Jonghoon J. Kim

716 total citations
52 papers, 552 citations indexed

About

Jonghoon J. Kim is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Biomedical Engineering. According to data from OpenAlex, Jonghoon J. Kim has authored 52 papers receiving a total of 552 indexed citations (citations by other indexed papers that have themselves been cited), including 52 papers in Electrical and Electronic Engineering, 5 papers in Hardware and Architecture and 5 papers in Biomedical Engineering. Recurrent topics in Jonghoon J. Kim's work include 3D IC and TSV technologies (31 papers), Electromagnetic Compatibility and Noise Suppression (18 papers) and Energy Harvesting in Wireless Networks (16 papers). Jonghoon J. Kim is often cited by papers focused on 3D IC and TSV technologies (31 papers), Electromagnetic Compatibility and Noise Suppression (18 papers) and Energy Harvesting in Wireless Networks (16 papers). Jonghoon J. Kim collaborates with scholars based in South Korea, United States and Italy. Jonghoon J. Kim's co-authors include Joungho Kim, D. Jung, Sunkyu Kong, Sukjin Kim, Bumhee Bae, Heegon Kim, Chiuk Song, Seungyoung Ahn, Hongseok Kim and Jonghoon Kim and has published in prestigious journals such as IEEE Transactions on Microwave Theory and Techniques, IEEE Microwave and Wireless Components Letters and IEEE Transactions on Electromagnetic Compatibility.

In The Last Decade

Jonghoon J. Kim

50 papers receiving 539 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jonghoon J. Kim South Korea 13 536 81 77 57 55 52 552
Yujun Shin South Korea 12 374 0.7× 29 0.4× 72 0.9× 88 1.5× 41 0.7× 55 397
G. Ofner Germany 5 379 0.7× 44 0.5× 66 0.9× 27 0.5× 7 0.1× 8 418
K. Kiyoyama Japan 11 338 0.6× 17 0.2× 85 1.1× 45 0.8× 21 0.4× 21 353
Sang‐Sun Yoo South Korea 11 370 0.7× 34 0.4× 125 1.6× 15 0.3× 21 0.4× 58 392
Adel Barakat Japan 18 927 1.7× 317 3.9× 190 2.5× 17 0.3× 70 1.3× 102 946
Kyoungchoul Koo South Korea 13 361 0.7× 81 1.0× 31 0.4× 15 0.3× 10 0.2× 37 374
J. Heikkinen Finland 10 353 0.7× 307 3.8× 104 1.4× 10 0.2× 40 0.7× 25 432
Sunkyu Kong South Korea 12 837 1.6× 195 2.4× 120 1.6× 193 3.4× 113 2.1× 38 856
Yeonje Cho South Korea 9 413 0.8× 176 2.2× 49 0.6× 68 1.2× 38 0.7× 20 445
Prasad Jayathurathnage Finland 12 495 0.9× 67 0.8× 112 1.5× 104 1.8× 61 1.1× 38 528

Countries citing papers authored by Jonghoon J. Kim

Since Specialization
Citations

This map shows the geographic impact of Jonghoon J. Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jonghoon J. Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jonghoon J. Kim more than expected).

Fields of papers citing papers by Jonghoon J. Kim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jonghoon J. Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jonghoon J. Kim. The network helps show where Jonghoon J. Kim may publish in the future.

Co-authorship network of co-authors of Jonghoon J. Kim

This figure shows the co-authorship network connecting the top 25 collaborators of Jonghoon J. Kim. A scholar is included among the top collaborators of Jonghoon J. Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jonghoon J. Kim. Jonghoon J. Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Kim, Jonghoon J., Junyong Park, Shinyoung Park, et al.. (2017). High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(8). 1356–1368. 12 indexed citations
3.
4.
Jung, D., Jonghoon J. Kim, Heegon Kim, et al.. (2016). Modeling and analysis of high-speed through silicon via (TSV) channel and defects. 6 indexed citations
5.
Jung, D., Youngwoo Kim, Jonghoon J. Kim, et al.. (2016). Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(1). 138–152. 47 indexed citations
6.
Song, Jinwook, Shinyoung Park, Sukjin Kim, Jonghoon J. Kim, & Joungho Kim. (2016). Active Silicon Interposer Design for Interposer-Level Wireless Power Transfer Technology for High-Density 2.5-D and 3-D ICs. IEEE Transactions on Components Packaging and Manufacturing Technology. 1–14. 12 indexed citations
7.
8.
Song, Chiuk, Hongseok Kim, D. Jung, et al.. (2016). Low EMF and EMI Design of a Tightly Coupled Handheld Resonant Magnetic Field (HH-RMF) Charger for Automotive Battery Charging. IEEE Transactions on Electromagnetic Compatibility. 58(4). 1194–1206. 37 indexed citations
9.
Choi, Sumin, Heegon Kim, D. Jung, et al.. (2015). Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. TS8.25.1–TS8.25.5. 2 indexed citations
10.
11.
Kim, Jonghoon J., D. Jung, Heegon Kim, et al.. (2015). TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. 1. 212–215. 1 indexed citations
12.
Choi, Sumin, Heegon Kim, Kiyeong Kim, et al.. (2014). Crosstalk included eye diagram estimation of high-speed and wide I/O interposer channel for 2.5D / 3D IC. 215–218. 5 indexed citations
13.
Kim, Jonghoon J., Bumhee Bae, Sukjin Kim, et al.. (2014). Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. 1. 1–6. 1 indexed citations
14.
Jung, D., Heegon Kim, Jonghoon J. Kim, et al.. (2014). Fault detection and isolation of multiple defects in through silicon via (TSV) channel. 1–5. 4 indexed citations
15.
Song, Jinwook, Sukjin Kim, Bumhee Bae, et al.. (2014). Design and analysis of magnetically coupled coil structures for PCB-to-active interposer wireless power transfer in 2.5D/3D-IC. 50. 1–4. 6 indexed citations
16.
Kim, Heegon, Jonghyun Cho, D. Jung, et al.. (2013). Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. 5–9. 3 indexed citations
17.
Kim, Jonghoon J., Heegon Kim, Sukjin Kim, et al.. (2013). Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. 1–4. 4 indexed citations
18.
Kim, Jonghoon J., Heegon Kim, Sunkyu Kong, et al.. (2012). Embedded toroidal magnetic coupling probe in multi-layer PCBs for current measurement. 153–156. 2 indexed citations
19.
Ahn, Seungyoung, et al.. (2000). High-frequency electrical performance of a new high-density multiple line grid array (MLGA) package. 497–501. 5 indexed citations
20.
Kim, Hyungsoo, et al.. (2000). An efficient crosstalk parameter extraction method for high-speed interconnection lines. IEEE Transactions on Advanced Packaging. 23(2). 148–155. 21 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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