K. N. Tu

1.0k total citations · 1 hit paper
12 papers, 848 citations indexed

About

K. N. Tu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, K. N. Tu has authored 12 papers receiving a total of 848 indexed citations (citations by other indexed papers that have themselves been cited), including 12 papers in Electrical and Electronic Engineering, 7 papers in Electronic, Optical and Magnetic Materials and 2 papers in Mechanical Engineering. Recurrent topics in K. N. Tu's work include Electronic Packaging and Soldering Technologies (11 papers), Copper Interconnects and Reliability (7 papers) and 3D IC and TSV technologies (7 papers). K. N. Tu is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Copper Interconnects and Reliability (7 papers) and 3D IC and TSV technologies (7 papers). K. N. Tu collaborates with scholars based in United States, Italy and Singapore. K. N. Tu's co-authors include D. R. Frear, T. Y. Lee, S.-M. Kuo, Andriy Gusak, Subodh G. Mhaisalkar, Chih Chen, Ehrenfried Zschech, A. V. Vairagar, Moritz Andreas Meyer and Ahila Krishnamoorthy and has published in prestigious journals such as Physical review. B, Condensed matter, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

K. N. Tu

12 papers receiving 817 citations

Hit Papers

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What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

1996 433 citations K. N. Tu et al. Physical review. B, Condensed matter profile →

Peers

Countries citing papers authored by K. N. Tu

Since Specialization

Citations

This map shows the geographic impact of K. N. Tu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K. N. Tu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K. N. Tu more than expected).

Fields of papers citing papers by K. N. Tu

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by K. N. Tu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K. N. Tu. The network helps show where K. N. Tu may publish in the future.

Co-authorship network of co-authors of K. N. Tu

This figure shows the co-authorship network connecting the top 25 collaborators of K. N. Tu. A scholar is included among the top collaborators of K. N. Tu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with K. N. Tu. K. N. Tu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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12 of 12 papers shown

#	Work	Indexed citations
1	Quaternary low melting point Sn-Bi-in-xGa solder with improved mechanical performance for advanced electronic packaging 2024 ·Intermetallics ·(unknown), (unknown), (unknown), (unknown), K. N. Tu, Yingxia Liu	3
2	Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu 2018 ·Materials ·(unknown), Chia-Ling Lu, (unknown), K. N. Tu, Chih Chen	34
3	Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5D IC technology 2016 ·Journal of Applied Physics ·Menglu Li, Dongwook Kim, Sam Gu, Dilworth Y. Parkinson, Harold Barnard, K. N. Tu	20
4	Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints 2007 ·Journal of Applied Physics ·Dan Yang, Bin Wu, Y.C. Chan, K. N. Tu	34
5	Direct evidence of Cu/cap/liner edge being the dominant electromigration path in dual damascene Cu interconnects 2007 ·Applied Physics Letters ·Wei Shao, Subodh G. Mhaisalkar, Thirumany Sritharan, A. V. Vairagar, H. Engelmann, Oliver Aubel, Ehrenfried Zschech, Andriy Gusak, K. N. Tu	15
6	Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration 2006 ·Applied Physics Letters ·Shuqi Liang, (unknown), T. L. Shao, Chih Chen, K. N. Tu	46
7	Electromigration in Flip Chip Solder Joints 2006 ·AIP conference proceedings ·K. N. Tu	2
8	Three-dimensional simulation of void migration at the interface between thin metallic film and dielectric under electromigration 2005 ·Journal of Applied Physics ·(unknown), Andriy Gusak, K. N. Tu, Subodh G. Mhaisalkar	23
9	In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures 2004 ·Applied Physics Letters ·A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy, K. N. Tu, Andriy Gusak, Moritz Andreas Meyer, Ehrenfried Zschech	82
10	Electromigration of eutectic SnPb solder interconnects for flip chip technology 2001 ·Journal of Applied Physics ·T. Y. Lee, K. N. Tu, S.-M. Kuo, D. R. Frear	150
11	Size dependent dewetting and sideband reaction of eutectic SnPb on Au/Cu/Cr multilayered thin film 1998 ·Journal of materials research/Pratt's guide to venture capital sources ·Dawei Zheng, (unknown), C. Y. Liu, Weijia Wen, K. N. Tu	6
12	Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening breakdown → 1996 ·Physical review. B, Condensed matter ·(unknown), K. N. Tu	433

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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