Jin Onuki

956 total citations
119 papers, 789 citations indexed

About

Jin Onuki is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, Jin Onuki has authored 119 papers receiving a total of 789 indexed citations (citations by other indexed papers that have themselves been cited), including 94 papers in Electrical and Electronic Engineering, 58 papers in Electronic, Optical and Magnetic Materials and 31 papers in Mechanical Engineering. Recurrent topics in Jin Onuki's work include Electronic Packaging and Soldering Technologies (67 papers), Copper Interconnects and Reliability (58 papers) and 3D IC and TSV technologies (27 papers). Jin Onuki is often cited by papers focused on Electronic Packaging and Soldering Technologies (67 papers), Copper Interconnects and Reliability (58 papers) and 3D IC and TSV technologies (27 papers). Jin Onuki collaborates with scholars based in Japan, Australia and United States. Jin Onuki's co-authors include Masahiro Koizumi, Masaki Suwa, Yasunori Chonan, Yasushi Sasajima, Takao Komiyama, Takashi Kimura, Masahiko Ito, Haruo Akahoshi, Nobuhiro Ishikawa and Hitoshi Suzuki and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

Jin Onuki

112 papers receiving 719 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Jin Onuki Japan	14	647	284	240	109	104	119	789
Hsiang‐Yao Hsiao Taiwan	9	736 1.1×	298 1.0×	379 1.6×	123 1.1×	234 2.3×	10	888
Yi-Shao Lai Taiwan	18	555 0.9×	211 0.7×	248 1.0×	224 2.1×	162 1.6×	41	787
K. N. Tu United States	9	813 1.3×	301 1.1×	398 1.7×	47 0.4×	67 0.6×	12	848
P. A. Totta United States	11	660 1.0×	164 0.6×	319 1.3×	78 0.7×	74 0.7×	22	761
F. Wulff Singapore	14	410 0.6×	71 0.3×	312 1.3×	133 1.2×	98 0.9×	29	566
C. C. Goldsmith United States	15	944 1.5×	225 0.8×	524 2.2×	174 1.6×	99 1.0×	36	1.0k
H.-U. Schreiber Germany	15	500 0.8×	288 1.0×	180 0.8×	67 0.6×	60 0.6×	48	718
C.-Y. Li United States	14	401 0.6×	198 0.7×	187 0.8×	98 0.9×	64 0.6×	44	487
S.-M. Kuo United States	12	459 0.7×	135 0.5×	360 1.5×	103 0.9×	209 2.0×	16	756
Chuan-Lu Li China	9	207 0.3×	181 0.6×	131 0.5×	36 0.3×	130 1.3×	15	429

Countries citing papers authored by Jin Onuki

Since Specialization

Citations

This map shows the geographic impact of Jin Onuki's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jin Onuki with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jin Onuki more than expected).

Fields of papers citing papers by Jin Onuki

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jin Onuki. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jin Onuki. The network helps show where Jin Onuki may publish in the future.

Co-authorship network of co-authors of Jin Onuki

This figure shows the co-authorship network connecting the top 25 collaborators of Jin Onuki. A scholar is included among the top collaborators of Jin Onuki based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jin Onuki. Jin Onuki is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Sasajima, Yasushi, et al.. (2021). Optimization of the Surface Structure of the Si Substrate for Si-Al Bonding Using Simulation by the Phase Field Method. Journal of Electronic Materials. 50(8). 4770–4780. 1 indexed citations

Miyamoto, Ryo, et al.. (2019). Effects of Electroplating at Lower Leveler and Suppressor Contents on the Formation of Very Low Resistivity Narrow Cu Interconnects. Journal of The Electrochemical Society. 166(4). D137–D143. 5 indexed citations

Saito, Katsuaki, et al.. (2018). High-Temperature Cycle Durability of Superplastic Al–Zn Eutectoid Solder Joints With Stress Relaxation Characteristics for SiC Power Semiconductor Devices. IEEE Electron Device Letters. 40(2). 303–306. 3 indexed citations

Onuki, Jin, et al.. (2011). Current Status and Future Prospect of Cu Interconnects for Very High Speed LSIs. Materia Japan. 50(11). 480–487. 2 indexed citations

Sasajima, Yasushi, et al.. (2010). Molecular Dynamics Simulation of Grain Growth of Cu Film —Effects of Adhesion Strength between Substrate and Cu Atoms—. MATERIALS TRANSACTIONS. 51(4). 664–669. 8 indexed citations

Onuki, Jin, et al.. (2010). Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire. MATERIALS TRANSACTIONS. 51(9). 1715–1717. 6 indexed citations

Onuki, Jin, et al.. (2010). Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires. MATERIALS TRANSACTIONS. 51(7). 1183–1187. 12 indexed citations

Tomota, Yo, et al.. (2010). Effect of Texture and Grain Size on the Deformation Behavior of Sputtered Thick Al-Si Films during Cyclic Heating and Cooling. MATERIALS TRANSACTIONS. 52(1). 102–107. 3 indexed citations

Sasajima, Yasushi, et al.. (2009). Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring. MATERIALS TRANSACTIONS. 50(10). 2373–2377. 1 indexed citations

10.

Chonan, Yasunori, et al.. (2006). Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating. MATERIALS TRANSACTIONS. 47(5). 1417–1419. 6 indexed citations

11.

Onuki, Jin, et al.. (2004). . Materia Japan. 43(1). 3–6. 1 indexed citations

12.

Takeuchi, Manabu, et al.. (2004). Microwave Plasma Nitriding of Hollow Tube Inner Wall. MATERIALS TRANSACTIONS. 45(2). 599–601. 2 indexed citations

13.

Chonan, Yasunori, et al.. (2002). Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film. MATERIALS TRANSACTIONS. 43(8). 1840–1846. 24 indexed citations

14.

Chonan, Yasunori, et al.. (2002). Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film. MATERIALS TRANSACTIONS. 43(8). 1887–1890. 36 indexed citations

15.

Komiyama, Takao, Yasunori Chonan, Jin Onuki, & Toshihiko Ohta. (2002). The Influence of Phosphorus Concentration of Electroless Plated Ni-P Film on Interfacial Structures in the Joints between Sn-Ag Solder and Ni-P Alloy Film. MATERIALS TRANSACTIONS. 43(2). 227–231. 11 indexed citations

16.

Onuki, Jin, et al.. (2002). Influence of Soldering Conditions on Void Formation in Large-area Solder Joints. MATERIALS TRANSACTIONS. 43(7). 1774–1777. 5 indexed citations

17.

Onuki, Jin, Takao Komiyama, Yasunori Chonan, & Masahiro Koizumi. (2002). High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire. MATERIALS TRANSACTIONS. 43(8). 2157–2160. 1 indexed citations

18.

Onuki, Jin, et al.. (2002). Friction and Elongation of Al Electrodes due to Micro-Sliding between the Inner Mo Electrode and the Al Electrodes in High-Power Devices. MATERIALS TRANSACTIONS. 43(9). 2326–2330. 2 indexed citations

19.

Chonan, Yasunori, Takao Komiyama, & Jin Onuki. (2001). Interface Reaction between Solder and Plated Nickel Film. MATERIALS TRANSACTIONS. 42(4). 697–701. 2 indexed citations

20.

Onuki, Jin, et al.. (2001). Joining of Oxide Dispersion Strengthened Ni Based Super Alloys. MATERIALS TRANSACTIONS. 42(2). 365–371. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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