim. Youngwoo Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 1 | |
| 4 | 2 | |
| 5 | 0 | |
| 6 | 6 | |
| 7 | 28 | |
| 8 | 30 | |
| 9 | 12 | |
| 10 | 4 | |
| 11 | 4 | |
| 12 | 21 | |
| 13 | 16 | |
| 14 | 10 | |
| 15 | 4 | |
| 16 | 5 | |
| 17 | 34 | |
| 18 | 4 | |
| 19 | 12 | |
| 20 | 1 |
About Youngwoo Kim
Youngwoo Kim is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering and Materials Chemistry, having authored 120 papers that have together received 1.9k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (49 papers), Electromagnetic Compatibility and Noise Suppression (39 papers) and Electronic Packaging and Soldering Technologies (19 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.6k citations), Hardware and Architecture (91 citations) and Materials Chemistry (558 citations). Youngwoo Kim has collaborated with scholars based in South Korea, United States and Japan. Frequent co-authors include Jooho Moon, Kyoohee Woo, Joungho Kim, Kyungjun Cho, Subin Kim, Seongsoo Lee, Junyong Park, Inhyuk Kim, Seungtaek Jeong and Rao Tummala. Their work appears in journals such as ACS Nano, Energy & Environmental Science and Advanced Functional Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.