C.P. Wong
Impact in
- Polymers and Plastics top 0.1%
- Conducting polymers and applications
-
- Supercapacitor Materials and Fabrication
Papers in
-
- Synthesis and properties of polymers 76
- Conducting polymers and applications 41
-
- Electronic Packaging and Soldering Technologies 272
- 3D IC and TSV technologies 172
- Nanomaterials and Printing Technologies 45
- Journals
- IEEE Transactions on Components and Packaging Technologies (30 papers)IEEE Transactions on Electronics Packaging Manufacturing (21 papers)Journal of Electronic Materials (20 papers)Journal of Applied Polymer Science (18 papers)IEEE Transactions on Advanced Packaging (15 papers)
- Partner nations
- United StatesChinaHong Kong
In The Last Decade
C.P. Wong
642 papers receiving 21.5k citations
Hit Papers
Peers
Comparison fields: 5 of 153
- Polymers and Plastics 5.2k
- Electronic, Optical and Magnetic Materials 5.2k
- Surfaces, Coatings and Films 1.4k
- Electrical and Electronic Engineering 11.1k
- Biomedical Engineering 8.3k
Countries citing papers authored by C.P. Wong
This map shows the geographic impact of C.P. Wong's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.P. Wong with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.P. Wong more than expected).
Fields of papers citing papers by C.P. Wong
This network shows the impact of papers produced by C.P. Wong. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.P. Wong. The network helps show where C.P. Wong may publish in the future.
Co-authorship network
The 25 scholars most cited alongside C.P. Wong, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 15 | |
| 2 | 2025 | 6 | |
| 3 | 2025 | 0 | |
| 4 | 2023 | 2 | |
| 5 | 2021 | 12 | |
| 6 | 2020 | 28 | |
| 7 | 2014 | 45 | |
| 8 | 2012 | 8 | |
| 9 | 2012 | 5 | |
| 10 | 2012 | 32 | |
| 11 | 2011 | 304 | |
| 12 | 2010 | 223 | |
| 13 | NANO materials and composites for electronic and photo packaging | 2009 | 2 |
| 14 | 2009 | 95 | |
| 15 | 2008 | 5 | |
| 16 | 2007 | 6 | |
| 17 | 2006 | 22 | |
| 18 | 2005 | 207 | |
| 19 | 2004 | 33 | |
| 20 | 2003 | 3 |
About C.P. Wong
C.P. Wong is a scholar working on Polymers and Plastics, Electrical and Electronic Engineering, Surfaces, Coatings and Films, Biomedical Engineering and Mechanics of Materials, having authored 661 papers that have together received 22.2k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (272 papers), 3D IC and TSV technologies (172 papers), Advanced Sensor and Energy Harvesting Materials (137 papers), Synthesis and properties of polymers (76 papers), Epoxy Resin Curing Processes (70 papers), Adhesion, Friction, and Surface Interactions (47 papers), Nanomaterials and Printing Technologies (45 papers) and Conducting polymers and applications (41 papers). The work is most often cited by research in Polymers and Plastics (5.2k citations), Electronic, Optical and Magnetic Materials (5.2k citations), Surfaces, Coatings and Films (1.4k citations), Electrical and Electronic Engineering (11.1k citations) and Biomedical Engineering (8.3k citations). C.P. Wong has collaborated with scholars based in United States, China and Hong Kong. Frequent co-authors include Kyoung‐sik Moon, Yi Li, Wei Lin, Yonghao Xiu, Ziyin Lin, Dennis W. Hess, Jianwen Xu, Zhong Lin Wang, Daoqiang Lu and Yang Rao. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing, Journal of Electronic Materials, Journal of Applied Polymer Science and IEEE Transactions on Advanced Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.