Jong‐Min Yook

562 total citations
53 papers, 410 citations indexed

About

Jong‐Min Yook is a scholar working on Electrical and Electronic Engineering, Condensed Matter Physics and Biomedical Engineering. According to data from OpenAlex, Jong‐Min Yook has authored 53 papers receiving a total of 410 indexed citations (citations by other indexed papers that have themselves been cited), including 51 papers in Electrical and Electronic Engineering, 8 papers in Condensed Matter Physics and 7 papers in Biomedical Engineering. Recurrent topics in Jong‐Min Yook's work include 3D IC and TSV technologies (25 papers), Radio Frequency Integrated Circuit Design (21 papers) and Microwave Engineering and Waveguides (20 papers). Jong‐Min Yook is often cited by papers focused on 3D IC and TSV technologies (25 papers), Radio Frequency Integrated Circuit Design (21 papers) and Microwave Engineering and Waveguides (20 papers). Jong‐Min Yook collaborates with scholars based in South Korea and United States. Jong‐Min Yook's co-authors include Jun Chul Kim, Joungho Kim, Byung‐Wook Min, Dongsu Kim, Joohee Kim, Junho Lee, Kunwoo Park, Dongsu Kim, Jun So Pak and Jonghyun Cho and has published in prestigious journals such as IEEE Access, IEEE Transactions on Microwave Theory and Techniques and Japanese Journal of Applied Physics.

In The Last Decade

Jong‐Min Yook

47 papers receiving 399 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jong‐Min Yook South Korea 13 387 43 41 33 32 53 410
Sang‐Woong Yoon United States 11 321 0.8× 52 1.2× 47 1.1× 26 0.8× 12 0.4× 48 348
Roberto S. Murphy‐Arteaga Mexico 13 441 1.1× 58 1.3× 54 1.3× 37 1.1× 12 0.4× 55 476
S. Joblot France 9 154 0.4× 44 1.0× 8 0.2× 25 0.8× 67 2.1× 28 194
S. Haque United States 9 292 0.8× 13 0.3× 43 1.0× 16 0.5× 37 1.2× 25 332
K.T. Chan Taiwan 13 442 1.1× 60 1.4× 93 2.3× 29 0.9× 25 0.8× 22 454
Chengzhan Li China 12 399 1.0× 22 0.5× 20 0.5× 60 1.8× 35 1.1× 71 490
Yumin Lu United States 8 232 0.6× 210 4.9× 28 0.7× 22 0.7× 32 1.0× 16 351
Muh‐Dey Wei Germany 8 333 0.9× 82 1.9× 36 0.9× 30 0.9× 19 0.6× 87 368
Tae Hwan Jang South Korea 13 447 1.2× 42 1.0× 209 5.1× 46 1.4× 21 0.7× 57 534
A. Sanseverino Italy 15 589 1.5× 18 0.4× 6 0.1× 59 1.8× 110 3.4× 56 610

Countries citing papers authored by Jong‐Min Yook

Since Specialization
Citations

This map shows the geographic impact of Jong‐Min Yook's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jong‐Min Yook with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jong‐Min Yook more than expected).

Fields of papers citing papers by Jong‐Min Yook

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jong‐Min Yook. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jong‐Min Yook. The network helps show where Jong‐Min Yook may publish in the future.

