A. V. Vairagar

558 total citations
23 papers, 418 citations indexed

About

A. V. Vairagar is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, A. V. Vairagar has authored 23 papers receiving a total of 418 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Electrical and Electronic Engineering, 22 papers in Electronic, Optical and Magnetic Materials and 2 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in A. V. Vairagar's work include Copper Interconnects and Reliability (22 papers), Electronic Packaging and Soldering Technologies (20 papers) and Semiconductor materials and devices (17 papers). A. V. Vairagar is often cited by papers focused on Copper Interconnects and Reliability (22 papers), Electronic Packaging and Soldering Technologies (20 papers) and Semiconductor materials and devices (17 papers). A. V. Vairagar collaborates with scholars based in Singapore, United States and Italy. A. V. Vairagar's co-authors include Subodh G. Mhaisalkar, Ahila Krishnamoorthy, Ehrenfried Zschech, Andriy Gusak, Moritz Andreas Meyer, K. N. Tu, K. N. Tu, Arijit Roy, Cher Ming Tan and H. Engelmann and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Thin Solid Films.

In The Last Decade

A. V. Vairagar

22 papers receiving 394 citations

Peers

Countries citing papers authored by A. V. Vairagar

Since Specialization

Citations

This map shows the geographic impact of A. V. Vairagar's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. V. Vairagar with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. V. Vairagar more than expected).

Fields of papers citing papers by A. V. Vairagar

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by A. V. Vairagar. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. V. Vairagar. The network helps show where A. V. Vairagar may publish in the future.

Co-authorship network of co-authors of A. V. Vairagar

This figure shows the co-authorship network connecting the top 25 collaborators of A. V. Vairagar. A scholar is included among the top collaborators of A. V. Vairagar based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with A. V. Vairagar. A. V. Vairagar is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation 2009 ·IEEE Transactions on Device and Materials Reliability ·Ehrenfried Zschech, Paul S. Ho, Dieter Schmeißer, Moritz Andreas Meyer, A. V. Vairagar, Gerd Schneider, Meike Hauschildt, (unknown), Valeriy Sukharev	14
2	Assessing the Effect of Die Sealing in Cu/Low-k Structures 2007 ·Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·(unknown), A. V. Vairagar, H. Geisler, Ehrenfried Zschech, (unknown)	7
3	Microstructural Evolution of Annealed Ruthenium–Nitrogen Films 2007 ·Electrochemical and Solid-State Letters ·(unknown), Thirumany Sritharan, Subodh G. Mhaisalkar, (unknown), Ehrenfried Zschech, A. V. Vairagar, (unknown)	17
4	Improvement of Electromigration Lifetime of Submicrometer Dual-Damascene Cu Interconnects Through Surface Engineering 2006 ·Journal of The Electrochemical Society ·A. V. Vairagar, Zhenghao Gan, Wei Shao, Subodh G. Mhaisalkar, (unknown), K. N. Tu, Zhong Chen, Ehrenfried Zschech, H. Engelmann, Sam Zhang	23
5	A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects 2006 ·Microelectronics Reliability ·Minyu Yan, K. N. Tu, A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy	4
6	Effect of interface modification on EM-induced degradation mechanisms in copper interconnects 2005 ·Thin Solid Films ·Ehrenfried Zschech, Michael Meyer, Subodh G. Mhaisalkar, A. V. Vairagar, Ahila Krishnamoorthy, H. Engelmann, Valeriy Sukharev	20
7	Confinement of electromigration induced void propagation in Cu interconnect by a buried Ta diffusion barrier layer 2005 ·Applied Physics Letters ·Minyu Yan, K. N. Tu, A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy	9
8	The effect of intermetallic bonding on blocking electromigration induced interfacial diffusion in cu dual damascene interconnects 2005 ·Minyu Yan, Jong-ook Suh, (unknown), A. V. Vairagar, Subodh G. Mhaisalkar	1
9	Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures 2005 ·Applied Physics Letters ·A. V. Vairagar, Subodh G. Mhaisalkar, Michael Meyer, Ehrenfried Zschech, Ahila Krishnamoorthy, K. N. Tu, Andriy Gusak	24
10	Effect of interface strength on electromigration-induced inlaid copper interconnect degradation: Experiment and simulation 2005 ·Zeitschrift für Metallkunde ·Ehrenfried Zschech, H. Engelmann, Moritz Andreas Meyer, (unknown), A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy, Minyu Yan, K. N. Tu, Valeriy Sukharev	16
11	Reservoir effect on electromigration mechanisms in dual-damascene Cu interconnect structures 2005 ·Microelectronic Engineering ·A. V. Vairagar, Subodh G. Mhaisalkar, Michael Meyer, Ehrenfried Zschech, Ahila Krishnamoorthy	2
12	Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects 2005 ·Applied Physics Letters ·Minyu Yan, Jong-ook Suh, Fei Ren, K. N. Tu, A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy	22
13	Current crowding effect on copper dual damascene via bottom failure for ULSI applications 2005 ·IEEE Transactions on Device and Materials Reliability ·Cher Ming Tan, Arijit Roy, A. V. Vairagar, Ahila Krishnamoorthy, Subodh G. Mhaisalkar	40
14	Study of Electromigration Induced Void Nucleation, Growth, and Movement in Cu Interconnects 2004 ·AIP conference proceedings ·A. V. Vairagar	1
15	Electromigration behavior of dual-damascene Cu interconnects––Structure, width, and length dependences 2004 ·Microelectronics Reliability ·A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy	61
16	Electromigration in copper damascene interconnects: reservoir effects and failure analysis 2004 ·Surface and Coatings Technology ·Wei Shao, A. V. Vairagar, Chih-Hang Tung, Zeliang Xie, Ahila Krishnamoorthy, Subodh G. Mhaisalkar	21
17	In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures 2004 ·Applied Physics Letters ·A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy, K. N. Tu, Andriy Gusak, Moritz Andreas Meyer, Ehrenfried Zschech	82
18	Effect of surface treatment on electromigration in sub-micron Cu damascene interconnects 2004 ·Thin Solid Films ·A. V. Vairagar, Subodh G. Mhaisalkar, Ahila Krishnamoorthy	23
19	Highly conducting doped poly-Si deposited by hot wire CVD and its applicability as gate material for CMOS devices 2003 ·Thin Solid Films ·Samadhan B. Patil, A. V. Vairagar, (unknown), (unknown), V. Ramgopal Rao, N. Venkatramani, Rajiv O. Dusane, B. Schröeder	9
20	Electromigration of lower and upper Cu lines in dual-damascene Cu interconnects 2003 ·MRS Proceedings ·Ahila Krishnamoorthy, Qiang Guo, A. V. Vairagar, Subodh G. Mhaisalkar	1

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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