C. Y. Liu

474 total citations
10 papers, 398 citations indexed

About

C. Y. Liu is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Computational Mechanics. According to data from OpenAlex, C. Y. Liu has authored 10 papers receiving a total of 398 indexed citations (citations by other indexed papers that have themselves been cited), including 7 papers in Electrical and Electronic Engineering, 3 papers in Mechanics of Materials and 3 papers in Computational Mechanics. Recurrent topics in C. Y. Liu's work include Electronic Packaging and Soldering Technologies (7 papers), Fluid Dynamics and Thin Films (3 papers) and Copper Interconnects and Reliability (2 papers). C. Y. Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Fluid Dynamics and Thin Films (3 papers) and Copper Interconnects and Reliability (2 papers). C. Y. Liu collaborates with scholars based in United States, Italy and Czechia. C. Y. Liu's co-authors include K. N. Tu, Chih Chen, K. N. Tu, H. K. Kim, P. A. Totta, P. G. Kim, D. R. Frear, Jihun Jang, Ajit Mal and K. N. Tu and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and The Journal of the Acoustical Society of America.

In The Last Decade

C. Y. Liu

9 papers receiving 376 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
C. Y. Liu United States	7	355	178	151	35	30	10	398
H. Balkan United States	9	526 1.5×	205 1.2×	229 1.5×	35 1.0×	33 1.1×	15	545
M. C. Shine United States	8	239 0.7×	94 0.5×	137 0.9×	49 1.4×	39 1.3×	9	274
C.-Y. Li United States	14	401 1.1×	198 1.1×	187 1.2×	20 0.6×	46 1.5×	44	487
King-Ning Tu United States	4	307 0.9×	107 0.6×	136 0.9×	32 0.9×	26 0.9×	6	338
Brook Chao United States	7	431 1.2×	171 1.0×	203 1.3×	48 1.4×	28 0.9×	12	453
T. L. Shao Taiwan	11	395 1.1×	237 1.3×	99 0.7×	16 0.5×	25 0.8×	18	405
K. Vieregge Germany	11	117 0.3×	62 0.3×	242 1.6×	72 2.1×	41 1.4×	21	406
H. K. Kim United States	7	502 1.4×	38 0.2×	364 2.4×	67 1.9×	17 0.6×	9	526
M. Li Singapore	9	535 1.5×	61 0.3×	404 2.7×	57 1.6×	30 1.0×	10	557
P. G. Kim United States	6	454 1.3×	31 0.2×	330 2.2×	24 0.7×	49 1.6×	7	465

Countries citing papers authored by C. Y. Liu

Since Specialization

Citations

This map shows the geographic impact of C. Y. Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Y. Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Y. Liu more than expected).

Fields of papers citing papers by C. Y. Liu

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. Y. Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Y. Liu. The network helps show where C. Y. Liu may publish in the future.

Co-authorship network of co-authors of C. Y. Liu

This figure shows the co-authorship network connecting the top 25 collaborators of C. Y. Liu. A scholar is included among the top collaborators of C. Y. Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. Y. Liu. C. Y. Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

10 of 10 papers shown

1.

Jang, Jihun, C. Y. Liu, P. G. Kim, et al.. (2000). Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints. Journal of materials research/Pratt's guide to venture capital sources. 15(8). 1679–1687. 29 indexed citations

2.

Tu, K. N., et al.. (2000). Effect of current crowding on vacancy diffusion and void formation in electromigration. Applied Physics Letters. 76(8). 988–990. 125 indexed citations

3.

Liu, C. Y., Chih Chen, & K. N. Tu. (2000). Electromigration in Sn–Pb solder strips as a function of alloy composition. Journal of Applied Physics. 88(10). 5703–5709. 133 indexed citations

4.

Liu, C. Y. & K. N. Tu. (1998). Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition. Journal of materials research/Pratt's guide to venture capital sources. 13(1). 37–44. 46 indexed citations

5.

Zheng, Dawei, et al.. (1998). Size dependent dewetting and sideband reaction of eutectic SnPb on Au/Cu/Cr multilayered thin film. Journal of materials research/Pratt's guide to venture capital sources. 13(5). 1103–1106. 6 indexed citations

6.

Liu, C. Y. & K. N. Tu. (1998). Reactive flow of molten Pb(Sn) alloys in Si grooves coated with Cu film. Physical review. E, Statistical physics, plasmas, fluids, and related interdisciplinary topics. 58(5). 6308–6311. 12 indexed citations

7.

Liu, C. Y., H. K. Kim, K. N. Tu, & P. A. Totta. (1996). Dewetting of molten Sn on Au/Cu/Cr thin-film metallization. Applied Physics Letters. 69(26). 4014–4016. 44 indexed citations

8.

Dong, S.B. & C. Y. Liu. (1979). A finite-element analysis of sound propagation in a nonuniform moving medium. The Journal of the Acoustical Society of America. 66(2). 548–555. 1 indexed citations

9.

Liu, C. Y. & William R. Goodin. (1976). A two-dimensional model for the transport of pollutants in an urban basin. Atmospheric Environment (1967). 10(7). 513–526. 2 indexed citations

10.

Bjork, R. L. & C. Y. Liu. (1965). Wave Propagation in Elastic-Plastic Solids. Journal of the Engineering Mechanics Division. 91(5). 77–95.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact