Sumin Choi

488 total citations
43 papers, 349 citations indexed

About

Sumin Choi is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Biomedical Engineering. According to data from OpenAlex, Sumin Choi has authored 43 papers receiving a total of 349 indexed citations (citations by other indexed papers that have themselves been cited), including 42 papers in Electrical and Electronic Engineering, 10 papers in Hardware and Architecture and 5 papers in Biomedical Engineering. Recurrent topics in Sumin Choi's work include 3D IC and TSV technologies (33 papers), Electromagnetic Compatibility and Noise Suppression (17 papers) and VLSI and Analog Circuit Testing (10 papers). Sumin Choi is often cited by papers focused on 3D IC and TSV technologies (33 papers), Electromagnetic Compatibility and Noise Suppression (17 papers) and VLSI and Analog Circuit Testing (10 papers). Sumin Choi collaborates with scholars based in South Korea, United States and Italy. Sumin Choi's co-authors include Joungho Kim, Heegon Kim, Youngwoo Kim, Kyungjun Cho, Hyunsuk Lee, D. Jung, Junyong Park, Jonghoon J. Kim, Subin Kim and Seongsoo Lee and has published in prestigious journals such as Nanomaterials, IEEE Transactions on Electromagnetic Compatibility and IEEE Transactions on Components Packaging and Manufacturing Technology.

In The Last Decade

Sumin Choi

38 papers receiving 342 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Sumin Choi South Korea 12 327 62 29 21 20 43 349
Robert Sankman United States 5 301 0.9× 79 1.3× 54 1.9× 42 2.0× 20 1.0× 8 336
John Safran United States 9 327 1.0× 92 1.5× 47 1.6× 18 0.9× 11 0.6× 19 343
E. Hamdy United States 10 286 0.9× 101 1.6× 28 1.0× 12 0.6× 7 0.3× 34 305
V. K. Tomar India 14 420 1.3× 107 1.7× 23 0.8× 18 0.9× 8 0.4× 53 458
Ningmei Yu China 10 341 1.0× 31 0.5× 48 1.7× 17 0.8× 5 0.3× 74 364
Mikhail Popovich United States 13 399 1.2× 54 0.9× 33 1.1× 52 2.5× 19 0.9× 27 417
Fabrice Caignet France 11 363 1.1× 89 1.4× 34 1.2× 46 2.2× 3 0.1× 37 376
Andrey V. Mezhiba United States 10 444 1.4× 82 1.3× 39 1.3× 44 2.1× 10 0.5× 16 462
Norman Robson United States 12 269 0.8× 124 2.0× 24 0.8× 38 1.8× 10 0.5× 29 300
Yarui Peng United States 13 440 1.3× 72 1.2× 10 0.3× 60 2.9× 8 0.4× 55 480

Countries citing papers authored by Sumin Choi

Since Specialization
Citations

This map shows the geographic impact of Sumin Choi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sumin Choi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sumin Choi more than expected).

Fields of papers citing papers by Sumin Choi

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Sumin Choi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sumin Choi. The network helps show where Sumin Choi may publish in the future.

Co-authorship network of co-authors of Sumin Choi

This figure shows the co-authorship network connecting the top 25 collaborators of Sumin Choi. A scholar is included among the top collaborators of Sumin Choi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sumin Choi. Sumin Choi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Choi, Sumin, Heegon Kim, Junyong Park, et al.. (2018). Estimation and analysis of crosstalk effects in high-bandwidth memory channel. 4–4. 1 indexed citations
2.
Kim, Jonghoon J., Junyong Park, Shinyoung Park, et al.. (2017). High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(8). 1356–1368. 12 indexed citations
5.
6.
Jung, D., Jonghoon J. Kim, Heegon Kim, et al.. (2016). Modeling and analysis of high-speed through silicon via (TSV) channel and defects. 6 indexed citations
7.
Jung, D., Youngwoo Kim, Jonghoon J. Kim, et al.. (2016). Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(1). 138–152. 47 indexed citations
8.
Kim, Jonghoon, Heegon Kim, D. Jung, et al.. (2016). Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact. IEEE Transactions on Electromagnetic Compatibility. 59(4). 1239–1251. 3 indexed citations
10.
Kim, Jonghoon, Heegon Kim, D. Jung, et al.. (2016). Design and analysis of silicone rubber-based TERAPOSER for LPDDR4 memory test. 450–454. 2 indexed citations
12.
Choi, Sumin, Heegon Kim, D. Jung, et al.. (2015). Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. TS8.25.1–TS8.25.5. 2 indexed citations
13.
Kim, Jonghoon J., D. Jung, Heegon Kim, et al.. (2015). TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. 1. 212–215. 1 indexed citations
14.
Cho, Jonghyun, Man‐Ho Lee, D. Jung, et al.. (2014). Through silicon via (TSV) noise coupling effects on RF LC-VCO in 3D IC. 53–56. 3 indexed citations
15.
Choi, Sumin, Heegon Kim, Kiyeong Kim, et al.. (2014). Crosstalk included eye diagram estimation of high-speed and wide I/O interposer channel for 2.5D / 3D IC. 215–218. 5 indexed citations
16.
Kim, Heegon, Jonghyun Cho, Joohee Kim, et al.. (2014). A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(1). 28–39. 10 indexed citations
18.
Kim, Heegon, Jonghyun Cho, D. Jung, et al.. (2013). Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. 5–9. 3 indexed citations
19.
Jang, Jisung, et al.. (2013). The Study of Efficient Separation of Oil Form the Cutting Oil. Journal of the Korean Chemical Society. 57(4). 515–519.
20.
Kim, Heegon, Jonghyun Cho, Joohee Kim, et al.. (2012). A compact on-interposer passive equalizer for chip-to-chip high-speed data transmission. 95–98. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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