C. Liu

569 total citations
20 papers, 478 citations indexed

About

C. Liu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, C. Liu has authored 20 papers receiving a total of 478 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in C. Liu's work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (11 papers) and Advanced Welding Techniques Analysis (7 papers). C. Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (11 papers) and Advanced Welding Techniques Analysis (7 papers). C. Liu collaborates with scholars based in United Kingdom, Singapore and United States. C. Liu's co-authors include Vadim V. Silberschmidt, Huining Xu, Zhong Chen, Viola L. Acoff, Timothy J. White, Stevin S. Pramana, M. Sivakumar, David A. Hutt, K. Tobita and N. Asakura and has published in prestigious journals such as Journal of Applied Physics, Acta Materialia and Scripta Materialia.

In The Last Decade

C. Liu

20 papers receiving 468 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
C. Liu United Kingdom 8 285 282 118 94 66 20 478
G. Humpston United Kingdom 12 287 1.0× 303 1.1× 65 0.6× 59 0.6× 34 0.5× 29 458
Yulong Li China 12 315 1.1× 218 0.8× 78 0.7× 80 0.9× 29 0.4× 29 462
G.T. Galyon United States 9 243 0.9× 424 1.5× 77 0.7× 72 0.8× 101 1.5× 15 488
Masanori Kajihara Japan 13 533 1.9× 217 0.8× 166 1.4× 172 1.8× 21 0.3× 43 597
K. Sakamoto Japan 10 475 1.7× 428 1.5× 68 0.6× 150 1.6× 31 0.5× 12 606
Jia-Hong Ke United States 14 315 1.1× 295 1.0× 292 2.5× 111 1.2× 94 1.4× 34 603
Jerome A. Rejent United States 15 593 2.1× 783 2.8× 88 0.7× 193 2.1× 55 0.8× 41 839
Cédric Garion Switzerland 9 168 0.6× 79 0.3× 230 1.9× 48 0.5× 21 0.3× 52 398
Richard C. Blish United States 14 120 0.4× 335 1.2× 95 0.8× 30 0.3× 64 1.0× 33 441

Countries citing papers authored by C. Liu

Since Specialization
Citations

This map shows the geographic impact of C. Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Liu more than expected).

Fields of papers citing papers by C. Liu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Liu. The network helps show where C. Liu may publish in the future.

Co-authorship network of co-authors of C. Liu

This figure shows the co-authorship network connecting the top 25 collaborators of C. Liu. A scholar is included among the top collaborators of C. Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. Liu. C. Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Liu, C., et al.. (2013). Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics. Journal of Microelectronics and Electronic Packaging. 10(2). 80–88. 7 indexed citations
3.
Liu, C., et al.. (2013). Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2013(HITEN). 220–228. 3 indexed citations
4.
Lim, Ying Ying, Yee Mey Goh, & C. Liu. (2012). RF performance of inkjet and stencil printed traces for flexible electronics applications. 98. 556–562. 2 indexed citations
5.
Liu, C., et al.. (2012). Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2012(HITEC). 335–344. 6 indexed citations
6.
Xu, Huining, Viola L. Acoff, C. Liu, Vadim V. Silberschmidt, & Zhong Chen. (2011). Facilitating intermetallic formation in wire bonding by applying a pre-ultrasonic energy. Microelectronic Engineering. 88(10). 3155–3157. 9 indexed citations
7.
Xu, Huining, Viola L. Acoff, C. Liu, Vadim V. Silberschmidt, & Zhong Chen. (2011). Void growth in thermosonic copper/gold wire bonding on aluminum pads. 539. 1729–1735. 4 indexed citations
8.
Liu, C., et al.. (2011). Effects of combined thermal and vibration loadings on the wire bond integrity. 1–4. 2 indexed citations
9.
Xu, Huining, C. Liu, Vadim V. Silberschmidt, et al.. (2011). New mechanisms of void growth in Au–Al wire bonds: Volumetric shrinkage and intermetallic oxidation. Scripta Materialia. 65(7). 642–645. 32 indexed citations
10.
Xu, Huining, C. Liu, Vadim V. Silberschmidt, et al.. (2011). Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds. Acta Materialia. 59(14). 5661–5673. 207 indexed citations
11.
Xu, Huining, C. Liu, Vadim V. Silberschmidt, et al.. (2011). Intermetallic phase transformations in Au–Al wire bonds. Intermetallics. 19(12). 1808–1816. 42 indexed citations
12.
Xu, Huining, C. Liu, Vadim V. Silberschmidt, et al.. (2010). Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution. Microelectronics Reliability. 51(1). 113–118. 28 indexed citations
13.
Xu, Huining, C. Liu, Vadim V. Silberschmidt, et al.. (2010). A micromechanism study of thermosonic gold wire bonding on aluminum pad. Journal of Applied Physics. 108(11). 57 indexed citations
14.
Tobita, K., Hiroyasu Utoh, C. Liu, et al.. (2010). Search for reality of solid breeder blanket for DEMO. Fusion Engineering and Design. 85(7-9). 1342–1347. 37 indexed citations
15.
Xu, Huining, C. Liu, Vadim V. Silberschmidt, M. Sivakumar, & Zhong Chen. (2010). Effect of ultrasonic energy on interfacial structure and bond strength in copper wire bonding. 36. 336–341. 2 indexed citations
16.
Xu, Huining, C. Liu, Vadim V. Silberschmidt, Zhong Chen, & M. Sivakumar. (2009). TEM interfacial characteristics of thermosonic gold wire bonding on aluminium metallization. 18. 512–517. 1 indexed citations
17.
Yan, Hua, Yee Yan Tay, Meng Liang, et al.. (2009). Amorphous metallic thin films as copper diffusion barrier for advanced interconnect applications. 567–572. 5 indexed citations
18.
Xu, Hui, C. Liu, & Vadim V. Silberschmidt. (2008). Effect of thermal aging on interfacial behaviour of copper ball bonds. Loughborough University Institutional Repository (Loughborough University). b64. 891–896. 4 indexed citations
19.
Liu, C. & David A. Hutt. (2006). Fluxless Soldering of Copper Substrates Using Self-Assembled Monolayers for Preservation. IEEE Transactions on Components and Packaging Technologies. 29(3). 512–521. 22 indexed citations
20.
Huang, Zhiheng, Paul Conway, C. Liu, & R.C. Thomson. (2004). Inter-dependence of processing and alloy composition on the reliability of Sn-based lead free solders in fine pitch FCOB interconnection. 26. 99–105. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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