Chia-Ling Lu

706 total citations
8 papers, 587 citations indexed

About

Chia-Ling Lu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, Chia-Ling Lu has authored 8 papers receiving a total of 587 indexed citations (citations by other indexed papers that have themselves been cited), including 6 papers in Electrical and Electronic Engineering, 4 papers in Electronic, Optical and Magnetic Materials and 3 papers in Mechanical Engineering. Recurrent topics in Chia-Ling Lu's work include Electronic Packaging and Soldering Technologies (6 papers), Copper Interconnects and Reliability (4 papers) and 3D IC and TSV technologies (4 papers). Chia-Ling Lu is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), Copper Interconnects and Reliability (4 papers) and 3D IC and TSV technologies (4 papers). Chia-Ling Lu collaborates with scholars based in Taiwan and United States. Chia-Ling Lu's co-authors include Chih Chen, Chien-Min Liu, Han-wen Lin, Hsiang‐Yao Hsiao, Yi-Sa Huang, K. N. Tu, K. N. Tu, Kuan‐Ju Chen, Jui‐Chao Kuo and K. N. Tu and has published in prestigious journals such as Science, Journal of The Electrochemical Society and Acta Materialia.

In The Last Decade

Chia-Ling Lu

8 papers receiving 578 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chia-Ling Lu Taiwan 7 482 232 228 188 90 8 587
Han-wen Lin Taiwan 6 533 1.1× 240 1.0× 260 1.1× 190 1.0× 102 1.1× 9 652
Hsiang‐Yao Hsiao Taiwan 9 736 1.5× 379 1.6× 298 1.3× 234 1.2× 123 1.4× 10 888
Chien-Lung Liang Taiwan 15 478 1.0× 193 0.8× 196 0.9× 155 0.8× 34 0.4× 37 533
Kong Boon Yeap United States 13 241 0.5× 103 0.4× 113 0.5× 79 0.4× 120 1.3× 38 394
Barbara Horváth Hungary 14 355 0.7× 191 0.8× 57 0.3× 82 0.4× 38 0.4× 31 445
G.T. Galyon United States 9 424 0.9× 243 1.0× 101 0.4× 77 0.4× 54 0.6× 15 488
Vemal Raja Manikam Malaysia 7 433 0.9× 225 1.0× 54 0.2× 82 0.4× 26 0.3× 12 508
Guangyin Lei China 8 422 0.9× 192 0.8× 117 0.5× 156 0.8× 38 0.4× 24 562
Kazuhiko Sugiura Japan 11 454 0.9× 319 1.4× 69 0.3× 60 0.3× 47 0.5× 32 550
Masayuki Wakita Japan 10 150 0.3× 250 1.1× 95 0.4× 252 1.3× 127 1.4× 18 415

Countries citing papers authored by Chia-Ling Lu

Since Specialization
Citations

This map shows the geographic impact of Chia-Ling Lu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chia-Ling Lu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chia-Ling Lu more than expected).

Fields of papers citing papers by Chia-Ling Lu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chia-Ling Lu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chia-Ling Lu. The network helps show where Chia-Ling Lu may publish in the future.

Co-authorship network of co-authors of Chia-Ling Lu

This figure shows the co-authorship network connecting the top 25 collaborators of Chia-Ling Lu. A scholar is included among the top collaborators of Chia-Ling Lu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chia-Ling Lu. Chia-Ling Lu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

8 of 8 papers shown
1.
Lu, Chia-Ling, et al.. (2021). A solid state process to obtain high mechanical strength in Cu-to-Cu joints by surface creep on (111)-oriented nanotwins Cu. Journal of Materials Research and Technology. 14. 719–730. 23 indexed citations
2.
Lu, Chia-Ling, et al.. (2018). Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient. Scientific Reports. 8(1). 13910–13910. 86 indexed citations
3.
4.
Chang, Yung‐Huang, et al.. (2018). Growth Mechanism of Self-Assembled TixWyO Nanotubes Fabricated by TiW Alloy Anodization. Journal of The Electrochemical Society. 165(10). D477–D481. 2 indexed citations
5.
Liu, Chien-Min, Han-wen Lin, Chia-Ling Lu, & Chih Chen. (2014). Effect of grain orientations of Cu seed layers on the growth of <111>-oriented nanotwinned Cu. Scientific Reports. 4(1). 6123–6123. 29 indexed citations
6.
Lu, Chia-Ling, Han-wen Lin, Chien-Min Liu, et al.. (2014). Extremely anisotropic single-crystal growth in nanotwinned copper. NPG Asia Materials. 6(10). e135–e135. 44 indexed citations
7.
Lin, Han-wen, Chia-Ling Lu, Chien-Min Liu, et al.. (2013). Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈1 1 1〉 oriented and nanotwinned Cu. Acta Materialia. 61(13). 4910–4919. 46 indexed citations
8.
Hsiao, Hsiang‐Yao, Chien-Min Liu, Han-wen Lin, et al.. (2012). Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper. Science. 336(6084). 1007–1010. 323 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026