Co-authorship network of co-authors of Jong‐Min Yook

This figure shows the co-authorship network connecting the top 25 collaborators of Jong‐Min Yook. A scholar is included among the top collaborators of Jong‐Min Yook based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jong‐Min Yook. Jong‐Min Yook is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Xiao, Yu, et al.. (2023). Die-embedded packaging using Corning® multi-layered glass. IMAPSource Proceedings. 2022(IMAPS Symposium).
3.
Yook, Jong‐Min, et al.. (2020). Ultrawideband Signal Transition Using Quasi-Coaxial Through-Silicon-Via (TSV) for mm-Wave IC Packaging. IEEE Microwave and Wireless Components Letters. 30(2). 167–169. 16 indexed citations
4.
Yook, Jong‐Min, et al.. (2019). Integrated circuit (IC)‐embedded wafer‐level packaging technology for millimeter‐wave power ICs. Microwave and Optical Technology Letters. 61(9). 2210–2213. 2 indexed citations
5.
Kim, Seung Min, et al.. (2019). 28 GHz GaAs pHEMT MMICs and RF front‐end module for 5G communication systems. Microwave and Optical Technology Letters. 61(4). 878–882. 12 indexed citations
6.
Chang, Joon Ha, Hyeon Kook Seo, Sung Joo Kim, et al.. (2017). In Situ Transmission Electron Microscopy Graphene Liquid Cell on Chemical Sodiation of Nickel Oxide Nanoparticle. Microscopy and Microanalysis. 23(S1). 204–205. 2 indexed citations
7.
Yook, Jong‐Min, Dongsu Kim, & Jun Chul Kim. (2017). Small and low-profile GaN hybrid-IC LNA using embedded-IC process in silicon. 1–3.
8.
An, Sung Jin, Dongsu Kim, Jong‐Min Yook, et al.. (2015). An X‐band RLC matched power amplifier using quasi‐MMIC technology. Microwave and Optical Technology Letters. 57(12). 2803–2807. 4 indexed citations
9.
Kim, Joohee, Jonghyun Cho, Joungho Kim, et al.. (2014). High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(4). 697–707. 49 indexed citations
10.
Yook, Jong‐Min, et al.. (2014). Low-loss and high-isolation through silicon via technology for high performance RF applications. 31. 996–999. 7 indexed citations
11.
Yook, Jong‐Min, et al.. (2013). High Power and High Q Spiral Inductors using TSV Processes.. 1 indexed citations
12.
Kim, Kiyeong, Jong‐Min Yook, Heegon Kim, et al.. (2013). Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs. IEEE Transactions on Components Packaging and Manufacturing Technology. 3(11). 1891–1906. 32 indexed citations
13.
Yook, Jong‐Min, et al.. (2012). High density and low-cost silicon interposer using thin-film and organic lamination processes. 274–278. 17 indexed citations
14.
Sekhar, K. C., Jong‐Min Yook, Dong-Soo Kim, et al.. (2011). Thickness-dependent tunable characteristics of (Ba0.5Sr0.5)0.925K0.075TiO3 thin films prepared by pulsed laser deposition. Current Applied Physics. 12(3). 654–658. 10 indexed citations
15.
Yook, Jong‐Min, et al.. (2011). Embedded passive and active package using silicon substrate. 554–557. 2 indexed citations
16.
Yook, Jong‐Min, et al.. (2010). Compact front end modules for WLAN applications with integrated passive devices using selectively anodized aluminum substrate. 329–332. 4 indexed citations
17.
Kim, Dongsu, et al.. (2010). RF passive components on a low resistivity Si substrate with an ABF isolation layer. 317–320. 1 indexed citations
18.
Kim, Kyoung-Min, et al.. (2007). An X-band high power amplifier module package using selectively anodized aluminum substrate. 2007 European Microwave Conference. 3. 1357–1360. 1 indexed citations
19.
Yook, Jong‐Min, et al.. (2005). High-quality solenoid inductor using dielectric film for multichip modules. IEEE Transactions on Microwave Theory and Techniques. 53(6). 2230–2234. 12 indexed citations
20.
Yook, Jong‐Min, et al.. (2004). High quality solenoid inductor for dielectric multi-chip module (D-MCM). European Microwave Conference. 3. 1365–1368. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Sang‐Woong Yoon Breakdown of academic impact, for papers by Roberto S. Murphy‐Arteaga Breakdown of academic impact, for papers by S. Joblot Breakdown of academic impact, for papers by S. Haque Breakdown of academic impact, for papers by K.T. Chan Breakdown of academic impact, for papers by Chengzhan Li Breakdown of academic impact, for papers by Yumin Lu Breakdown of academic impact, for papers by Muh‐Dey Wei Breakdown of academic impact, for papers by Tae Hwan Jang Breakdown of academic impact, for papers by A. Sanseverino
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