Moritz Andreas Meyer
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Perovskite Materials and Applications
- Electrodeposition and Electroless Coatings
Papers in
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- Electronic Packaging and Soldering Technologies 8
- Semiconductor materials and devices 8
- Chalcogenide Semiconductor Thin Films 2
- Integrated Circuits and Semiconductor Failure Analysis 1
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- Copper Interconnects and Reliability 8
- Co-authors
- Ehrenfried Zschech (8 shared papers)A. V. Vairagar (4 shared papers)Subodh G. Mhaisalkar (3 shared papers)Ahila Krishnamoorthy (3 shared papers)K. N. Tu (1 shared paper)Andriy Gusak (1 shared paper)Brian D. Gerardot (3 shared papers)Johannes Knörzer (3 shared papers)
- Journals
- International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde) (2 papers)npj 2D Materials and Applications (1 paper)Applied Physics Letters (1 paper)IEEE Transactions on Device and Materials Reliability (1 paper)AIP conference proceedings (1 paper)
- Partner nations
- GermanyUnited StatesSingapore
In The Last Decade
Moritz Andreas Meyer
12 papers receiving 216 citations
Peers
Comparison fields: 5 of 16
- Electronic, Optical and Magnetic Materials 139
- Electrical and Electronic Engineering 191
- Materials Chemistry 71
- Atomic and Molecular Physics, and Optics 39
- Mechanics of Materials 29
Countries citing papers authored by Moritz Andreas Meyer
This map shows the geographic impact of Moritz Andreas Meyer's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Moritz Andreas Meyer with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Moritz Andreas Meyer more than expected).
Fields of papers citing papers by Moritz Andreas Meyer
This network shows the impact of papers produced by Moritz Andreas Meyer. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Moritz Andreas Meyer. The network helps show where Moritz Andreas Meyer may publish in the future.
Co-authors
The 25 scholars most cited alongside Moritz Andreas Meyer, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 82 | |
| 2 | Discrete interactions between a few interlayer excitons trapped at a MoSe<sub>2</sub>-WSe<sub>2</sub> heterointerface | 2020 | 68 |
| 3 | 2004 | 26 | |
| 4 | 2005 | 16 | |
| 5 | 2009 | 14 | |
| 6 | 2007 | 6 | |
| 7 | 2010 | 4 | |
| 8 | 2008 | 2 | |
| 9 | Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects | 2007 | 2 |
| 10 | 2020 | 2 | |
| 11 | 2021 | 1 | |
| 12 | 2005 | 1 |
About Moritz Andreas Meyer
Moritz Andreas Meyer is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry, Atomic and Molecular Physics, and Optics and Infectious Diseases, having authored 12 papers that have together received 224 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (8 papers), Copper Interconnects and Reliability (8 papers), Semiconductor materials and devices (8 papers), Chalcogenide Semiconductor Thin Films (2 papers), 2D Materials and Applications (2 papers), Graphene research and applications (1 paper), Integrated Circuits and Semiconductor Failure Analysis (1 paper) and Spectroscopy and Quantum Chemical Studies (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (139 citations), Electrical and Electronic Engineering (191 citations), Materials Chemistry (71 citations), Atomic and Molecular Physics, and Optics (39 citations) and Mechanics of Materials (29 citations). Moritz Andreas Meyer has collaborated with scholars based in Germany, United States and Singapore. Frequent co-authors include Ehrenfried Zschech, A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy, K. N. Tu, Andriy Gusak, Brian D. Gerardot, Johannes Knörzer, Andreas V. Stier and Mauro Brotons‐Gisbert. Their work appears in journals such as International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde), npj 2D Materials and Applications, Applied Physics Letters, IEEE Transactions on Device and Materials Reliability and AIP conference proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.