Youngwoo Kim

2.6k total citations
120 papers, 1.9k citations indexed

About

Youngwoo Kim is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Materials Chemistry. According to data from OpenAlex, Youngwoo Kim has authored 120 papers receiving a total of 1.9k indexed citations (citations by other indexed papers that have themselves been cited), including 99 papers in Electrical and Electronic Engineering, 17 papers in Hardware and Architecture and 14 papers in Materials Chemistry. Recurrent topics in Youngwoo Kim's work include 3D IC and TSV technologies (49 papers), Electromagnetic Compatibility and Noise Suppression (39 papers) and Electronic Packaging and Soldering Technologies (19 papers). Youngwoo Kim is often cited by papers focused on 3D IC and TSV technologies (49 papers), Electromagnetic Compatibility and Noise Suppression (39 papers) and Electronic Packaging and Soldering Technologies (19 papers). Youngwoo Kim collaborates with scholars based in South Korea, United States and Japan. Youngwoo Kim's co-authors include Jooho Moon, Kyoohee Woo, Joungho Kim, Kyungjun Cho, Subin Kim, Seongsoo Lee, Junyong Park, Inhyuk Kim, Seungtaek Jeong and Rao Tummala and has published in prestigious journals such as ACS Nano, Energy & Environmental Science and Advanced Functional Materials.

In The Last Decade

Youngwoo Kim

111 papers receiving 1.9k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Youngwoo Kim South Korea 22 1.6k 558 263 137 120 120 1.9k
Jasmin Aghassi‐Hagmann Germany 22 1.1k 0.7× 416 0.7× 397 1.5× 144 1.1× 80 0.7× 112 1.6k
Noel Rodríguez Spain 24 1.2k 0.7× 294 0.5× 554 2.1× 118 0.9× 63 0.5× 112 1.8k
Jin‐Young Kim South Korea 20 1.6k 1.0× 486 0.9× 400 1.5× 143 1.0× 136 1.1× 126 2.0k
Yiqun Wang China 21 774 0.5× 252 0.5× 397 1.5× 311 2.3× 96 0.8× 83 1.5k
Suresh K. Sitaraman United States 24 1.9k 1.2× 586 1.1× 645 2.5× 164 1.2× 132 1.1× 259 2.9k
Paolo Pavan Italy 29 3.5k 2.1× 682 1.2× 267 1.0× 166 1.2× 53 0.4× 217 3.9k
Roy Paily India 21 1.2k 0.7× 278 0.5× 489 1.9× 79 0.6× 31 0.3× 165 1.6k
Wenhui Zhu China 26 1.4k 0.9× 503 0.9× 368 1.4× 103 0.8× 108 0.9× 199 2.3k
Yi Zhao China 32 3.8k 2.3× 537 1.0× 260 1.0× 44 0.3× 620 5.2× 230 4.2k
Zheyao Wang China 26 1.3k 0.8× 276 0.5× 689 2.6× 61 0.4× 89 0.7× 130 1.9k

Countries citing papers authored by Youngwoo Kim

Since Specialization
Citations

This map shows the geographic impact of Youngwoo Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Youngwoo Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Youngwoo Kim more than expected).

Fields of papers citing papers by Youngwoo Kim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Youngwoo Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Youngwoo Kim. The network helps show where Youngwoo Kim may publish in the future.

Co-authorship network of co-authors of Youngwoo Kim

This figure shows the co-authorship network connecting the top 25 collaborators of Youngwoo Kim. A scholar is included among the top collaborators of Youngwoo Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Youngwoo Kim. Youngwoo Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lee, Chang‐Woo, et al.. (2025). Influence of Band Gap Enlargement on Thermoelectric Performance in Cu0.008Bi2Te3. Korean Journal of Materials Research. 35(2). 96–106.
2.
Kim, Haeyeon, et al.. (2025). Advanced Chiplet Placement and Routing Optimization Considering Signal Integrity. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(11). 2331–2343.
3.
Shin, Weon Ho, Youngwoo Kim, Sang-Hyun Park, et al.. (2024). Evolution of thermoelectric transport properties of Sb2Te3–Sb2Se3 solid-solution alloys depending on phase formation behavior. Materials Science in Semiconductor Processing. 182. 108689–108689. 1 indexed citations
4.
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6.
Kim, Youngwoo, et al.. (2022). A Novel FDTD Approach Considering Frequency Dispersion of FR-4 Substrates for Signal Transmission Analyses at GHz Band. IEEE Transactions on Electromagnetic Compatibility. 64(5). 1522–1532. 1 indexed citations
7.
Park, Gapyeol, Youngwoo Kim, Kyungjun Cho, et al.. (2021). Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer. IEEE Transactions on Electromagnetic Compatibility. 63(5). 1562–1573. 15 indexed citations
8.
Sim, Boogyo, Seungtaek Jeong, Youngwoo Kim, et al.. (2020). A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System. IEEE Transactions on Electromagnetic Compatibility. 63(3). 935–946. 28 indexed citations
9.
Kim, Youngwoo, Seongsoo Lee, Seungtaek Jeong, et al.. (2019). A Frequency-Selective EMI Reduction Method for Tightly Coupled Wireless Power Transfer Systems Using Resonant Frequency Control of a Shielding Coil in Smartphone Application. IEEE Transactions on Electromagnetic Compatibility. 61(6). 2031–2039. 30 indexed citations
10.
Kim, Junghyun, et al.. (2019). Optical Spatial Modulation with Polar Coordinate for Optical Wireless Communication System. 653–655. 1 indexed citations
11.
Kim, Youngwoo, et al.. (2017). Optimization Study on the Open-Loop Rankine Cycle for Cold Heat Power Generation Using Liquefied Natural Gas. Journal of Hydrogen and New Energy. 28(3). 295–299. 4 indexed citations
12.
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Jung, D., Youngwoo Kim, Jonghoon J. Kim, et al.. (2016). Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(1). 138–152. 47 indexed citations
14.
Kim, Youngwoo, Jonghyun Cho, Jinwook Song, et al.. (2016). Electromagnetic Bandgap Design for Power Distribution Network Noise Isolation in the Glass Interposer. 1856–1861. 2 indexed citations
15.
Kim, Youngwoo, et al.. (2016). Mobile AP GPU power distribution network simulation and analysis based on chip power model. 54. 330–335. 3 indexed citations
16.
Kim, Youngwoo, Jonghyun Cho, Kiyeong Kim, et al.. (2015). Signal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer. 738–743. 21 indexed citations
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18.
Kim, Jihye, Youngwoo Kim, Jonghyun Cho, et al.. (2015). Noise coupling modeling and analysis of through glass via(TGV). TS8.34.1–TS8.34.5. 4 indexed citations
19.
Kim, Youngwoo, Jonghyun Cho, Kiyeong Kim, et al.. (2014). Analysis and optimization of a power distribution network in 2.5D IC with glass interposer. 1–4. 4 indexed citations
20.
Kim, Youngwoo, Kyoohee Woo, Inhyuk Kim, et al.. (2013). Highly concentrated synthesis of copper-zinc-tin-sulfide nanocrystals with easily decomposable capping molecules for printed photovoltaic applications. Nanoscale. 5(21). 10183–10183. 34 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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